KR100880410B1 - 웨이퍼 홀딩 장치 - Google Patents

웨이퍼 홀딩 장치 Download PDF

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Publication number
KR100880410B1
KR100880410B1 KR1020020040533A KR20020040533A KR100880410B1 KR 100880410 B1 KR100880410 B1 KR 100880410B1 KR 1020020040533 A KR1020020040533 A KR 1020020040533A KR 20020040533 A KR20020040533 A KR 20020040533A KR 100880410 B1 KR100880410 B1 KR 100880410B1
Authority
KR
South Korea
Prior art keywords
dovetail
joint
silicon carbide
endplate
lock
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020020040533A
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English (en)
Korean (ko)
Other versions
KR20030007136A (ko
Inventor
페인토마스
고엘라지텐드라에스.
번스리이.
픽커링마이클에이.
Original Assignee
롬 앤드 하아스 컴패니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 롬 앤드 하아스 컴패니 filed Critical 롬 앤드 하아스 컴패니
Publication of KR20030007136A publication Critical patent/KR20030007136A/ko
Application granted granted Critical
Publication of KR100880410B1 publication Critical patent/KR100880410B1/ko
Assigned to 도까이 카본 가부시끼가이샤 reassignment 도까이 카본 가부시끼가이샤 권리의 전부이전등록 Assignors: 롬 앤드 하아스 컴패니
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/13—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S206/00—Special receptacle or package
    • Y10S206/832—Semiconductor wafer boat

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020020040533A 2001-07-16 2002-07-12 웨이퍼 홀딩 장치 Expired - Lifetime KR100880410B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US30576401P 2001-07-16 2001-07-16
US60/305,764 2001-07-16

Publications (2)

Publication Number Publication Date
KR20030007136A KR20030007136A (ko) 2003-01-23
KR100880410B1 true KR100880410B1 (ko) 2009-01-23

Family

ID=23182234

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020020040533A Expired - Lifetime KR100880410B1 (ko) 2001-07-16 2002-07-12 웨이퍼 홀딩 장치

Country Status (5)

Country Link
US (1) US6811040B2 (https=)
EP (1) EP1289002A3 (https=)
JP (1) JP4283504B2 (https=)
KR (1) KR100880410B1 (https=)
TW (1) TWI226078B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101772180B1 (ko) * 2016-02-02 2017-08-29 (주)앤피에스 기판 지지 장치 및 이를 포함하는 기판 처리 장치

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JP5205737B2 (ja) 2006-10-13 2013-06-05 株式会社Ｓｕｍｃｏ シリコンウェーハの保持方法および保持治具
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US20080220150A1 (en) * 2007-03-05 2008-09-11 Applied Materials, Inc. Microbatch deposition chamber with radiant heating
TWI361469B (en) * 2007-03-09 2012-04-01 Rohm & Haas Elect Mat Chemical vapor deposited silicon carbide articles
US20090004405A1 (en) * 2007-06-29 2009-01-01 Applied Materials, Inc. Thermal Batch Reactor with Removable Susceptors
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EP2255384B1 (en) * 2008-02-21 2019-11-20 Saint-Gobain Ceramics & Plastics, Inc. Ceramic paddle
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TWD140831S1 (zh) * 2008-03-28 2011-06-01 東京威力科創股份有限公司 半導體製造用保溫筒之基台
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WO2011027823A1 (ja) * 2009-09-02 2011-03-10 本田技研工業株式会社 搬送ラック、金属リングの保持方法及び熱処理方法
WO2011049938A2 (en) * 2009-10-20 2011-04-28 Saint-Gobain Ceramics & Plastics, Inc. Microelectronic processing component having a corrosion-resistant layer, microelectronic workpiece processing apparatus incorporating same, and method of forming an article having the corrosion-resistant layer
USD655255S1 (en) * 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD655682S1 (en) * 2010-06-18 2012-03-13 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
KR101035552B1 (ko) * 2011-03-24 2011-05-23 (주)상아프론테크 솔라웨이퍼 카세트
USD714369S1 (en) 2011-11-23 2014-09-30 Coorstek, Inc. Wafer paddle
USD763807S1 (en) * 2014-05-22 2016-08-16 Hzo, Inc. Boat for a deposition apparatus
TWM447450U (zh) * 2012-08-24 2013-02-21 Wistron Corp 支撐結構、卡榫與具有其之支撐架
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
TWD163542S (zh) * 2013-03-22 2014-10-11 日立國際電氣股份有限公司 基板處理裝置用晶舟
TWD166332S (zh) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 基板處理裝置用晶舟之部分
KR101495901B1 (ko) * 2013-07-03 2015-02-26 주식회사 월덱스 세라믹소재의 보트 결합 구조 및 그 접합 방법
JP1537630S (https=) * 2014-11-20 2015-11-09
JP1537312S (https=) * 2014-11-20 2015-11-09
JP1537313S (https=) * 2014-11-20 2015-11-09
JP6322159B2 (ja) * 2015-06-10 2018-05-09 クアーズテック株式会社 ウエハボート及びその製造方法
JP1563649S (https=) * 2016-02-12 2016-11-21
JP6770461B2 (ja) * 2017-02-21 2020-10-14 クアーズテック株式会社 縦型ウエハボート
JP7030604B2 (ja) * 2018-04-19 2022-03-07 三菱電機株式会社 ウエハボートおよびその製造方法
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD908103S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD908102S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
KR102552458B1 (ko) * 2019-07-31 2023-07-06 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 기판 지지구 및 반도체 장치의 제조 방법
CN110666992A (zh) * 2019-08-27 2020-01-10 北京灵禾科技发展有限公司 一种长晶舟及制备工艺
CN112687597B (zh) * 2020-12-25 2022-08-05 集美大学 一种高温基片退火架
JP7364275B1 (ja) 2022-06-07 2023-10-18 株式会社フェローテックホールディングス ウェハボート
JP1741513S (https=) * 2022-09-14 2023-04-11
JP1741512S (https=) * 2022-09-14 2023-04-11
CN115928209A (zh) * 2022-11-23 2023-04-07 浙江金瑞泓科技股份有限公司 一种防止硅片崩边的处理工艺以及操作用石英舟

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Also Published As

Publication number Publication date
JP2003179124A (ja) 2003-06-27
EP1289002A2 (en) 2003-03-05
JP4283504B2 (ja) 2009-06-24
US20030024888A1 (en) 2003-02-06
TWI226078B (en) 2005-01-01
US6811040B2 (en) 2004-11-02
KR20030007136A (ko) 2003-01-23
EP1289002A3 (en) 2007-01-24

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