KR100802878B1 - 금속의 표면처리제, 표면처리방법 및 그 이용 - Google Patents

금속의 표면처리제, 표면처리방법 및 그 이용 Download PDF

Info

Publication number
KR100802878B1
KR100802878B1 KR1020067019566A KR20067019566A KR100802878B1 KR 100802878 B1 KR100802878 B1 KR 100802878B1 KR 1020067019566 A KR1020067019566 A KR 1020067019566A KR 20067019566 A KR20067019566 A KR 20067019566A KR 100802878 B1 KR100802878 B1 KR 100802878B1
Authority
KR
South Korea
Prior art keywords
molecule
metal
solder
salt
surface treatment
Prior art date
Application number
KR1020067019566A
Other languages
English (en)
Korean (ko)
Other versions
KR20060122967A (ko
Inventor
다카시 오우치
Original Assignee
닛코킨조쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛코킨조쿠 가부시키가이샤 filed Critical 닛코킨조쿠 가부시키가이샤
Publication of KR20060122967A publication Critical patent/KR20060122967A/ko
Application granted granted Critical
Publication of KR100802878B1 publication Critical patent/KR100802878B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/58—Treatment of other metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
KR1020067019566A 2004-03-05 2005-02-22 금속의 표면처리제, 표면처리방법 및 그 이용 KR100802878B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00061635 2004-03-05
JP2004061635 2004-03-05

Publications (2)

Publication Number Publication Date
KR20060122967A KR20060122967A (ko) 2006-11-30
KR100802878B1 true KR100802878B1 (ko) 2008-02-13

Family

ID=34918077

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067019566A KR100802878B1 (ko) 2004-03-05 2005-02-22 금속의 표면처리제, 표면처리방법 및 그 이용

Country Status (5)

Country Link
JP (1) JP4518507B2 (zh)
KR (1) KR100802878B1 (zh)
CN (2) CN102424965A (zh)
TW (1) TWI301515B (zh)
WO (1) WO2005085498A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007197791A (ja) * 2006-01-27 2007-08-09 Daiwa Fine Chemicals Co Ltd (Laboratory) めっき後処理剤組成物
CN102282294B (zh) * 2009-01-14 2013-07-03 安美特德国有限公司 增加金属或金属合金表面的钎焊性和耐腐蚀性的溶液和方法
JP5649139B2 (ja) * 2010-12-01 2015-01-07 Jx日鉱日石金属株式会社 銅表面の表面皮膜層構造
CN104818478A (zh) * 2012-12-13 2015-08-05 蒋红娟 可提高耐腐蚀性的水电解极板表面处理液的使用方法
CN104894569B (zh) * 2015-06-30 2018-03-02 长沙理工大学 一种Ni‑Pd金属表面处理剂
CN107326413A (zh) * 2017-07-04 2017-11-07 苏州道蒙恩电子科技有限公司 一种电镀锡抗变色处理剂及使用方法
CN115070259A (zh) * 2022-07-15 2022-09-20 深圳市同方电子新材料有限公司 一种新型超细焊锡粉的环保无铅焊锡膏

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000332399A (ja) * 1999-05-24 2000-11-30 Sumitomo Metal Mining Co Ltd はんだボールとその製造方法
JP2003193255A (ja) * 2001-12-26 2003-07-09 Kansai Paint Co Ltd 金属材料用表面処理組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000332399A (ja) * 1999-05-24 2000-11-30 Sumitomo Metal Mining Co Ltd はんだボールとその製造方法
JP2003193255A (ja) * 2001-12-26 2003-07-09 Kansai Paint Co Ltd 金属材料用表面処理組成物

Also Published As

Publication number Publication date
CN1930323B (zh) 2012-06-27
CN1930323A (zh) 2007-03-14
TWI301515B (en) 2008-10-01
TW200533783A (en) 2005-10-16
WO2005085498A1 (ja) 2005-09-15
JP4518507B2 (ja) 2010-08-04
JPWO2005085498A1 (ja) 2008-04-24
CN102424965A (zh) 2012-04-25
KR20060122967A (ko) 2006-11-30

Similar Documents

Publication Publication Date Title
KR100964063B1 (ko) 주석 및 주석 합금의 수계 산화 방지제
KR100802878B1 (ko) 금속의 표면처리제, 표면처리방법 및 그 이용
JP3103065B2 (ja) スズ合金めっき組成物及びめっき方法
US6200451B1 (en) Method for enhancing the solderability of a surface
KR102323027B1 (ko) 땜납이 고화된 회로 기판의 제조 방법, 전자 부품이 탑재된 회로 기판의 제조 방법 및 플럭스용 세정제 조성물
JP5422558B2 (ja) 金属又は金属合金表面のはんだ付け性及び耐食性強化溶液および方法
JP2000212763A (ja) 銀合金メッキ浴及びそれを用いる銀合金被膜の形成方法
KR100673181B1 (ko) Ｓｎ합금에 대한 표면처리제, 표면처리방법, 및 그것의 이용
KR101650601B1 (ko) 금속 또는 금속 합금 표면의 납땜성 및 내식성을 증가시키기 위한 용액 및 방법
KR101418194B1 (ko) Ｐｄ 또는 Ｐｄ를 주성분으로 하는 합금의 표면처리제, 및 구리표면의 표면 피막층 구조
US6544397B2 (en) Method for enhancing the solderability of a surface
EP1348512A1 (en) Water-soluble flux composition and process for producing soldered part
JP5137317B2 (ja) 電子部品
US7267259B2 (en) Method for enhancing the solderability of a surface
EP0750549B1 (en) Bismuth coating protection for copper
JP5697641B2 (ja) ＳｎおよびＳｎ合金に対する表面処理剤
JP2004156094A (ja) Ｓｎ又はＳｎ合金に対する表面処理剤及び表面処理方法
JPH07173675A (ja) 錫又は錫−鉛合金めっき材の表面処理液及び方法
USRE45842E1 (en) Method for enhancing the solderability of a surface
JPH09157887A (ja) 鉛無含有半田めっき浴およびそれにより得られた半田めっき皮膜

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130118

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20140117

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20150119

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20160104

Year of fee payment: 9

FPAY Annual fee payment

Payment date: 20170102

Year of fee payment: 10

FPAY Annual fee payment

Payment date: 20180103

Year of fee payment: 11

FPAY Annual fee payment

Payment date: 20190103

Year of fee payment: 12

FPAY Annual fee payment

Payment date: 20200103

Year of fee payment: 13