KR100756707B1 - 이방 도전성 커넥터 및 도전성 페이스트 조성물, 프로우브 부재 및 웨이퍼 검사 장치 - Google Patents

이방 도전성 커넥터 및 도전성 페이스트 조성물, 프로우브 부재 및 웨이퍼 검사 장치 Download PDF

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Publication number
KR100756707B1
KR100756707B1 KR1020057001118A KR20057001118A KR100756707B1 KR 100756707 B1 KR100756707 B1 KR 100756707B1 KR 1020057001118 A KR1020057001118 A KR 1020057001118A KR 20057001118 A KR20057001118 A KR 20057001118A KR 100756707 B1 KR100756707 B1 KR 100756707B1
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South Korea
Prior art keywords
conductive
wafer
connection
anisotropic conductive
connector
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Expired - Lifetime
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KR1020057001118A
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English (en)
Korean (ko)
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KR20050033614A (ko
Inventor
료오지 세따까
Original Assignee
제이에스알 가부시끼가이샤
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Publication of KR20050033614A publication Critical patent/KR20050033614A/ko
Application granted granted Critical
Publication of KR100756707B1 publication Critical patent/KR100756707B1/ko
Assigned to 주식회사 아이에스시 reassignment 주식회사 아이에스시 권리의 전부이전등록 Assignors: 제이에스알 가부시끼가이샤
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Paints Or Removers (AREA)
KR1020057001118A 2002-08-09 2003-08-07 이방 도전성 커넥터 및 도전성 페이스트 조성물, 프로우브 부재 및 웨이퍼 검사 장치 Expired - Lifetime KR100756707B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00232202 2002-08-09
JP2002232202 2002-08-09
PCT/JP2003/010055 WO2004015760A1 (ja) 2002-08-09 2003-08-07 異方導電性コネクターおよび導電性ペースト組成物、プローブ部材並びにウエハ検査装置およびウエハ検査方法

Publications (2)

Publication Number Publication Date
KR20050033614A KR20050033614A (ko) 2005-04-12
KR100756707B1 true KR100756707B1 (ko) 2007-09-07

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KR1020057001118A Expired - Lifetime KR100756707B1 (ko) 2002-08-09 2003-08-07 이방 도전성 커넥터 및 도전성 페이스트 조성물, 프로우브 부재 및 웨이퍼 검사 장치

Country Status (7)

Country Link
US (1) US7049836B2 (https=)
EP (1) EP1553621A4 (https=)
JP (2) JP3685192B2 (https=)
KR (1) KR100756707B1 (https=)
CN (1) CN100369227C (https=)
AU (1) AU2003254853A1 (https=)
WO (1) WO2004015760A1 (https=)

Cited By (1)

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KR100998356B1 (ko) 2008-06-04 2010-12-03 주식회사 아이에스시테크놀러지 열전달시트 및 그 열전달시트의 제조방법

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US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
TWI239684B (en) * 2003-04-16 2005-09-11 Jsr Corp Anisotropic conductive connector and electric inspection device for circuit device
US7446545B2 (en) * 2003-05-08 2008-11-04 Unitechno Inc. Anisotropically conductive sheet
TWI239685B (en) * 2003-05-13 2005-09-11 Jsr Corp Flaky probe, its manufacturing method and its application
US20060177971A1 (en) * 2004-01-13 2006-08-10 Jsr Corporation Anisotropically conductive connector, production process thereof and application product thereof
WO2006046650A1 (ja) * 2004-10-29 2006-05-04 Jsr Corporation ウエハ検査用探針部材、ウエハ検査用プローブカードおよびウエハ検査装置
US20070268032A1 (en) * 2004-11-12 2007-11-22 Jsr Corporation Probe Member for Wafer Inspection, Probe Card for Wafer Inspection and Wafer Inspection Apparatus
TWI388846B (zh) * 2005-07-14 2013-03-11 Jsr Corp An electrical impedance measuring device and a measuring method for connecting an electrical resistance measuring connector and a circuit board
US7662708B2 (en) * 2005-07-27 2010-02-16 Palo Alto Research Center Incorporated Self-assembled interconnection particles
US7504331B2 (en) * 2005-07-27 2009-03-17 Palo Alto Research Center Incorporated Method of fabricating self-assembled electrical interconnections
US7525194B2 (en) * 2005-07-27 2009-04-28 Palo Alto Research Center Incorporated System including self-assembled interconnections
US7405582B2 (en) * 2006-06-01 2008-07-29 Advantest Corporation Measurement board for electronic device test apparatus
EP1972930B1 (de) * 2007-03-19 2019-11-13 Concast Ag Verfahren zur Erkennung von Oberflächenmerkmalen metallurgischer Erzeugnisse, insbesondere Strangguss- und Walzerzeugnisse, sowie eine Einrichtung zur Durchführung des Verfahrens
KR101402144B1 (ko) * 2007-03-30 2014-06-03 주식회사 아이에스시 이방 도전성 커넥터, 프로브 부재 및 웨이퍼 검사 장치
KR100886712B1 (ko) * 2007-07-27 2009-03-04 주식회사 하이닉스반도체 반도체 패키지 및 이의 제조 방법
JP2009193710A (ja) * 2008-02-12 2009-08-27 Jsr Corp 異方導電性コネクターおよびこの異方導電性コネクターを用いた回路装置の検査装置
KR101145886B1 (ko) * 2009-01-16 2012-05-15 주식회사 아이에스시 전기적 접속체 및 그 전기적 접속체를 포함한 테스트 소켓
JP5152099B2 (ja) * 2009-05-18 2013-02-27 富士通株式会社 基板構造
JP2013007766A (ja) * 2011-06-22 2013-01-10 Japan Display Central Co Ltd 液晶表示装置
JP5531170B1 (ja) * 2012-07-31 2014-06-25 帝人株式会社 ランダムマットおよび繊維強化複合材料成形体
US10738168B2 (en) * 2012-08-01 2020-08-11 Teijin Limited Random mat and fiber-reinforced composite material shaped product
US9142475B2 (en) 2013-08-13 2015-09-22 Intel Corporation Magnetic contacts
WO2016048347A1 (en) 2014-09-26 2016-03-31 Intel Corporation Flexible packaging architecture
CN106568993B (zh) * 2015-10-09 2019-07-30 苍南县三维电子塑胶有限公司 可编程的显示面板检测用探针结构及检测系统
JP2018073577A (ja) * 2016-10-27 2018-05-10 株式会社エンプラス 異方導電性シート及びその製造方法
KR102180143B1 (ko) * 2017-12-29 2020-11-17 국도화학 주식회사 이방 도전성 필름, 이를 포함하는 디스플레이 장치 및／또는 이를 포함하는 반도체 장치
JP7405337B2 (ja) * 2018-10-11 2023-12-26 積水ポリマテック株式会社 電気接続シート、及び端子付きガラス板構造
KR102075669B1 (ko) * 2018-10-26 2020-02-10 오재숙 신호 전송 커넥터 및 그 제조방법
KR102732165B1 (ko) * 2019-03-15 2024-11-22 주식회사 아이에스시 전기접속용 커넥터
TWI750578B (zh) * 2020-02-04 2021-12-21 吳在淑 信號傳輸連接器及其製造方法
CN114413745B (zh) * 2022-01-04 2023-05-23 华北电力科学研究院有限责任公司 一种检测发电机定子绝缘受潮深度的装置及方法
KR102732569B1 (ko) * 2022-07-13 2024-11-20 주식회사 아이에스시 도전성 입자, 도전성 입자의 제조방법 및 검사용 커넥터
KR102771411B1 (ko) * 2023-06-09 2025-02-24 주식회사 티에프이 반도체 소자 테스트용 소켓

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Publication number Publication date
CN100369227C (zh) 2008-02-13
WO2004015760A1 (ja) 2004-02-19
JP2005166678A (ja) 2005-06-23
KR20050033614A (ko) 2005-04-12
CN1675757A (zh) 2005-09-28
JP2004095547A (ja) 2004-03-25
JP3685192B2 (ja) 2005-08-17
US20050264307A1 (en) 2005-12-01
EP1553621A4 (en) 2005-08-10
US7049836B2 (en) 2006-05-23
AU2003254853A1 (en) 2004-02-25
EP1553621A1 (en) 2005-07-13

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