HK1071804A1 - Electronic component and method for forming external electrodes thereof - Google Patents

Electronic component and method for forming external electrodes thereof

Info

Publication number
HK1071804A1
HK1071804A1 HK05104408.3A HK05104408A HK1071804A1 HK 1071804 A1 HK1071804 A1 HK 1071804A1 HK 05104408 A HK05104408 A HK 05104408A HK 1071804 A1 HK1071804 A1 HK 1071804A1
Authority
HK
Hong Kong
Prior art keywords
electronic component
external electrodes
forming external
forming
electrodes
Prior art date
Application number
HK05104408.3A
Other languages
English (en)
Inventor
Shoji Ishihara
Kiyoshi Tsuzuki
Yasuyuki Ishii
Original Assignee
Taiyo Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Chemical Industry Co Ltd filed Critical Taiyo Chemical Industry Co Ltd
Publication of HK1071804A1 publication Critical patent/HK1071804A1/xx

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02B—HYDRAULIC ENGINEERING
    • E02B15/00—Cleaning or keeping clear the surface of open water; Apparatus therefor
    • E02B15/04—Devices for cleaning or keeping clear the surface of open water from oil or like floating materials by separating or removing these materials
    • E02B15/08—Devices for reducing the polluted area with or without additional devices for removing the material
    • E02B15/0814—Devices for reducing the polluted area with or without additional devices for removing the material with underwater curtains
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02B—HYDRAULIC ENGINEERING
    • E02B15/00—Cleaning or keeping clear the surface of open water; Apparatus therefor
    • E02B15/04—Devices for cleaning or keeping clear the surface of open water from oil or like floating materials by separating or removing these materials
    • E02B15/06—Barriers therefor construed for applying processing agents or for collecting pollutants, e.g. absorbent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
    • B63B—SHIPS OR OTHER WATERBORNE VESSELS; EQUIPMENT FOR SHIPPING 
    • B63B22/00—Buoys
    • B63B22/18—Buoys having means to control attitude or position, e.g. reaction surfaces or tether
    • B63B22/20—Ballast means
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02B—HYDRAULIC ENGINEERING
    • E02B15/00—Cleaning or keeping clear the surface of open water; Apparatus therefor
    • E02B15/04—Devices for cleaning or keeping clear the surface of open water from oil or like floating materials by separating or removing these materials
    • E02B15/08—Devices for reducing the polluted area with or without additional devices for removing the material
    • E02B15/085—Details of connectors
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D2600/00—Miscellaneous
    • E02D2600/20—Miscellaneous comprising details of connection between elements
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D2600/00—Miscellaneous
    • E02D2600/30—Miscellaneous comprising anchoring details
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D5/00—Bulkheads, piles, or other structural elements specially adapted to foundation engineering
    • E02D5/74—Means for anchoring structural elements or bulkheads
    • E02D5/80—Ground anchors

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
HK05104408.3A 2003-03-11 2005-05-26 Electronic component and method for forming external electrodes thereof HK1071804A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003065062A JP4544825B2 (ja) 2003-03-11 2003-03-11 電子部品の外部電極形成方法

Publications (1)

Publication Number Publication Date
HK1071804A1 true HK1071804A1 (en) 2005-07-29

Family

ID=33126184

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05104408.3A HK1071804A1 (en) 2003-03-11 2005-05-26 Electronic component and method for forming external electrodes thereof

Country Status (5)

Country Link
JP (1) JP4544825B2 (xx)
KR (1) KR100937298B1 (xx)
CN (1) CN100477031C (xx)
HK (1) HK1071804A1 (xx)
MY (1) MY139649A (xx)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006269829A (ja) * 2005-03-24 2006-10-05 Kyocera Corp セラミック電子部品
JP5899609B2 (ja) * 2010-08-06 2016-04-06 株式会社村田製作所 積層セラミックコンデンサおよびその製造方法
KR20130037485A (ko) * 2011-10-06 2013-04-16 삼성전기주식회사 적층 세라믹 커패시터 및 이의 제조방법
US10933679B2 (en) * 2017-03-27 2021-03-02 Taiyo Yuden Co., Ltd. Screen printing plate and manufacturing method of electronic component
CN112342584A (zh) * 2020-09-29 2021-02-09 扬州市景杨表面工程有限公司 一种心脏起搏器电容器件无磁化铜锡电镀工艺

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100277382B1 (ko) * 1995-08-18 2001-01-15 사토 히로시 다층전자부품
JP3407839B2 (ja) * 1995-12-27 2003-05-19 富士通株式会社 半導体装置のはんだバンプ形成方法
KR20000003052A (ko) 1998-06-25 2000-01-15 이형도 칩부품의 외부전극 형성방법

Also Published As

Publication number Publication date
CN100477031C (zh) 2009-04-08
KR100937298B1 (ko) 2010-01-18
JP2004273919A (ja) 2004-09-30
JP4544825B2 (ja) 2010-09-15
MY139649A (en) 2009-10-30
KR20040081063A (ko) 2004-09-20
CN1551259A (zh) 2004-12-01

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20130311