KR100834351B1 - 멀티칩 패키지　밀봉용 에폭시 수지 조성물　및 이를이용한 멀티칩 패키지 - Google Patents

멀티칩 패키지　밀봉용 에폭시 수지 조성물　및 이를이용한 멀티칩 패키지 Download PDF

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Publication number
KR100834351B1
KR100834351B1 KR1020060117214A KR20060117214A KR100834351B1 KR 100834351 B1 KR100834351 B1 KR 100834351B1 KR 1020060117214 A KR1020060117214 A KR 1020060117214A KR 20060117214 A KR20060117214 A KR 20060117214A KR 100834351 B1 KR100834351 B1 KR 100834351B1
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KR
South Korea
Prior art keywords
epoxy resin
resin composition
sealing
hydroxysiloxane
multichip package
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
KR1020060117214A
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English (en)
Korean (ko)
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KR20080047185A (ko
Inventor
배경철
김진아
박윤곡
Original Assignee
제일모직주식회사
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Priority to KR1020060117214A priority Critical patent/KR100834351B1/ko
Priority to CN2007101871809A priority patent/CN101186802B/zh
Priority to JP2007302729A priority patent/JP2008127577A/ja
Priority to US11/984,933 priority patent/US20080131702A1/en
Publication of KR20080047185A publication Critical patent/KR20080047185A/ko
Application granted granted Critical
Publication of KR100834351B1 publication Critical patent/KR100834351B1/ko
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020060117214A 2006-11-24 2006-11-24 멀티칩 패키지　밀봉용 에폭시 수지 조성물　및 이를이용한 멀티칩 패키지 Active KR100834351B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020060117214A KR100834351B1 (ko) 2006-11-24 2006-11-24 멀티칩 패키지　밀봉용 에폭시 수지 조성물　및 이를이용한 멀티칩 패키지
CN2007101871809A CN101186802B (zh) 2006-11-24 2007-11-21 多芯片封装用环氧树脂组合物以及利用该组合物的多芯片封装
JP2007302729A JP2008127577A (ja) 2006-11-24 2007-11-22 マルチチップパッケージ封止用エポキシ樹脂組成物、及びこれを用いたマルチチップパッケージ
US11/984,933 US20080131702A1 (en) 2006-11-24 2007-11-26 Epoxy resin composition and semiconductor package including the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060117214A KR100834351B1 (ko) 2006-11-24 2006-11-24 멀티칩 패키지　밀봉용 에폭시 수지 조성물　및 이를이용한 멀티칩 패키지

Publications (2)

Publication Number Publication Date
KR20080047185A KR20080047185A (ko) 2008-05-28
KR100834351B1 true KR100834351B1 (ko) 2008-06-02

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Country Status (4)

Country Link
US (1) US20080131702A1 (https=)
JP (1) JP2008127577A (https=)
KR (1) KR100834351B1 (https=)
CN (1) CN101186802B (https=)

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KR101469265B1 (ko) * 2011-12-26 2014-12-04 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 장치
US20140018475A1 (en) * 2012-07-16 2014-01-16 Baker Hughes Incorporated High glass transition temperature thermoset and method of making the same
KR101557538B1 (ko) * 2012-12-24 2015-10-06 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
KR20140082521A (ko) * 2012-12-24 2014-07-02 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
KR101516068B1 (ko) * 2013-06-14 2015-04-29 삼성전기주식회사 인쇄회로기판용 수지 조성물, 빌드업필름, 프리프레그 및 인쇄회로기판
KR101731495B1 (ko) * 2015-01-08 2017-04-28 한국과학기술연구원 폴리오르가노―실세스퀴옥산 및 파장변환제를 포함하는 코팅 조성물, 및 이를 이용한 파장변환 시트
KR102567687B1 (ko) * 2015-06-17 2023-08-18 주식회사 다이셀 경화성 조성물
KR102487472B1 (ko) * 2015-08-03 2023-01-12 나믹스 가부시끼가이샤 고성능, 열 전도성 표면 실장 (다이 부착) 접착제
US9704767B1 (en) * 2015-12-23 2017-07-11 Intel Corporation Mold compound with reinforced fibers
JP7221079B2 (ja) * 2019-02-27 2023-02-13 株式会社東光高岳 エポキシ樹脂組成物、絶縁性成形体及びその製造方法
EP3950763B1 (en) * 2019-03-27 2025-10-22 NHK Spring Co., Ltd. Thermosetting epoxy resin composition, layered sheet for circuit board, metal-based circuit board, and power module
TWI784356B (zh) * 2020-11-30 2022-11-21 財團法人工業技術研究院 具環氧基之矽氧烷改質樹脂、封裝材料、與封裝結構
JP2022158797A (ja) * 2021-03-31 2022-10-17 住友ベークライト株式会社 封止用樹脂組成物、硬化物および電子装置の製造方法
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Also Published As

Publication number Publication date
JP2008127577A (ja) 2008-06-05
US20080131702A1 (en) 2008-06-05
CN101186802B (zh) 2011-06-08
KR20080047185A (ko) 2008-05-28
CN101186802A (zh) 2008-05-28

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