KR100755295B1 - 전력 종속 피드백을 사용한 전자소자 제어 - Google Patents

전력 종속 피드백을 사용한 전자소자 제어 Download PDF

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Publication number
KR100755295B1
KR100755295B1 KR1020017000633A KR20017000633A KR100755295B1 KR 100755295 B1 KR100755295 B1 KR 100755295B1 KR 1020017000633 A KR1020017000633 A KR 1020017000633A KR 20017000633 A KR20017000633 A KR 20017000633A KR 100755295 B1 KR100755295 B1 KR 100755295B1
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South Korea
Prior art keywords
temperature
power
heat exchanger
heat
signal
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Expired - Lifetime
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KR1020017000633A
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English (en)
Korean (ko)
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KR20010071917A (ko
Inventor
토마스피. 존스
조나단이. 터너
마크에프. 말리노스키
Original Assignee
델타 디자인, 인코포레이티드
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Publication of KR20010071917A publication Critical patent/KR20010071917A/ko
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Publication of KR100755295B1 publication Critical patent/KR100755295B1/ko
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G05D23/24—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Control Of Temperature (AREA)
KR1020017000633A 1998-07-14 1999-07-14 전력 종속 피드백을 사용한 전자소자 제어 Expired - Lifetime KR100755295B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9272098P 1998-07-14 1998-07-14
US60/092,720 1998-07-14

Publications (2)

Publication Number Publication Date
KR20010071917A KR20010071917A (ko) 2001-07-31
KR100755295B1 true KR100755295B1 (ko) 2007-09-05

Family

ID=22234752

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020017000633A Expired - Lifetime KR100755295B1 (ko) 1998-07-14 1999-07-14 전력 종속 피드백을 사용한 전자소자 제어

Country Status (5)

Country Link
JP (1) JP4703850B2 (enExample)
KR (1) KR100755295B1 (enExample)
AU (1) AU4991799A (enExample)
DE (1) DE19983379B4 (enExample)
WO (1) WO2000004582A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6794620B1 (en) * 2001-11-07 2004-09-21 Advanced Micro Devices, Inc. Feedforward temperature control of device under test
DE10203790A1 (de) * 2002-01-31 2003-06-26 Siemens Ag Aktive Stabilisierung des Temperaturniveaus in Halbleiterbauelementen
US6825681B2 (en) 2002-07-19 2004-11-30 Delta Design, Inc. Thermal control of a DUT using a thermal control substrate
US7313500B2 (en) 2004-11-05 2007-12-25 Schweitzer Engineering Labortories, Inc. Method to increase the maximum allowable ambient temperature rating of an electronic device
DE102005001163B3 (de) 2005-01-10 2006-05-18 Erich Reitinger Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer temperierbaren Aufspanneinrichtung
US9570643B2 (en) 2013-10-28 2017-02-14 General Electric Company System and method for enhanced convection cooling of temperature-dependent power producing and power consuming electrical devices
EP4099370B1 (en) 2016-06-15 2024-08-07 Watlow Electric Manufacturing Company Power converter for a thermal system
US10514416B2 (en) 2017-09-29 2019-12-24 Advantest Corporation Electronic component handling apparatus and electronic component testing apparatus
CN109932630B (zh) * 2017-12-15 2021-08-03 朋程科技股份有限公司 过温度检测电路及其测试方法
JP7266481B2 (ja) * 2019-07-19 2023-04-28 東京エレクトロン株式会社 温度制御装置、温度制御方法、および検査装置
JP7534047B2 (ja) * 2020-12-07 2024-08-14 東京エレクトロン株式会社 検査装置の制御方法及び検査装置
WO2025191634A1 (ja) * 2024-03-11 2025-09-18 株式会社日立ハイテク プラズマ処理装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4713612A (en) * 1986-07-14 1987-12-15 Hughes Aircraft Company Method and apparatus for determination of junction-to-case thermal resistance for a hybrid circuit element
US4881591A (en) * 1985-09-23 1989-11-21 Sharetree Limited Oven for the burn-in of integrated circuits
JPH05276008A (ja) * 1991-11-01 1993-10-22 Hewlett Packard Co <Hp> 動的電力補償
US5569950A (en) * 1994-08-16 1996-10-29 International Business Machines Corporation Device to monitor and control the temperature of electronic chips to enhance reliability
JPH09264647A (ja) * 1996-03-27 1997-10-07 Nec Corp 電子機器冷却回路

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330809A (en) * 1979-12-31 1982-05-18 Crown International, Inc. Thermal protection circuit for the die of a transistor
US4637020A (en) * 1983-08-01 1987-01-13 Fairchild Semiconductor Corporation Method and apparatus for monitoring automated testing of electronic circuits
US4686627A (en) * 1984-12-24 1987-08-11 Honeywell Inc. Electrical test apparatus
DE3536098A1 (de) * 1985-10-09 1987-04-09 Siemens Ag Einrichtung zum ueberwachen der temperatur eines elektrischen bauelements
US5287292A (en) * 1992-10-16 1994-02-15 Picopower Technology, Inc. Heat regulator for integrated circuits
JPH07263526A (ja) * 1994-03-17 1995-10-13 Hitachi Ltd ウェハチャックおよび半導体素子の冷却方法
US6476627B1 (en) * 1996-10-21 2002-11-05 Delta Design, Inc. Method and apparatus for temperature control of a device during testing

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4881591A (en) * 1985-09-23 1989-11-21 Sharetree Limited Oven for the burn-in of integrated circuits
US4713612A (en) * 1986-07-14 1987-12-15 Hughes Aircraft Company Method and apparatus for determination of junction-to-case thermal resistance for a hybrid circuit element
JPH05276008A (ja) * 1991-11-01 1993-10-22 Hewlett Packard Co <Hp> 動的電力補償
US5569950A (en) * 1994-08-16 1996-10-29 International Business Machines Corporation Device to monitor and control the temperature of electronic chips to enhance reliability
JPH09264647A (ja) * 1996-03-27 1997-10-07 Nec Corp 電子機器冷却回路

Also Published As

Publication number Publication date
JP2002520630A (ja) 2002-07-09
WO2000004582A8 (en) 2000-05-18
AU4991799A (en) 2000-02-07
DE19983379T1 (de) 2001-09-13
WO2000004582A1 (en) 2000-01-27
KR20010071917A (ko) 2001-07-31
DE19983379B4 (de) 2011-08-18
WO2000004582A9 (en) 2000-07-20
JP4703850B2 (ja) 2011-06-15

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