KR100922145B1 - 전자부품 시험장치 - Google Patents
전자부품 시험장치 Download PDFInfo
- Publication number
- KR100922145B1 KR100922145B1 KR1020077025767A KR20077025767A KR100922145B1 KR 100922145 B1 KR100922145 B1 KR 100922145B1 KR 1020077025767 A KR1020077025767 A KR 1020077025767A KR 20077025767 A KR20077025767 A KR 20077025767A KR 100922145 B1 KR100922145 B1 KR 100922145B1
- Authority
- KR
- South Korea
- Prior art keywords
- test
- under test
- electronic component
- electronic
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2005/012947 WO2007007406A1 (ja) | 2005-07-13 | 2005-07-13 | 電子部品試験装置 |
| WOPCT/JP2005/012947 | 2005-07-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080004579A KR20080004579A (ko) | 2008-01-09 |
| KR100922145B1 true KR100922145B1 (ko) | 2009-10-19 |
Family
ID=37636814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077025767A Expired - Fee Related KR100922145B1 (ko) | 2005-07-13 | 2006-07-13 | 전자부품 시험장치 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7859286B2 (enExample) |
| KR (1) | KR100922145B1 (enExample) |
| CN (1) | CN101176007A (enExample) |
| TW (1) | TW200720675A (enExample) |
| WO (2) | WO2007007406A1 (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101235285B1 (ko) | 2012-11-15 | 2013-02-21 | 유호전기공업주식회사 | 3차원 패턴을 이용한 부분방전 검출장치의 시험 방법 |
| KR20180010480A (ko) | 2016-07-21 | 2018-01-31 | 세메스 주식회사 | 반도체 소자 테스트 방법 |
| KR20180012032A (ko) | 2016-07-26 | 2018-02-05 | 세메스 주식회사 | 반도체 소자 테스트 장치 |
| KR20180012973A (ko) | 2016-07-28 | 2018-02-07 | 세메스 주식회사 | 반도체 소자 테스트 장치 |
| KR20180017594A (ko) | 2016-08-10 | 2018-02-21 | 세메스 주식회사 | 반도체 소자 테스트 장치 |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100800312B1 (ko) * | 2006-01-25 | 2008-02-04 | (주)테크윙 | 테스트핸들러 및 테스트핸들러의 로딩방법 |
| JP2011197203A (ja) * | 2010-03-18 | 2011-10-06 | Renesas Electronics Corp | ドライバ及び表示装置 |
| JP4955792B2 (ja) * | 2010-04-28 | 2012-06-20 | シャープ株式会社 | 電子部品動作機能測定装置および電子部品動作機能測定方法 |
| TWI416652B (zh) * | 2010-08-20 | 2013-11-21 | Chroma Ate Inc | With a single through the shuttle shuttle of the semiconductor components test machine |
| TWI398654B (zh) * | 2011-11-22 | 2013-06-11 | Chroma Ate Inc | Semiconductor automation testing machine with temperature control system |
| JP6094733B2 (ja) * | 2012-11-26 | 2017-03-15 | 澁谷工業株式会社 | 物品分類装置 |
| TWI472778B (zh) * | 2013-08-30 | 2015-02-11 | Chroma Ate Inc | System - level IC test machine automatic retest method and the test machine |
| CN104670892B (zh) * | 2013-11-29 | 2017-02-08 | 鸿富锦精密工业(深圳)有限公司 | 取放料装置 |
| CN104880618B (zh) * | 2014-02-28 | 2019-06-07 | 惠州市德赛西威汽车电子股份有限公司 | 一种复合并行测试系统及方法 |
| JP6245445B2 (ja) * | 2014-07-07 | 2017-12-13 | Smc株式会社 | アクチュエータのタクト計測装置及びセンサ信号検知装置 |
| KR102656451B1 (ko) * | 2016-03-18 | 2024-04-12 | (주)테크윙 | 전자부품 테스트용 핸들러 |
| CN106017727B (zh) * | 2016-05-16 | 2018-11-06 | 合肥市芯海电子科技有限公司 | 一种多芯片温度测试及标定系统及方法 |
| KR102270760B1 (ko) * | 2019-11-29 | 2021-06-30 | 에이엠티 주식회사 | 미세 피치를 갖는 디바이스의 테스트장치 |
| TWI832311B (zh) | 2022-06-30 | 2024-02-11 | 美商金士頓數位股份有限公司 | 用於積體電路裝置的自動化測試系統及自動化測試方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002207062A (ja) | 2001-01-09 | 2002-07-26 | Advantest Corp | 電子部品試験装置におけるソケットの電気特性相関取得方法、ハンドラ、ハンドラの制御方法および電子部品試験装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001033514A (ja) | 1999-07-23 | 2001-02-09 | Advantest Corp | 電子部品試験装置用加熱板 |
| JP2001230481A (ja) * | 2000-02-21 | 2001-08-24 | Sharp Corp | 半導体レーザチップのスクリーニング装置 |
-
2005
- 2005-07-13 WO PCT/JP2005/012947 patent/WO2007007406A1/ja not_active Ceased
-
2006
- 2006-07-12 TW TW095125451A patent/TW200720675A/zh not_active IP Right Cessation
- 2006-07-13 US US11/911,202 patent/US7859286B2/en not_active Expired - Fee Related
- 2006-07-13 KR KR1020077025767A patent/KR100922145B1/ko not_active Expired - Fee Related
- 2006-07-13 WO PCT/JP2006/313962 patent/WO2007007835A1/ja not_active Ceased
- 2006-07-13 CN CNA2006800164255A patent/CN101176007A/zh active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002207062A (ja) | 2001-01-09 | 2002-07-26 | Advantest Corp | 電子部品試験装置におけるソケットの電気特性相関取得方法、ハンドラ、ハンドラの制御方法および電子部品試験装置 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101235285B1 (ko) | 2012-11-15 | 2013-02-21 | 유호전기공업주식회사 | 3차원 패턴을 이용한 부분방전 검출장치의 시험 방법 |
| KR20180010480A (ko) | 2016-07-21 | 2018-01-31 | 세메스 주식회사 | 반도체 소자 테스트 방법 |
| KR20180012032A (ko) | 2016-07-26 | 2018-02-05 | 세메스 주식회사 | 반도체 소자 테스트 장치 |
| KR20180012973A (ko) | 2016-07-28 | 2018-02-07 | 세메스 주식회사 | 반도체 소자 테스트 장치 |
| KR20180017594A (ko) | 2016-08-10 | 2018-02-21 | 세메스 주식회사 | 반도체 소자 테스트 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200720675A (en) | 2007-06-01 |
| TWI303719B (enExample) | 2008-12-01 |
| WO2007007406A1 (ja) | 2007-01-18 |
| US7859286B2 (en) | 2010-12-28 |
| CN101176007A (zh) | 2008-05-07 |
| US20090058439A1 (en) | 2009-03-05 |
| KR20080004579A (ko) | 2008-01-09 |
| WO2007007835A1 (ja) | 2007-01-18 |
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