KR100926747B1 - 도전 접착제 및 이를 이용한 플립칩 본딩 방법 - Google Patents

도전 접착제 및 이를 이용한 플립칩 본딩 방법 Download PDF

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Publication number
KR100926747B1
KR100926747B1 KR20070114866A KR20070114866A KR100926747B1 KR 100926747 B1 KR100926747 B1 KR 100926747B1 KR 20070114866 A KR20070114866 A KR 20070114866A KR 20070114866 A KR20070114866 A KR 20070114866A KR 100926747 B1 KR100926747 B1 KR 100926747B1
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KR
South Korea
Prior art keywords
temperature
ball
pressure
substrate
melting point
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KR20070114866A
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English (en)
Korean (ko)
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KR20090048813A (ko
Inventor
엄용성
문종태
Original Assignee
한국전자통신연구원
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Application filed by 한국전자통신연구원 filed Critical 한국전자통신연구원
Priority to KR20070114866A priority Critical patent/KR100926747B1/ko
Priority to JP2008091481A priority patent/JP5037406B2/ja
Publication of KR20090048813A publication Critical patent/KR20090048813A/ko
Application granted granted Critical
Publication of KR100926747B1 publication Critical patent/KR100926747B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers

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  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR20070114866A 2007-11-12 2007-11-12 도전 접착제 및 이를 이용한 플립칩 본딩 방법 KR100926747B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR20070114866A KR100926747B1 (ko) 2007-11-12 2007-11-12 도전 접착제 및 이를 이용한 플립칩 본딩 방법
JP2008091481A JP5037406B2 (ja) 2007-11-12 2008-03-31 導電接着剤及びこれを利用したフリップチップボンディング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20070114866A KR100926747B1 (ko) 2007-11-12 2007-11-12 도전 접착제 및 이를 이용한 플립칩 본딩 방법

Publications (2)

Publication Number Publication Date
KR20090048813A KR20090048813A (ko) 2009-05-15
KR100926747B1 true KR100926747B1 (ko) 2009-11-16

Family

ID=40813303

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20070114866A KR100926747B1 (ko) 2007-11-12 2007-11-12 도전 접착제 및 이를 이용한 플립칩 본딩 방법

Country Status (2)

Country Link
JP (1) JP5037406B2 (ja)
KR (1) KR100926747B1 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000323523A (ja) * 1999-05-07 2000-11-24 Sony Corp フリップチップ実装構造
JP2002217239A (ja) * 2001-01-19 2002-08-02 Matsushita Electric Ind Co Ltd 異方性導電膜

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6806309B2 (en) * 2002-02-28 2004-10-19 Henkel Corporation Adhesive compositions containing organic spacers and methods for use thereof
EP1608699A2 (en) * 2003-04-01 2005-12-28 Aguila Technologies, Inc. Thermally conductive adhesive composition and process for device attachment
JP2006199833A (ja) * 2005-01-20 2006-08-03 Sekisui Chem Co Ltd 異方性導電接着剤

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000323523A (ja) * 1999-05-07 2000-11-24 Sony Corp フリップチップ実装構造
JP2002217239A (ja) * 2001-01-19 2002-08-02 Matsushita Electric Ind Co Ltd 異方性導電膜

Also Published As

Publication number Publication date
KR20090048813A (ko) 2009-05-15
JP2009120799A (ja) 2009-06-04
JP5037406B2 (ja) 2012-09-26

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