WO2000004582A1 - Temperature control of electronic devices using power following feedback - Google Patents

Abstract

A method for controlling a device temperature measures a parameter related to device power consumption and utilizes the parameter to control the device temperature. This can be achieved with a system including a heat exchanger, a power monitor, and a circuit which controls the temperature setting of the heat exchanger. The circuit uses as inputs the power level, heat exchanger temperature, and set point. The system thus eliminates the need for temperature sensing devices in or connected to a chip, responds to the temperature of the device and not the package, can be used for high volume chip manufacturing, does not require significant surface area of a device for temperature sensing, and eliminates the need for chip power profiles. Significantly, the system allows a set point to be maintained with minimal overshoot or undershoot.

Description

TEMPERATURE CONTROL OF ELECTRONIC DEVICES USING POWER FOLLOWING FEEDBACK

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority of previously filed provisional application number 60/092,720, filed on July 14, 1998, which is hereby incorporated as if fully set forth herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates in general to the field of temperamre control and more particularly to an improved apparatus and method of providing temperamre control to electronic devices using power following feedback.

2. Description of Related Art

The present invention relates to temperamre control systems which maintain the temperamre of an electronic device at or near a constant set point temperamre while the device is being operated or tested. Two examples of electronic devices which are best operated at a constant or near constant temperamre are packaged integrated chips and bare chips which are unpackaged. Maintaining the chip temperamre near a constant set point is not difficult if the power dissipation of the chip is constant or varies in a small range while operating or testing. One way of handling such a situation is to couple the chip through a fixed thermal resistance to a thermal mass which is at a fixed temperamre. But if the instantaneous power dissipation of the chip varies up and down in a wide range while operating or testing, then maintaining the chip temperamre near a constant set point is very difficult. Various temperamre forcing systems are used to respond to the chip's temperamre variation caused by widely varying power dissipation of the chip. Feedback methods are commonly used to sense the varying temperamre. Typical approaches involve the use of a temperamre sensing device such as a thermocouple, mounted on the chip package or chip itself. Another approach is to integrate a temperamre sensing device, such as a thermal diode, into the chip circuitry. Such a temperamre sensing device would be used to sense changes in the chip's temperature, and then adjust the temperamre forcing system appropriately.

There are several problems with the use of temperature sensing devices. In the case of packaged chips, an externally mounted thermocouple will indicate the temperamre of the package surface, not the temperamre of the chip inside the package. At some level of power dissipation, this temperamre difference will be significant to the test result. The use of temperature sensors integrated into the chip itself addresses this problem, but raises other issues. It is not typical practice for the chip manufacturer to integrate temperature sensors on the chip. Even if it were, each chip's temperature sensor would have unique calibration requirements. All of the above present problems for high volume chip manufacturing.

Temporary temperamre sensors, such as thermocouple probes, included in automated test handling equipment can address some of these issues. However, the package temperature vs. die temperamre problem will remain. Also, the reliability of the temporary temperamre sensor introduces error which can be significant to the high volume chip manufacturing test result. Moreover, the surface available for temperamre control is the same surface needed for the temporary temperature sensor, complicating the problem further. Therefore, a need has arisen for an apparams and method of temperamre control for electronic devices which can respond to the temperamre of the electronic device, instead of the package. A further need exists for an apparams and method of temperamre control for electronic devices which can conveniently be used for high volume chip manufacturing. A further need exists for an apparams and method of temperamre control for electronic devices which is reliable. A further need exists for an apparams and method of temperamre control for electronic device which does not require significant surface area of the electronic device. A further need exists for a method of temperamre control for electronic devices which does not require temperature sensing devices to be integrated into the chip or to be temporarily in contact with the chip. A further need exists for a method of temperamre control for electronic devices which does not require collecting, mamtaining, and applying the use of chip power profiles, and does not require the capability of performing such tasks in the automated test equipment, temperamre forcing system, and testing software.

The present invention is directed to overcoming or at least reducing the effects of one or more of the problems set out above. SUMMARY OF THE INVENTION

In accordance with the present invention, an apparatus and method of temperamre control for electronic devices is provided that substantially eliminates or reduces the disadvantages and problems associated with the previously developed temperamre control for electronic devices. An advantage of the present invention is that it provides an apparams and method of temperamre control for electronic devices which can respond to the temperamre of an electronic device, instead of the package.

Another advantage of the present invention is that it provides an apparatus and method of temperature control for electronic devices which can conveniently be used for high volume chip manufacturing.

A further benefit of the present invention is that it provides an apparams and method of temperamre control for electronic devices which is reliable.

Yet another advantage of the present invention is that it provides an apparatus and method of temperamre control for electronic devices which does not require significant surface area of an electronic device for temporary monitoring of package temperamre.

Another benefit of the present invention is that it eliminates the need for temperature sensing devices to be integrated into the chip or to be temporarily connected to the chip for temperamre control in high volume manufacturing. Yet another benefit of the present invention is that it eliminates the need to collect, maintain, and apply the use of chip power profiles, as well as eliminating the need for the capability in the automated test equipment, temperamre forcing system, and testing software to collect and apply chip power profiles.

Briefly, in accordance with one aspect of the present invention, there is provided a method for controlling a temperamre of a device. The method includes measuring a parameter related to power consumption by the device and utilizing the measured parameter in controlling the temperamre of the device. The measuring of the parameter and the controlling of the temperature occur contemporaneously. The parameter is other than the temperature of the device, and the relevant power consumption is the power which is consumed by the device through power connections as opposed to signal connections.

Briefly, in accordance with another aspect of the present invention, there is provided a method for calculating a real time temperamre of a device. The method includes measuring a real time power usage of the device, and using the measured real time power usage of the device in determining a figure which can be used for the real time temperature of the device. The power usage relates to power which is used by the device through one or more power connections as opposed to signal connections.

Briefly, in accordance with another aspect of the present invention, there is provided a method for controlling a temperature of a device in a system containing a temperamre forcing system coupled to the device. The method includes monitoring a power consumption of the device, adjusting a temperature of the temperamre forcing system based in part on the monitored power consumption of the device, and controlling the device temperamre with the temperature forcing system. The power consumption relates to power which is supplied to the device by one or more power supplies.

Briefly, in accordance with another aspect of the present invention, there is provided a system for controlling a temperamre of a device. The system includes a measuring device for measuring a parameter related to power consumption by the device, a heat exchanger adapted to be coupled to the device, and a thermal controller for determining a setting of the heat exchanger. The setting is determined in part by using the measured parameter related to power consumption by the device. The thermal controller is coupled to the measuring device and operates contemporaneously with it. The parameter is other than the temperamre of the device, and the relevant power consumption is the power which is consumed by the device through power connections as opposed to signal connections.

Briefly, in accordance with another aspect of the present invention, there is provided a system for controlling a temperamre of a device. The system includes structure for measuring a parameter related to power consumption by the device, and structure for controlling the temperature of the device based in part on the measured parameter related to power consumption by the device. The measuring of a parameter related to power consumption by the device and the controlling of the temperamre of the device occur contemporaneously. The parameter is other than the temperamre of the device, and the relevant power consumption is the power which is consumed by the device through power connections as opposed to signal connections.

Briefly, in accordance with another aspect of the present invention, there is provided a data generation system for use with a semiconductor device under test.

The data generation system includes a programmable power supply and a data acquisition device. The programmable power supply is for supplying power to the semiconductor device under test, and for supplying a data signal which contains information on the power being used by the semiconductor device under test. The data acquisition device is coupled to the programmable power supply. The data acquisition device is for acquiring data on the power being used by the semiconductor device under test by receiving the data signal from the programmable power supply.

Briefly, in accordance with another aspect of the present invention, there is provided a method of data generation for use with a semiconductor device under test. The method includes continuously supplying a data signal from a programmable power supply. The data signal contains real-time information on the power being supplied by the programmable power supply to the semiconductor device under test. The method further includes continuously receiving the data signal, from the programmable power supply, at a data acquisition device.

Briefly, in accordance with another aspect of the present invention, there is provided a temperamre control system for use with a semiconductor device during D testing. The temperamre control system includes a measuring device, a heat exchanger, a thermal controller, and a test head. The measuring device is for measuring a parameter related to power consumption by the semiconductor device during testing. The parameter is other than the temperamre of the semiconductor device, and the relevant power consumption is the power which is consumed by the semiconductor device through power connections as opposed to signal connections. The heat exchanger is adapted to be coupled to the semiconductor device. The thermal controller is for determining a setting of the heat exchanger, wherein the setting is determined in part by using the measured parameter related to power consumption by the device. The thermal controller is coupled to the measuring device and operates contemporaneously in time with it. The test head is for holding the semiconductor device during testing. The test head allows testing of the semiconductor device while the semiconductor device is in conductive contact with the heat exchanger and the setting of the heat exchanger is determined by the thermal controller.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a block diagram illustrating an embodiment of the present invention.

FIG. IB is a block diagram illustrating several principle components of a thermal control board according to an embodiment of the present invention.

FIG. 2 is a block diagram illustrating the power computation and monitoring circuit of an embodiment of the present invention.

FIG. 3 is a block diagram illustrating the thermal control circuit of an embodiment of the present invention. FIG. 4 is a graph illustrating the results of power following temperature control according to an embodiment of the present invention.

FIG. 5 contains a graph illustrating the performance of a forced air system.

FIG. 6 contains a graph illustrating the performance of a simple conduction system. FIG. 7 contains a graph illustrating the performance of power following temperature control according to an embodiment of the present invention. FIG. 8 contains a graph illustrating the effect of controlling self-heating versus not controlling self-heating on the performance distribution of a device lot.

FIG. 9 is a high-level block diagram showing an interrelationship between a test control system, a temperamre control system, and a device. FIGS. 10 A- IOC are high-level block diagrams showing the acquisition and use of device power information.

FIG. 11 illustrates a thermal control unit.

DETAILED DESCRIPTION OF AN EMBODIMENT

The above-noted and other aspects of the present invention will become more apparent from a description of an embodiment, when read in conjunction with the accompanying drawings. The drawings illustrate an embodiment of the invention. In the drawings, the same members have the same reference numerals.

Pending patent application U.S.S.N. 08/734,212 to Pelissier, assigned to the present assignee, is hereby incorporated as fully set forth herein. Co-pending provisional patent application U.S.S.N. 60/092,715 to Jones et al. (attorney docket number 42811-106), also assigned to the present assignee, filed on July 14, 1998, is also hereby incorporated as if fully set forth herein.

1. Central Principles

When a device is tested, the tests need to be run at a specified temperamre, known as a set point. The device, which is also called the device under test

("DUT"), is typically tested at several different set points and the performance at each set point is noted. The performance of the DUT is often measured as the maximum operating frequency, f^, at a given set point. A DUT is typically faster (high f-_n^) at lower temperamres and slower (low f^) at higher temperatures. A higher f_^ indicates a better performing DUT and, therefore, a more valuable DUT.

It has become increasingly difficult to maintain a given set point. One of the reasons is the DUT self-heating which occurs during a test. The DUT self-heats because it draws power during the test. If the DUT cannot be maintained at the set point during a test sequence, and it heats up, then, as indicated above, the performance of the DUT will go down. This results in underreporting the DUT's performance because if the temperamre had been kept at the desired, lower temperamre, then the performance would have been better. The same device could then have been sold at a higher price. The price is typically exponentially higher for a faster device. Thus, the impact is large for manufacturers who must, understandably, accept the underreported performance. The number of devices affected is also exponentially related to the temperamre increase from self-heating. As FIG. 8 indicates, the distribution of the performance of a given lot of devices typically has a normal distribution about some center frequency. That center frequency is approximately 450 MHz in FIG. 8, for the right-most curve. In this example, the high performing devices are considered to be those with an f_^ of 480 MHz or greater.

If the set point can be maintained, then all of the devices of the right-most curve which are in the tail to the right of 480 MHz will be high performing devices. However, if the set point cannot be maintained due to self-heating, then the curve will shift, resulting in the left-most curve, for example. In this example, the acmal junction temperamre of the device is assumed to increase by 20 degrees C, which would result in approximately a 4% decrease in performance. The distribution of devices in this lot is therefore shifted to the left, so that it is centered around approximately 432 MHz (4% of 450 = 18). This shifted curve is represented by the left-most curve. However, a high performing device still needs to have an f._^ of 480 MHz or greater. The high performance area of the curve has thus moved further into the tail of the distribution. As is clear from the area under the curve, the number of high performance devices is now exponentially smaller.

This problem would continue to get worse. Industry trends are toward devices which operate at greater frequencies and occupy less area. This causes the devices to use more power, have greater power spikes or transitions, and to be less able to dissipate the heat which they generate.

Many semiconductors utilize complementary metal oxide semiconductor ("CMOS") technology. One of the characteristics of CMOS is that it draws a large spike in power when it switches states. Further, as a CMOS device is operated at a faster speed, the device will typically switch more quickly and more often. This will require more power and will also result in large, fast changes in instantaneous power consumption. Thus, more heat will be generated. This situation is aggravated by the decreasing size and thermal mass of the devices. This results in less "space" into which the heat of the device can dissipate or diffuse. The net result will be larger variations in DUT temperamre due to self- heating and increased underreporting of DUT performance. Convection systems have proven ineffective, as have improvements to them.

Referring to Fig. 5, there is shown the performance of a forced air system when analyzed in terms of junction temperature in a device and power drawn by the device. The deviation in the junction temperature from the desired set point increases as the power drawn by the device increases. As can be seen, the deviation exceeds twenty degrees C at several transition points.

Conduction systems, while offering a potential advantage over convection systems, have also proven ineffective. Referring to FIG. 6, there is shown the performance of simple conduction on a flip chip device. As the power drawn by the device increases, the temperamre also increases well in excess of the nominal temperature of approximately sixty degrees C.

A true solution requires an ability to quickly detect a DUT's temperamre and an ability to respond quickly and effectively to changes in the DUT temperamre.

As described in this application, both requirements are addressed by the disclosed invention. They provide a mechanism for quickly determining the DUT temperamre by using a newly developed power-following feedback technique. The disclosures also provide a heat source/sink (generically, a heat exchanger ("Hx")) that can respond quickly and effectively to offset the self-heating of the DUT. Referring to FIG. 7, there is shown a reduced overshoot in the DUT temperamre effected in part by the rapid response to the determined DUT temperature. This response is shown by the heat exchanger temperamre reflecting, with a reverse image, the power to. the DUT.

The power-following feedback method which is used for determining the DUT temperamre also has the advantage of working in real time, so that test sequences can be optimized without the need for changing thermal conditioning, and without the thermal conditioning limiting test program flexibility. A key feature is the development and use of a simplified equation which allows the derivation of a DUT temperamre from the power measurements. While a measurement, also called a calculation, of the total power usage of a DUT is desirable, it will be clear to those skilled in the relevant art, in light of the present disclosure, that this will not always be necessary. Clearly, there will be embodiments in which part of the power could be estimated or ignored. This may occur, for example and without limitation, if all of a device's power fluctuations are isolated to a particular voltage or power supply, or if a particular power supply provides a comparatively small amount of power to the device.

Further, monitoring the power supplies is a convenient method of monitoring power usage because the connections are removed from the DUT and because it senses the instantaneous power fluctuations before the actual change in self-heating occurs. Note that these power fluctuations may be increases or decreases and may give rise to increases or decreases in self-heating. However, those of ordinary skill in the art will appreciate that there are other methods of monitoring power, current, and/or voltage.

2. Power Following System

FIG. 1A illustrates an embodiment of the present invention. A monitoring circuit 10 monitors power usage from one or more power supplies 15 which supply power to an electronic device (not shown) under test or in operation. If there is a plurality of power supplies 15, then the monitor circuit 10 sums the total power usage. An electrical connection point 16 links the monitor circuit 10 to each power supply 15. The electrical connection point 16 provides the monitor circuit 10 with indication of the power usage of the electronic device, such as a voltage image of the current through the electronic device and a voltage level at which the electronic device is being operated or tested. Electrical connection points 16 are available in power supplies of automated test equipment used to test electronic devices. The monitor circuit 10 sends a power usage signal 20 (a voltage representing the value of the power usage) to a thermal control circuit 25.

Based on a given chip set point temperamre or a signal representing the set point temperamre 30, and a forcing system surface temperamre or a signal representing the forcing system surface temperature 32, the thermal control circuit 25 translates the power usage signal 20 into a temperamre control signal 35. The thermal control circuit 25 sends the temperamre control signal 35 to a heat exchanger temperamre control 40. The heat exchanger temperature control 40 contains a heat exchanger power supply (not shown) with a power amplifier and controls temperamre to a heat exchanger 45 for the electronic device under test or operation by adjusting the output current of the heat exchanger power supply. The resulting temperamre of the heat exchanger is the forcing system surface temperamre 32.

Referring to FIG. IB, the thermal control circuit 25 resides on a thermal control board 27. The thermal control board 27 also contains, among other components, a first precise constant current source 28 and a second precise constant current source 29. The first precise constant current source 28 sends a precise constant current from the thermal control board 27 to a variable resistance device ("RTD") in the heat exchanger 45. The RTD responds to the forcing system surface temperamre and outputs a voltage representing the forcing system surface temperamre 32. The forcing system surface temperamre voltage 33 feeds back into the thermal control circuit 25. Placing the first precise constant current source 28 off of the heat exchanger 45 provides an advantage in that the heat exchanger can be replaced more easily.

The second precise constant current source 29 is able to send a precise constant current to the DUT. The heat exchanger 45 is further described in the section on the Temperamre Control Unit below.

The present invention can be used in conjunction with the techniques and apparams described in co-pending provisional patent application U.S.S.N. 60/092,715 to Jones et al. As one skilled in the relevant art will readily appreciate, in light of the present and incorporated disclosures, the functions of the overall system can be implemented with a variety of techniques. Electrical circuits are disclosed herein for the monitoring circuit and the thermal control circuit, but other implementations are possible for these functions, as well as for others such as producing the signals representing the current, voltage, temperamre, and power.

In accordance with an aspect of the present invention, the functionality disclosed herein can be implemented by hardware, software, and/ or a combination of both. Software implementations can be written in any suitable language, including without limitation high-level programming languages such as C+ + , mid- level and low-level languages, assembly languages, and application-specific or device-specific languages. Such software can run on a general purpose computer such as a 486 or a Pentium, an application specific piece of hardware, or other suitable device.

In addition to using discrete hardware components in a logic circuit, the required logic may also be performed by an application specific integrated circuit ("ASIC") or other device. The technique may use analog circuitry, digital circuitry, or a combination of both. The system will also include various hardware components which are well known in the art, such as connectors, cables, and the like. Moreover, at least part of this functionality may be embodied in computer readable media (also referred to as computer program products), such as magnetic, magnetic-optical, and optical media, used in programming an information- processing apparams to perform in accordance with the invention. This functionality also may be embodied in computer readable media, or computer program products, such as a transmitted waveform to be used in transmitting the information or functionality.

Further, the present disclosure should make it clear to one skilled in the art that the present invention can be applied to a variety of different fields, applications, industries, and technologies. The present invention can be used, without limitation, with any powered system in which temperamre must either be monitored or controlled. This includes without limitation many different processes and applications involved in semiconductor fabrication, testing, and operation. Additionally, the preferred embodiment calculates, or monitors, the power which is supplied to a DUT from a power supply. This power is typically provided to a power plane or grid of some sort on the DUT, through one or more power connections in the DUT. This is to be differentiated from the power inherent in any signal. Clearly, any signal connection on a device is designed to receive the specified power of that signal, for example a clock signal. However, the power which the preferred embodiment monitors is the power provided from a power supply to the power connections, and not the power inherent in a signal which might be supplied to a signal connection. A power supply, as used above, refers to a standard industry device which can supply electrical power at a specified voltage for operating a device. It should be clear, however, that the techniques of the present invention could be applied to any signal, including without limitation a power signal, a clock signal, and a data signal. These techniques could also be applied to non-standard power supplies.

3. The Monitoring Circuit Summing Function

FIG. 2 is a block diagram illustrating the calculating function of the monitoring circuit 10 in an embodiment of the present invention where the electronic device is supplied power from a plurality of power devices 15. Each electrical connection 16 (not shown in FIG. 2, see FIG. 1A) sends current 210 and voltage signals 215 from its corresponding power supply 15 (not shown in FIG. 2, see FIG. 1A) to the monitor circuit 10. Each current and voltage signal 210, 215 passes through a respective first amplifier 220, where it is amplified and into a low pass filter 225 which removes wide-band noise and high frequency components of the signal. The current and voltage signals 210, 215 may be in the form of voltages representing the values of the respective current or voltage.

The thermal components of the system respond more slowly (e.g. milliseconds) than does the power supplied to the electronic device under test (e.g. nanoseconds). Accordingly, the high frequency components of the current and voltage signals 210, 215 add no value. Removing the high frequency components of the current and voltage signals 210, 215 matches the bandwidth of the current and voltage signals 210, 215 to the bandwidth of the rest of the control circuit and simplifies the task of stabilizing the temperamre control.

The current and voltage signals 210, 215 for a particular power supply then pass together into a first multiplying circuit 230, which uses the current and voltage signals 210, 215 to calculate power usage for that particular power supply.

For every power supply, the monitoring circuit 10 uses the following equation to calculate the power usage from the current and voltage signals 210, 215:

P = I * V (Eqn. 1) Where:

- P = power usage in watts - 1 = current signal in amps

- V = voltage signal in volts.

If the power supply 15 provides a voltage image of the current being drawn by the electromc device, then a scaling factor is required which describes the volts- to-amps relationship of the voltage image signal. If the electronic device is being tested, the scaling factor is derived from characteristics of the power supply to the automatic test equipment (also powering the electronic device under operation or test) being used to test the electronic device. For example, the scaling factor of Schlumberger's VHCDPS is 1.0, while the scaling factor of Schlumberger's HCDPS is 0.87. The scaling factor is made available to. the monitoring circuit to allow the conversion of the signal in volts to a corresponding current value in amps. The scaling factor can also be determined empirically with the formula:

Scaling factor = Signal Volts / Measured Amps.

This could be done by measuring the actual current and the signal voltage simultaneously, and then dividing the voltage by the measured amperage. Certain embodiments may also allow the setting of one or more specific current outputs and then measuring the signal voltage(s).

The output from all the first multiplying circuits 230 pass into a single summing circuit 235, which sums the power usage from all of the power supplies into the power usage signal 20. The power usage signal 20 may be in the form of a voltage representing that value and passes through a second amplifier 240 before leaving the monitoring circuit and going on to the thermal control circuit as the power usage signal 20.

4. The Thermal Control Circuit FIG. 3 is a block diagram illustrating the thermal control circuit of the present invention. The temperature of the electronic device being tested or under operation can be determined using the following equation:

Chip temperature = K^ * P_ed + T_fss (Eqn. 2)

Where:

- Chip temperamre (°C) represents the chip temperamre derived from its power dissipation.

- K_tn_eta is a constant (°C/watts) derived from the capabilities of the temperamre forcing system and the thermal resistance of the medium (or media, in those cases where heat spreaders, lids, or other devices are attached to the top of the device itself) between the electronic device and the heat exchanger.

- P_ed (watts) is the total power usage, reflected in the power usage signal 20 obtained from the monitoring circuit 10 (see FIG. 1A). - T_fss (°C) is the system surface forcing temperature and is the absolute temperamre of the medium contacting the chip, as measured by a temperamre sensor embedded in the thermal control system surface.

K_tπ-_tj is also derived from the general efficiency of the thermal control system when in contact with the DUT. For example, at setpoint temperamres well above ambient, the DUT loses proportionally more heat to its surroundings, and the thermal control system must work harder to raise DUT temperature than to lower it.

From the standpoint of a thermal control system responding to DUT self-heating, the overall effect is the same as a lower thermal resistance between the DUT and the heat exchanger operating at an ambient setpoint. Similarly, at setpoint temperatures well below ambient, the DUT gains heat from its surroundings, and the thermal control system must work harder to lower temperamre than to raise it. From the standpoint of a thermal control system responding to DUT self-heating, the overall effect is the same as a higher thermal resistance between the DUT and the heat exchanger operating at an ambient setpoint. In both cases, K^ is adjusted to reflect the effect of heat transfer to the DUT's surrounding environment during power excursions. K_tneta may be considered an effective or a fine-tuned thermal resistance of the medium. Although the thermal resistance of different media are set out in standard chemistry reference books (such as CRC Handbook of Chemistry and Physics, 77^th Edition; David R. Lide, Editor-in-Chief), factors such as ambient humidity, pressure, and temperamre may affect the acmal thermal resistance. Thermal resistance may also be affected by the physical configuration of the test. To determine K^ one can use a calibration process to adjust the value of the anticipated thermal resistance of the medium and ascertain whether the result is an improvement. Another advantage of a calibration process is that it will automatically account for the "efficiency factor" of the heat transfer from the DUT to the thermal control system as a function of the setpoint temperamre.

As described above, K^^ offers the advantage of incorporating the effects of a variety of variables into one term. In the preferred embodiment, K^ only needs to be optimized for a given application, or type of DUT, and then can be used to test many different devices of the same type. Additionally, one practical effect of K_ibea is that in mirroring the monitored power consumption of the device with the temperamre of the temperamre forcing system (see FIG. 7), K^ magnifies or compresses the relative magnitude of the mirroring.

In the thermal summing circuit 330, the temperamre control signal 35 is determined using the following equation:

V_tcs =d(Vsp - ((V,.^ * V_Ped) + (V_fsst - V_IR0)/V.j_pha))/dt (Eqn. 3)

Where:

- V_tcs is the temperamre control signal. - V_sp is a set point temperamre voltage 375, a voltage representing the set point temperamre for the electronic device.

- V^_ta is a voltage 315 representing the K^ value. The K^, value is inputted into a digital to analog converter, which generates a voltage corresponding to the value of the input. - V_Ped is the total power usage signal 20 obtained from the monitoring circuit 10 (see

FIG. 1A) and which represents the watts consumed by the DUT. - V_fsst is the forcing system surface temperature voltage 32 generated by digital to analog conversion and representing the forcing system surface temperamre.

- V_1R0 345 is a voltage generated by digital to analog conversion which represents a voltage equal to the value of the precise constant current from the first precise constant current source 28 in the thermal control board 27 multiplied by the resistance shown by the variable resistance device in the heat exchanger at 0 degrees C. This can be determined when the embedded temperature sensor in the heat exchanger is calibrated.

- V-j_pna 360 is a voltage generated by digital to analog conversion and represented the slope of a curve for the variable resistance device in the heat exchanger of resistance versus temperature. This can be determined when the embedded temperature sensor in the heat exchanger is calibrated.

Referring to FIG. 3, the power usage signal 20 from the monitoring circuit 10 (not shown in FIG. 3) enters the thermal control circuit 25 by passing through a third amplifier 310. From there, the power usage signal 20 passes into a second multiplying circuit 320 where it is multiplied with a V^_a 315 to create a first modified signal. The modified power usage signal then passes into a fourth amplifier 325 and from there into a thermal summing circuit 330. The voltage representing forcing system surface temperamre V_fsst 32 also enters the thermal control circuit 25 by passing through a fifth amplifier 335. From there, V_fsst 32 passes into a subtracting circuit 340 where V_1R0 345 is subtracted from V_fsst 32 for a calibrated V_fsst. The calibrated V_fsst passes through a sixth amplifier 350 and into a divisional circuit 355, where the calibrated V_fsst is divided by V-^ 360. A result representing (V_fsst -

passes through a seventh amplifier 365 and from there passes into the thermal summing circuit 330, and is summed there with the modified power usage signal to yield a summation. The summation passes into a difference circuit (or subtraction circuit) 375, which subtracts the summation from the set point temperamre voltage 370 to yield a resulting signal. This signal represents the instantaneous temperamre error.

The resulting signal passes into a derivative circuit 380 which takes the derivative of the resulting circuit with respect to time and smoothes it out. The derivative signal is amplified by a sixth amplifier 390 before leaving the thermal control circuit as the temperamre control signal V_tcs 35.

The derivative circuit 380 represents the overall control section of the thermal control circuit 25. This is where the circuit's response time to instantaneous signal level changes is determined. Although characterized by the derivative circuit 380, the control circuit 25 can be described as a PI style control loop because there is a proportional and integral gain stage in the control circuit 25.

Other embodiments may use true PID control by, for example, either designing a custom system or using an off the shelf commercial servo controller. Such a system adds capabilities like continuous ramping, s-curve profiling, servo tuning for minimal overshoot and undershoot, and improved closed-loop control stability. Depending upon the particular controller used, the PID controller may need to convert the temperature signals and the power signal to some sort of thermal position signal, and feed it back into a commercial servomotor controller. Some controllers may also need to do some conversion on the back end. As these examples indicate, the control functions required can be performed by analog and/or digital circuits.

5. Graphic Example FIG. 4 is a graph illustrating an example of the power following temperamre control of the present invention. The graph illustrates that the temperature of the electronic device 410 can be kept fairly constant even with wider swings in the amount of power 420 used by the electronic device.

6. Test Control and Temperamre Determination

As described in the disclosure, a control system maintains the DUT temperature at a specified set point within a given tolerance. The control system must therefore have some information on the DUT temperamre. Some control systems, such as direct temperamre following, require repeated DUT temperature information. Other control systems, such as power following, which control deviation from a set point, do not need repeated DUT temperamre information but only need to know when to begin the temperamre maintenance process. In one embodiment, the power following process begins after the DUT has reached the set point temperamre. This information may be determined indirectly, for example, after a soak timer has expired. It may also be determined directly, for example, by monitoring a thermal strucmre. Thermal strucmres can be used to supply initial DUT temperature information and they can also be monitored throughout the test if they are properly calibrated. One embodiment of the present invention monitors thermal strucmres to determine the initial DUT temperamre before initiating a power following temperamre control method.

Preferably, the characterization and validation process is performed for the power following temperature control of a particular type of DUT. This process utilizes die temperature information. If a statistically relevant sample set is taken with true die temperamre information during the calibration process, then no temperamre sensing device in the die is necessary during high volume manufacturing and testing. Embodiments of the present invention may include separate control sections to control the temperamre and to control the test sequence. Referring to FIG. 9, there is shown a generic high-level block diagram illustrating a test control system 130 and temperature control system 132, both of which are connected to and communicate with a DUT 134. This disclosure has been primarily concerned with describing the temperature control system 132. The test control system 130 would operate the appropriate tests on the DUT 134 while the temperature control system 132 controlled the DUT temperature.

These two control systems 130, 132 need to communicate or otherwise coordinate their activities. Either the temperamre control system 132 or the test control system 130 can monitor a thermal strucmre. In one embodiment of the present invention, the test control system 130 monitors the thermal strucmre of the DUT 134 and sends a signal, such as a scaled voltage, to the temperamre control system 132 indicating the DUT temperamre. FIG. 9 shows the communication path of such an embodiment with a dashed line between the test control system 130 and the temperamre control system 132. Embodiments of the control systems and their architecture may vary considerably. In one embodiment, the two control systems 130, 132 are separate and have no direct communication. Both control systems 130, 132 monitor the DUT 134 to gain the necessary DUT temperamre information in order to coordinate their activities. In a second embodiment, the two control systems 130, 132 are fully integrated.

7. Data Acquisition

The information which the above-described power following system utilizes is information on the power draw of a DUT. In one described embodiment, this information is the scaled voltage image of current and voltage signals, as depicted in FIG. 1A. These signals are supplied by the power supply(s) 15 of FIG. 1A. This information can also be made available for other purposes, with a data generation system. Such a data generation system may display the power information such as with plots or graphs, perform calculations based on it for a variety of applications, monitor performance or efficiency, and store the data, to name a few of the possibilities. Various data generation systems are shown in FIGS. lOA-lOC. Referring to FIG. 10A, there is shown a power supply 15 supplying power to a DUT 134. The power supply is preferably a programmable power supply. There is also shown a data acquisition card 136, more generally referred to as a data acquisition device, which receives power information, such as the scaled voltage images of the current and voltage signals from the power supply 15. In certain embodiments, the data acquisition card 136 can receive the same information that the monitoring circuit 10 of FIG. 1A receives. That signal (connecting the power supply 15 to the monitoring circuit 10 through connection 16, in FIG. 1A) can be supplied to the data acquisition card 136 in a variety of methods known in the industry, including without limitation, splitting the line, or daisy-chaining the data acquisition card 136 to the monitoring circuit 10.

Referring to FIG. 10C, the monitoring circuit 10 is preferably disposed between the power supply 15 and the data acquisition card 136. The data acquisition card 136 then receives the power use signal 20 from the monitoring circuit 10. In this embodiment, the data acquisition card 136 acquires the power use signal 20 directly instead of having to either perform the calculations itself or rely on another device or processor to perform them. Various power usage signals 20, scaled voltage images of the power, are depicted in FIG. 4 (Chip Power), FIG. 5 (Acmal Pwr), FIG. 6 (Power Mon), and FIG. 7 (Power to DUT). In these figures, the signals were acquired by data acquisition cards 136.

The data acquisition card 136 may utilize analog and/or digital circuitry. Preferably the data acquisition card 136 contains an analog-to-digital converter with multiple channels. One embodiment uses an off-the-shelf board, model number

PCI-6031E made by National Instruments, for the data acquisition card 136.

The data acquisition card 136 may also perform a variety of control functions, such as setting the sampling rate and other parameters. In a preferred embodiment, however, the data acquisition card 136 sends the data to another controller. In each of FIGS. 10B and IOC, there is shown a general purpose personal computer ("PC") 138 which serves as the controller and sets a variety of values on the data acquisition card 136. In one embodiment, the PC 138 receives digitized data from the data acquisition card 136 and the PC 138 can then perform a variety of services and functions with the data. In one embodiment, the data can be stored on a digital storage medium such as, for example, a hard disk, floppy disk, optical disk, ZIP disk, or Bernoulli drive. The data can also be transmitted, displayed on a display device such as a computer screen, or processed. Other embodiments may also encompass additional processors or equipment, including analog equipment, which utilize the data. Preferably, the PC 138 includes a Pentium processor and uses the Windows

NT operating system. Various communications cards and protocols can be used between the PC 138 and the data acquisition card 136, including without limitation, a universal asynchronous receiver transmitter ("UART"), a universal receiver transmitter ("URT"), and the RS-232 standard. In a preferred embodiment, the data acquisition card 136 also acquires various other information, including without limitation, DUT temperature information, heat exchanger power information, coolant flow rates, and fluid inlet and outlet temperamres.

8. Temperature Control Unit

FIG. 11 shows a general diagram of a system 110 according to the present invention. As shown, the user operates the system 110 at the operator interface panel 112. The operator interface panel 112 serves as an interface to the system controller 114. The system controller 114 is housed in the thermal control chassis 116 and controls the heat exchanger 120 and the liquid cooling and recirculation system 122. The heat exchanger 120 preferably includes a heater and a heat sink. Other heat exchangers are possible, however. The heat sink preferably contains a chamber through which the liquid is pumped. Other heat sinks are also possible. Heat sinks, or heat sink systems, with no liquid are also viable if the thermal conductivity is high enough. In particular, solid heat sinks such as Peltier devices are known in the art which use electrical signals through the material to control temperature and temperamre gradients. A heat sink may also be equivalently referred to as a heat transfer unit, thus focusing attention on the fact that the heat sink may also act as a heat source.

The heater of the heat exchanger 120 is preferably a three layer co-fired aluminum nitride heater substrate with a heater trace between the first two layers and the RTD trace between the last two layers. The heater trace provides the heating and the RTD trace provides temperature information. The two traces are electrically isolated while being at essentially the same thermal position due to the thermal conductivity of the aluminum nitride layers. In discussing the temperature of a heater, or heat sink or other device, it is to be understood that the temperamre of a single point on the device is being discussed. This follows from the fact that a typical heater, or heat sink or other device, will have a temperamre gradient across the surface. In the case of a heater, the existence of a gradient is due, in part, to the fact that the heating element usually occupies only a portion of the heater.

The liquid cooling and recirculation system 122 supplies a liquid to the heat exchanger 120, specifically to the heat sink, through the boom arm 118. The boom arm 118 also carries the control signals from the system controller 114 to the heater.

A test head 121 is adapted to be positioned under the heat exchanger 120. The test head 121 preferably contains a test socket which is used for mating with a device under test ("DUT") such as a chip. Testing of the DUT can then be performed through the test head 121 and the temperature of the DUT can also be regulated during the testing. During temperature regulation the DUT is preferably in conductive contact with the heat exchanger 120.

9. Modifications and Benefits Embodiments of the present invention can include a time delay or filtering on the power usage signal 20, or elsewhere, to adjust the effect of power compensation with respect to time. This might be used, for example, to offset the effects of a big ceramic substrate or other large thermal heat sink, or to average out the effects of a high frequency power signal without eliminating them. A time delay or filter would become more important as testers and microprocessors become faster.

Other embodiments may also compensate for large bypass capacitance on a tester interface board or a DUT itself. Bypass capacitance is used to supply instantaneous charge which the power supply cannot replenish fast enough, due to inductive loading or physical distance. As the bypass capacitance increases, the time between the power supply signal and the DUT self-heating will decrease.

While the embodiment described above uses analog design techniques, a digital signal processor and software could be used in an alternative embodiment of the invention to effect this digitally.

The benefits of the present invention include providing an apparatus and method of temperamre control for electronic devices which can respond to the temperamre of the electronic device, instead of the package. A further benefit of the present invention is that it provides an apparams and method of temperamre control for electronic devices which can conveniently be used for high volume chip manufacturing. A further benefit of the present invention is that it provides an apparams and method of temperamre control for electronic devices which is reliable.

A further benefit of the present invention is that it provides an apparams and method of temperamre control for electronic device which does not require significant surface area of the electronic device for sensing the device temperature, although the system does require surface area for conduction. Another benefit of the present invention is that it eliminates the need for temperature sensing devices to be integrated into the chip or to be temporarily connected to the chip. Yet another benefit is that the present invention also eliminates the need to collect, maintain, and apply the use of chip power profiles, as well as eliminating the need for the capability in the automated test equipment, temperamre forcing system and testing software to collect and apply chip power profiles. The principles, preferred embodiments, and modes of operation of the present invention have been described in the foregoing specification. The invention is not to be construed as limited to the particular forms disclosed, because these are regarded as illustrative rather than restrictive. Moreover, variations and changes may be made by those of ordinary skill in the art without departing from the spirit and scope of the invention.

Claims

What is claimed is:

1. A method for controlling a temperamre of a device, the method comprising: measuring a parameter other than the temperamre of the device, wherein the parameter is related to power consumption by the device, the relevant power consumption being the power which is consumed by the device through power connections as opposed to signal connections; and utilizing the measured parameter in controlling the temperamre of the device, wherein the measuring of the parameter and the controlling of the temperamre occur contemporaneously .

2. The method of claim 1, wherein measuring the parameter related to power consumption by the device comprises monitoring at least a partial power usage of the device.

3. The method of claim 1, wherein measuring the parameter related to power consumption by the device comprises monitoring a power supply which supplies power to the device and measuring a voltage and a current from the power supply.

4. The method of claim 1, wherein measuring the parameter related to power consumption by the device comprises monitoring a change in instantaneous power consumption of the device.

5. The method of claim 2, wherein monitoring the at least a partial power usage of the device comprises monitoring a complete power usage of the device, and wherein the monitored complete power usage is utilized in controlling the temperamre of the device.

6. The method of claim 1, wherein measuring the parameter related to power consumption by the device comprises: producing a signal representing a first current usage of the device; producing a signal representing a first voltage corresponding to the first current usage of the device; and multiplying the signal representing the first current usage with the signal representing the first voltage to produce a signal representing a first power usage of the device.

7. The method of claim 6, wherein measuring the parameter related to power consumption by the device further comprises: producing a signal representing a second current usage of the device; producing a signal representing a second voltage corresponding to the second current usage of the device; multiplying the signal representing a second current usage with the signal representing a second voltage to produce a signal representing a second power usage of the device; and adding the signal representing a first power usage of the device to the signal representing a second power usage of the device to produce a signal representing a summed power usage of the device.

8. The method of claim 1, wherein controlling the temperature of the device based on the measured parameter related to power consumption by the device comprises: utilizing a temperature forcing system; and controlling the setting of the temperature forcing system based, at least in part, on the measured parameter related to power consumption by the device.

9. The method of claim 8, wherein controlling the setting of the temperamre forcing system comprises using a first equation for substantially deterrnining the temperamre of the device, and wherein the first equation is: the temperamre of the device = K_thm * P_ed + T_fs.

10. The method of claim 9, wherein controlling the setting of the temperamre forcing system further comprises using a second equation for producing a signal used to control the temperamre forcing system, and wherein the second equation is:

V_tcs =d(Vsp - ((V_k._meta * V^) + (V_fsst - V_IR0)/V_alpha))/dt, and wherein V_tcs is the signal used to control the temperamre forcing system.

11. The method of claim 6, wherein measuring the parameter related to power consumption by the device further comprises: processing the signal representing the first current usage of the device; processing the signal representing the first voltage corresponding to the first current usage of the device; and wherein both signals are processed before being multiplied together.

12. The method of claim 8, wherein controlling the setting of the temperature forcing system comprises using an analog circuit.

13. The method of claim 8, wherein controlling the setting of the temperature forcing system comprises performing PID control.

14. A method for calculating a real time temperamre of a device, the method comprising: measuring a real time power usage of the device, the power usage relating to power which is used by the device through one or more power connections as opposed to signal connections; and using the measured real time power usage of the device in determining a figure which can be used for the real time temperamre of the device.

15. The method of claim 14, wherein measuring the real time power usage of the device comprises measuring a complete power usage.

16. A method for controlling a temperamre of a device, in a system containing a temperamre forcing system coupled to the device, the method comprising: monitoring a power consumption of the device, the power consumption relating to power which is supplied to the device by one or more power supplies; and adjusting a temperature of the temperature forcing system based in part on the monitored power consumption of the device; and controlling the device temperature with the temperamre forcing system.

17. The method of claim 16, wherein monitoring the power consumption of the device comprises monitoring a complete power consumption of the device.

18. The method of claim 16, wherein adjusting the temperamre of the temperature forcing system comprises mirroring the momtored power consumption of the device with the temperature of the temperature forcing system.

19. A system for controlling a temperamre of a device, the system comprising: a measuring device for measuring a parameter other than the temperature of the device, wherein the parameter is related to power consumption by the device, the relevant power consumption being the power which is consumed by the device through power connections as opposed to signal connections; a heat exchanger adapted to be coupled to the device; and a thermal controller for determining a setting of the heat exchanger, wherein the setting is determined in part by using the measured parameter related to power consumption by the device, wherein the thermal controller is coupled to the measuring device and operates contemporaneously with it.

20. The system of claim 19, wherein the measuring device for measuring a parameter related to power consumption by the device comprises a monitor for monitoring power usage of the device.

21. The system of claim 20, wherein the monitor monitors complete power usage and the parameter related to power consumption by the device comprises the complete power usage.

22. The system of claim 19, wherein: the measuring device comprises: at least one current measuring device for monitoring the current supplied to the device by one or more power supplies; at least one voltage measuring device for monitoring the voltage supplied to the device by one or more power supplies; and a monitoring circuit, coupled to the at least one current measuring device and to the at least one voltage measuring device, for producing a power usage signal from the monitored current and voltage; and the thermal controller for determining a setting of the heat exchanger comprises a thermal control circuit which utilizes the following equation for estimating the temperamre of the device: the temperamre of the device = K^_a * P_ed + T_fs, wherein P^ is the produced power usage signal.

23. A system for controlling a temperature of a device, the system comprising: means for measuring a parameter other than the temperamre of the device, wherein the parameter is related to power consumption by the device, the relevant power consumption being the power which is consumed by the device through power connections as opposed to signal connections; and means for controlling the temperamre of the device based in part on the measured parameter related to power consumption by the device, wherein the measuring a parameter related to power consumption by the device and the controlling the temperamre of the device occur contemporaneously.

24. A data generation system for use with a semiconductor device under test, the system comprising: a programmable power supply for supplying power to the semiconductor device under test, and for supplying a data signal which contains information on the power being used by the semiconductor device under test; and a data acquisition device, coupled to the programmable power supply, for acquiring data on the power being used by the semiconductor device under test by receiving the data signal from the programmable power supply.

25. The data generation system of claim 24, further comprising a monitoring circuit disposed between the programmable power supply and the data acquisition device, wherein the monitoring circuit is adapted to receive the data signal from the programmable power supply and to supply a power usage signal to the data acquisition device, and wherein the device under test is an integrated circuit.

26. The data generation system of claim 24, further comprising a computer, communicatively coupled to the data acquisition device, including a digital storage medium and a display device, wherein the computer is adapted to receive a digital power usage signal from the data acquisition device, to store information from the digital power use signal on the digital storage medium, and to display information from the digital power usage signal on the display device.

27. A method of data generation for use with a semiconductor device under test, the method comprising: continuously supplying a data signal, from a programmable power supply, wherein the data signal contains real-time information on the power being supplied by the programmable power supply to the semiconductor device under test; and continuously receiving the data signal, from the programmable power supply, at a data acquisition device.

28. The method of claim 27, wherein the power use signal is an analog signal and the method further comprises: processing the continuously received data signal, before it is received at the data acquisition device, to produce a power signal which indicates the power being used by the semiconductor device under test; supplying the power signal to the data acquisition device; sampling the power signal by the data acquisition device; and providing the sampled power signal from the data acquisition device to a computer.

29. A temperamre control system for use with a semiconductor device during testing, the temperature control system comprising: a measuring device for measuring a parameter other than the temperamre of the semiconductor device, wherein the parameter is related to power consumption by the semiconductor device during testing, the relevant power consumption being the power which is consumed by the semiconductor device through power connections as opposed to signal connections; a heat exchanger adapted to be coupled to the semiconductor device; a thermal controller for determining a setting of the heat exchanger, wherein the setting is determined in part by using the measured parameter related to power consumption by the device, wherein the thermal controller is coupled to the measuring device and operates contemporaneously in time with it; and a test head for holding the semiconductor device during testing, wherein the test head allows testing of the semiconductor device while the semiconductor device is in conductive contact with the heat exchanger and the setting of the heat exchanger is determined by the thermal controller.

30. The temperamre control system of claim 29, wherein the thermal controller is adapted to control the heat exchanger such that the heat exchanger maintains the semiconductor device at or near a first temperature during a first test of the semiconductor device and then maintains the semiconductor device at or near a second temperamre during a second test of the semiconductor device.