KR100908101B1 - 터치패널의 제조방법 및 이에 의해 제조되는 터치패널 - Google Patents

터치패널의 제조방법 및 이에 의해 제조되는 터치패널 Download PDF

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Publication number
KR100908101B1
KR100908101B1 KR1020080096674A KR20080096674A KR100908101B1 KR 100908101 B1 KR100908101 B1 KR 100908101B1 KR 1020080096674 A KR1020080096674 A KR 1020080096674A KR 20080096674 A KR20080096674 A KR 20080096674A KR 100908101 B1 KR100908101 B1 KR 100908101B1
Authority
KR
South Korea
Prior art keywords
coating layer
touch panel
pad
pattern
conductive material
Prior art date
Application number
KR1020080096674A
Other languages
English (en)
Korean (ko)
Inventor
박준영
정주현
김세현
배상모
Original Assignee
신와전공 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신와전공 주식회사 filed Critical 신와전공 주식회사
Priority to KR1020080096674A priority Critical patent/KR100908101B1/ko
Application granted granted Critical
Publication of KR100908101B1 publication Critical patent/KR100908101B1/ko
Priority to CN2009801389349A priority patent/CN102171633A/zh
Priority to PCT/KR2009/005516 priority patent/WO2010038957A2/ko

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Position Input By Displaying (AREA)
  • Manufacture Of Switches (AREA)
KR1020080096674A 2008-10-01 2008-10-01 터치패널의 제조방법 및 이에 의해 제조되는 터치패널 KR100908101B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020080096674A KR100908101B1 (ko) 2008-10-01 2008-10-01 터치패널의 제조방법 및 이에 의해 제조되는 터치패널
CN2009801389349A CN102171633A (zh) 2008-10-01 2009-09-28 触摸面板的制造方法及使用该方法制造的触摸面板
PCT/KR2009/005516 WO2010038957A2 (ko) 2008-10-01 2009-09-28 터치패널의 제조방법 및 이에 의해 제조되는 터치패널

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080096674A KR100908101B1 (ko) 2008-10-01 2008-10-01 터치패널의 제조방법 및 이에 의해 제조되는 터치패널

Publications (1)

Publication Number Publication Date
KR100908101B1 true KR100908101B1 (ko) 2009-07-16

Family

ID=41337695

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080096674A KR100908101B1 (ko) 2008-10-01 2008-10-01 터치패널의 제조방법 및 이에 의해 제조되는 터치패널

Country Status (3)

Country Link
KR (1) KR100908101B1 (zh)
CN (1) CN102171633A (zh)
WO (1) WO2010038957A2 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2672369A1 (en) * 2011-02-04 2013-12-11 Shin-Etsu Polymer Co. Ltd. Capacitive sensor sheet and manufacturing method of same
US10104770B2 (en) 2013-04-09 2018-10-16 3M Innovative Properties Company Touch panel, preparing method thereof, and Ag—Pd—Nd alloy for touch panel

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5942725B2 (ja) * 2012-09-18 2016-06-29 デクセリアルズ株式会社 導電性シート
KR101504840B1 (ko) * 2012-11-30 2015-03-20 주식회사 엘지화학 전도성 기판 및 이의 제조방법
CN103396012A (zh) * 2013-07-23 2013-11-20 蓝思科技（长沙）有限公司 一种采用金属或合金实现触控面板视窗边框图案及色彩的方法
EP2863291A1 (en) * 2013-10-18 2015-04-22 Applied Materials, Inc. Transparent body for a touch panel manufacturing method and system for manufacturing a transparent body for a touch screen panel
KR102329084B1 (ko) 2017-06-30 2021-11-18 엘지디스플레이 주식회사 터치 스크린 패널 및 터치 스크린 일체형 표시 장치
CN111028702B (zh) * 2019-12-05 2022-01-25 湖南创瑾科技有限公司 一种制造led透明显示屏的方法及显示屏

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000059089A (ko) * 2000-02-17 2000-10-05 서용운 마스크를 이용한 배선전극용 박막형성 공정 및 레이저가공 공정을 갖는 터치패널 제조방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020011716A (ko) * 2000-08-04 2002-02-09 한승국 도금방식에 의한 도체박막을 사용하는 터치판넬
KR20060007799A (ko) * 2004-07-22 2006-01-26 트렌돈 터치 테크놀로지 코오포레이숀 금속도금 기술을 이용하여 터치 패널상에 회로 레이아웃을제조하는 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000059089A (ko) * 2000-02-17 2000-10-05 서용운 마스크를 이용한 배선전극용 박막형성 공정 및 레이저가공 공정을 갖는 터치패널 제조방법

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2672369A1 (en) * 2011-02-04 2013-12-11 Shin-Etsu Polymer Co. Ltd. Capacitive sensor sheet and manufacturing method of same
EP2672369A4 (en) * 2011-02-04 2014-11-12 Shinetsu Polymer Co CAPACITIVE SENSING SHEET AND METHOD FOR MANUFACTURING THE SAME
US9482693B2 (en) 2011-02-04 2016-11-01 Shin-Etsu Polymer Co., Ltd. Capacitive sensor sheet and production method thereof
US10104770B2 (en) 2013-04-09 2018-10-16 3M Innovative Properties Company Touch panel, preparing method thereof, and Ag—Pd—Nd alloy for touch panel

Also Published As

Publication number Publication date
WO2010038957A2 (ko) 2010-04-08
CN102171633A (zh) 2011-08-31
WO2010038957A3 (ko) 2010-07-29

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