DE19983379T1 - Temperaturregelung elektronischer Bauelemente unter Verwendung von Leistungsfolgerückkopplung - Google Patents

Temperaturregelung elektronischer Bauelemente unter Verwendung von Leistungsfolgerückkopplung

Info

Publication number
DE19983379T1
DE19983379T1 DE19983379T DE19983379T DE19983379T1 DE 19983379 T1 DE19983379 T1 DE 19983379T1 DE 19983379 T DE19983379 T DE 19983379T DE 19983379 T DE19983379 T DE 19983379T DE 19983379 T1 DE19983379 T1 DE 19983379T1
Authority
DE
Germany
Prior art keywords
temperature control
electronic components
power sequence
sequence feedback
feedback
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19983379T
Other languages
English (en)
Other versions
DE19983379B4 (de
Inventor
Thomas P Jones
Jonathan E Turner
Mark F Malinoski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Design Inc
Original Assignee
Schlumberger Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger Technologies Inc filed Critical Schlumberger Technologies Inc
Publication of DE19983379T1 publication Critical patent/DE19983379T1/de
Application granted granted Critical
Publication of DE19983379B4 publication Critical patent/DE19983379B4/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G05D23/24—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Control Of Temperature (AREA)
DE19983379T 1998-07-14 1999-07-14 Temperaturregelung elektronischer Bauelemente unter Verwendung von Leistungsfolgerückkopplung Expired - Lifetime DE19983379B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9272098P 1998-07-14 1998-07-14
US60/092,720 1998-07-14
PCT/US1999/015846 WO2000004582A1 (en) 1998-07-14 1999-07-14 Temperature control of electronic devices using power following feedback

Publications (2)

Publication Number Publication Date
DE19983379T1 true DE19983379T1 (de) 2001-09-13
DE19983379B4 DE19983379B4 (de) 2011-08-18

Family

ID=22234752

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19983379T Expired - Lifetime DE19983379B4 (de) 1998-07-14 1999-07-14 Temperaturregelung elektronischer Bauelemente unter Verwendung von Leistungsfolgerückkopplung

Country Status (5)

Country Link
JP (1) JP4703850B2 (de)
KR (1) KR100755295B1 (de)
AU (1) AU4991799A (de)
DE (1) DE19983379B4 (de)
WO (1) WO2000004582A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10203790A1 (de) * 2002-01-31 2003-06-26 Siemens Ag Aktive Stabilisierung des Temperaturniveaus in Halbleiterbauelementen
US7271604B2 (en) 2005-01-10 2007-09-18 Erich Reitinger Method and apparatus for testing semiconductor wafers by means of a temperature-regulated chuck device

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6794620B1 (en) * 2001-11-07 2004-09-21 Advanced Micro Devices, Inc. Feedforward temperature control of device under test
US6825681B2 (en) 2002-07-19 2004-11-30 Delta Design, Inc. Thermal control of a DUT using a thermal control substrate
US7313500B2 (en) 2004-11-05 2007-12-25 Schweitzer Engineering Labortories, Inc. Method to increase the maximum allowable ambient temperature rating of an electronic device
US9570643B2 (en) 2013-10-28 2017-02-14 General Electric Company System and method for enhanced convection cooling of temperature-dependent power producing and power consuming electrical devices
US10514416B2 (en) 2017-09-29 2019-12-24 Advantest Corporation Electronic component handling apparatus and electronic component testing apparatus
CN109932630B (zh) * 2017-12-15 2021-08-03 朋程科技股份有限公司 过温度检测电路及其测试方法
JP7266481B2 (ja) * 2019-07-19 2023-04-28 東京エレクトロン株式会社 温度制御装置、温度制御方法、および検査装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330809A (en) * 1979-12-31 1982-05-18 Crown International, Inc. Thermal protection circuit for the die of a transistor
US4637020A (en) * 1983-08-01 1987-01-13 Fairchild Semiconductor Corporation Method and apparatus for monitoring automated testing of electronic circuits
US4686627A (en) * 1984-12-24 1987-08-11 Honeywell Inc. Electrical test apparatus
DE3683284D1 (de) * 1985-09-23 1992-02-13 Sharetree Systems Ltd Ofen zum einbrennen integrierter schaltungen.
DE3536098A1 (de) * 1985-10-09 1987-04-09 Siemens Ag Einrichtung zum ueberwachen der temperatur eines elektrischen bauelements
US4713612A (en) * 1986-07-14 1987-12-15 Hughes Aircraft Company Method and apparatus for determination of junction-to-case thermal resistance for a hybrid circuit element
US5324916A (en) * 1991-11-01 1994-06-28 Hewlett-Packard Company System and method for dynamic power compensation
US5287292A (en) * 1992-10-16 1994-02-15 Picopower Technology, Inc. Heat regulator for integrated circuits
JPH07263526A (ja) * 1994-03-17 1995-10-13 Hitachi Ltd ウェハチャックおよび半導体素子の冷却方法
JP2986381B2 (ja) * 1994-08-16 1999-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 電子チップ温度制御装置及び方法
JPH09264647A (ja) * 1996-03-27 1997-10-07 Nec Corp 電子機器冷却回路
US6476627B1 (en) * 1996-10-21 2002-11-05 Delta Design, Inc. Method and apparatus for temperature control of a device during testing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10203790A1 (de) * 2002-01-31 2003-06-26 Siemens Ag Aktive Stabilisierung des Temperaturniveaus in Halbleiterbauelementen
US7271604B2 (en) 2005-01-10 2007-09-18 Erich Reitinger Method and apparatus for testing semiconductor wafers by means of a temperature-regulated chuck device

Also Published As

Publication number Publication date
DE19983379B4 (de) 2011-08-18
WO2000004582A1 (en) 2000-01-27
WO2000004582A8 (en) 2000-05-18
AU4991799A (en) 2000-02-07
JP2002520630A (ja) 2002-07-09
KR100755295B1 (ko) 2007-09-05
JP4703850B2 (ja) 2011-06-15
WO2000004582A9 (en) 2000-07-20
KR20010071917A (ko) 2001-07-31

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Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: DELTA DESIGN,INC., POWAY, CALIF., US

8110 Request for examination paragraph 44
R018 Grant decision by examination section/examining division
R020 Patent grant now final

Effective date: 20111119

R071 Expiry of right