KR100759193B1 - 다층 인쇄회로기판의 제조방법 및 이에 의해 제조된 다층인쇄회로기판 - Google Patents
다층 인쇄회로기판의 제조방법 및 이에 의해 제조된 다층인쇄회로기판 Download PDFInfo
- Publication number
- KR100759193B1 KR100759193B1 KR1020050079885A KR20050079885A KR100759193B1 KR 100759193 B1 KR100759193 B1 KR 100759193B1 KR 1020050079885 A KR1020050079885 A KR 1020050079885A KR 20050079885 A KR20050079885 A KR 20050079885A KR 100759193 B1 KR100759193 B1 KR 100759193B1
- Authority
- KR
- South Korea
- Prior art keywords
- conductive metal
- metal paste
- circuit board
- printed circuit
- resin
- Prior art date
Links
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050079885A KR100759193B1 (ko) | 2005-08-30 | 2005-08-30 | 다층 인쇄회로기판의 제조방법 및 이에 의해 제조된 다층인쇄회로기판 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050079885A KR100759193B1 (ko) | 2005-08-30 | 2005-08-30 | 다층 인쇄회로기판의 제조방법 및 이에 의해 제조된 다층인쇄회로기판 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070027926A KR20070027926A (ko) | 2007-03-12 |
KR100759193B1 true KR100759193B1 (ko) | 2007-09-14 |
Family
ID=38100874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050079885A KR100759193B1 (ko) | 2005-08-30 | 2005-08-30 | 다층 인쇄회로기판의 제조방법 및 이에 의해 제조된 다층인쇄회로기판 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100759193B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5110178B2 (ja) | 2010-04-13 | 2012-12-26 | 株式会社デンソー | 半導体装置およびその製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1013024A (ja) * | 1996-06-27 | 1998-01-16 | Nec Toyama Ltd | 多層プリント配線板の製造方法 |
KR20000075884A (ko) * | 1997-03-03 | 2000-12-26 | 브래들리 이. 해덕 | 화학 처리탑의 강류관 |
KR20040067048A (ko) * | 2003-01-21 | 2004-07-30 | 오태성 | 교류자기장에 의한 유도가열체를 이용한 플립칩본딩방법과 그 장치 |
WO2005060324A1 (ja) * | 2003-12-16 | 2005-06-30 | Mitsui Mining & Smelting Co., Ltd. | 多層プリント配線板及びその多層プリント配線板の製造方法 |
-
2005
- 2005-08-30 KR KR1020050079885A patent/KR100759193B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1013024A (ja) * | 1996-06-27 | 1998-01-16 | Nec Toyama Ltd | 多層プリント配線板の製造方法 |
KR20000075884A (ko) * | 1997-03-03 | 2000-12-26 | 브래들리 이. 해덕 | 화학 처리탑의 강류관 |
KR20040067048A (ko) * | 2003-01-21 | 2004-07-30 | 오태성 | 교류자기장에 의한 유도가열체를 이용한 플립칩본딩방법과 그 장치 |
WO2005060324A1 (ja) * | 2003-12-16 | 2005-06-30 | Mitsui Mining & Smelting Co., Ltd. | 多層プリント配線板及びその多層プリント配線板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20070027926A (ko) | 2007-03-12 |
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