HK1071804A1 - Electronic component and method for forming external electrodes thereof - Google Patents
Electronic component and method for forming external electrodes thereofInfo
- Publication number
- HK1071804A1 HK1071804A1 HK05104408.3A HK05104408A HK1071804A1 HK 1071804 A1 HK1071804 A1 HK 1071804A1 HK 05104408 A HK05104408 A HK 05104408A HK 1071804 A1 HK1071804 A1 HK 1071804A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- electronic component
- external electrodes
- forming external
- forming
- electrodes
- Prior art date
Links
Classifications
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02B—HYDRAULIC ENGINEERING
- E02B15/00—Cleaning or keeping clear the surface of open water; Apparatus therefor
- E02B15/04—Devices for cleaning or keeping clear the surface of open water from oil or like floating materials by separating or removing these materials
- E02B15/08—Devices for reducing the polluted area with or without additional devices for removing the material
- E02B15/0814—Devices for reducing the polluted area with or without additional devices for removing the material with underwater curtains
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02B—HYDRAULIC ENGINEERING
- E02B15/00—Cleaning or keeping clear the surface of open water; Apparatus therefor
- E02B15/04—Devices for cleaning or keeping clear the surface of open water from oil or like floating materials by separating or removing these materials
- E02B15/06—Barriers therefor construed for applying processing agents or for collecting pollutants, e.g. absorbent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
- B63B—SHIPS OR OTHER WATERBORNE VESSELS; EQUIPMENT FOR SHIPPING
- B63B22/00—Buoys
- B63B22/18—Buoys having means to control attitude or position, e.g. reaction surfaces or tether
- B63B22/20—Ballast means
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02B—HYDRAULIC ENGINEERING
- E02B15/00—Cleaning or keeping clear the surface of open water; Apparatus therefor
- E02B15/04—Devices for cleaning or keeping clear the surface of open water from oil or like floating materials by separating or removing these materials
- E02B15/08—Devices for reducing the polluted area with or without additional devices for removing the material
- E02B15/085—Details of connectors
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
- E02D2600/00—Miscellaneous
- E02D2600/20—Miscellaneous comprising details of connection between elements
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
- E02D2600/00—Miscellaneous
- E02D2600/30—Miscellaneous comprising anchoring details
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
- E02D5/00—Bulkheads, piles, or other structural elements specially adapted to foundation engineering
- E02D5/74—Means for anchoring structural elements or bulkheads
- E02D5/80—Ground anchors
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Mechanical Engineering (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003065062A JP4544825B2 (en) | 2003-03-11 | 2003-03-11 | Method for forming external electrode of electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1071804A1 true HK1071804A1 (en) | 2005-07-29 |
Family
ID=33126184
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK05104408.3A HK1071804A1 (en) | 2003-03-11 | 2005-05-26 | Electronic component and method for forming external electrodes thereof |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4544825B2 (en) |
KR (1) | KR100937298B1 (en) |
CN (1) | CN100477031C (en) |
HK (1) | HK1071804A1 (en) |
MY (1) | MY139649A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006269829A (en) * | 2005-03-24 | 2006-10-05 | Kyocera Corp | Ceramic electronic component |
JP5899609B2 (en) * | 2010-08-06 | 2016-04-06 | 株式会社村田製作所 | Multilayer ceramic capacitor and manufacturing method thereof |
KR20130037485A (en) * | 2011-10-06 | 2013-04-16 | 삼성전기주식회사 | Multilayered ceramic capacitor, and method for manufacturing the same |
US10933679B2 (en) * | 2017-03-27 | 2021-03-02 | Taiyo Yuden Co., Ltd. | Screen printing plate and manufacturing method of electronic component |
CN112342584A (en) * | 2020-09-29 | 2021-02-09 | 扬州市景杨表面工程有限公司 | Nonmagnetic copper-tin electroplating process for capacitor device of cardiac pacemaker |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5805409A (en) * | 1995-08-18 | 1998-09-08 | Tdk Corporation | Multi-layer electronic part having external electrodes that have a thermosetting resin and metal particles |
JP3407839B2 (en) * | 1995-12-27 | 2003-05-19 | 富士通株式会社 | Method of forming solder bump for semiconductor device |
KR20000003052A (en) | 1998-06-25 | 2000-01-15 | 이형도 | External electrode forming of chip component |
-
2003
- 2003-03-11 JP JP2003065062A patent/JP4544825B2/en not_active Expired - Lifetime
-
2004
- 2004-03-11 CN CNB2004100399272A patent/CN100477031C/en not_active Expired - Lifetime
- 2004-03-12 MY MYPI20040877A patent/MY139649A/en unknown
- 2004-03-12 KR KR1020040016918A patent/KR100937298B1/en active IP Right Grant
-
2005
- 2005-05-26 HK HK05104408.3A patent/HK1071804A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100937298B1 (en) | 2010-01-18 |
JP4544825B2 (en) | 2010-09-15 |
MY139649A (en) | 2009-10-30 |
KR20040081063A (en) | 2004-09-20 |
CN1551259A (en) | 2004-12-01 |
CN100477031C (en) | 2009-04-08 |
JP2004273919A (en) | 2004-09-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20130311 |