JP4703850B2 - 電力追従帰還作用を利用した電子装置の温度制御 - Google Patents

電力追従帰還作用を利用した電子装置の温度制御 Download PDF

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Publication number
JP4703850B2
JP4703850B2 JP2000560611A JP2000560611A JP4703850B2 JP 4703850 B2 JP4703850 B2 JP 4703850B2 JP 2000560611 A JP2000560611 A JP 2000560611A JP 2000560611 A JP2000560611 A JP 2000560611A JP 4703850 B2 JP4703850 B2 JP 4703850B2
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Prior art keywords
temperature
temperature control
heat exchanger
power consumption
control method
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JP2000560611A
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Japanese (ja)
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JP2002520630A5 (enExample
JP2002520630A (ja
Inventor
トーマス・ピー・ジョーンズ
ジョナサン・イー・ターナー
マーク・エフ・マリノスキ
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Delta Design Inc
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Delta Design Inc
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G05D23/24—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Control Of Temperature (AREA)
JP2000560611A 1998-07-14 1999-07-14 電力追従帰還作用を利用した電子装置の温度制御 Expired - Lifetime JP4703850B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9272098P 1998-07-14 1998-07-14
US60/092,720 1998-07-14
PCT/US1999/015846 WO2000004582A1 (en) 1998-07-14 1999-07-14 Temperature control of electronic devices using power following feedback

Publications (3)

Publication Number Publication Date
JP2002520630A JP2002520630A (ja) 2002-07-09
JP2002520630A5 JP2002520630A5 (enExample) 2010-03-18
JP4703850B2 true JP4703850B2 (ja) 2011-06-15

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ID=22234752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000560611A Expired - Lifetime JP4703850B2 (ja) 1998-07-14 1999-07-14 電力追従帰還作用を利用した電子装置の温度制御

Country Status (5)

Country Link
JP (1) JP4703850B2 (enExample)
KR (1) KR100755295B1 (enExample)
AU (1) AU4991799A (enExample)
DE (1) DE19983379B4 (enExample)
WO (1) WO2000004582A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021014724A1 (ja) * 2019-07-19 2021-01-28 東京エレクトロン株式会社 温度制御装置、温度制御方法、および検査装置
WO2025191634A1 (ja) * 2024-03-11 2025-09-18 株式会社日立ハイテク プラズマ処理装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6794620B1 (en) * 2001-11-07 2004-09-21 Advanced Micro Devices, Inc. Feedforward temperature control of device under test
DE10203790A1 (de) * 2002-01-31 2003-06-26 Siemens Ag Aktive Stabilisierung des Temperaturniveaus in Halbleiterbauelementen
US6825681B2 (en) 2002-07-19 2004-11-30 Delta Design, Inc. Thermal control of a DUT using a thermal control substrate
US7313500B2 (en) 2004-11-05 2007-12-25 Schweitzer Engineering Labortories, Inc. Method to increase the maximum allowable ambient temperature rating of an electronic device
DE102005001163B3 (de) 2005-01-10 2006-05-18 Erich Reitinger Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer temperierbaren Aufspanneinrichtung
US9570643B2 (en) 2013-10-28 2017-02-14 General Electric Company System and method for enhanced convection cooling of temperature-dependent power producing and power consuming electrical devices
KR102269440B1 (ko) 2016-06-15 2021-06-25 와틀로 일렉트릭 매뉴팩츄어링 컴파니 열시스템용 전력 변환기
US10514416B2 (en) 2017-09-29 2019-12-24 Advantest Corporation Electronic component handling apparatus and electronic component testing apparatus
CN109932630B (zh) * 2017-12-15 2021-08-03 朋程科技股份有限公司 过温度检测电路及其测试方法
JP7534047B2 (ja) * 2020-12-07 2024-08-14 東京エレクトロン株式会社 検査装置の制御方法及び検査装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330809A (en) * 1979-12-31 1982-05-18 Crown International, Inc. Thermal protection circuit for the die of a transistor
US4637020A (en) * 1983-08-01 1987-01-13 Fairchild Semiconductor Corporation Method and apparatus for monitoring automated testing of electronic circuits
US4686627A (en) * 1984-12-24 1987-08-11 Honeywell Inc. Electrical test apparatus
WO1987001813A1 (en) * 1985-09-23 1987-03-26 Sharetree Limited An oven for the burn-in of integrated circuits
DE3536098A1 (de) * 1985-10-09 1987-04-09 Siemens Ag Einrichtung zum ueberwachen der temperatur eines elektrischen bauelements
US4713612A (en) * 1986-07-14 1987-12-15 Hughes Aircraft Company Method and apparatus for determination of junction-to-case thermal resistance for a hybrid circuit element
US5324916A (en) * 1991-11-01 1994-06-28 Hewlett-Packard Company System and method for dynamic power compensation
US5287292A (en) * 1992-10-16 1994-02-15 Picopower Technology, Inc. Heat regulator for integrated circuits
JPH07263526A (ja) * 1994-03-17 1995-10-13 Hitachi Ltd ウェハチャックおよび半導体素子の冷却方法
JP2986381B2 (ja) * 1994-08-16 1999-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 電子チップ温度制御装置及び方法
JPH09264647A (ja) * 1996-03-27 1997-10-07 Nec Corp 電子機器冷却回路
US6476627B1 (en) * 1996-10-21 2002-11-05 Delta Design, Inc. Method and apparatus for temperature control of a device during testing

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021014724A1 (ja) * 2019-07-19 2021-01-28 東京エレクトロン株式会社 温度制御装置、温度制御方法、および検査装置
JP2021019066A (ja) * 2019-07-19 2021-02-15 東京エレクトロン株式会社 温度制御装置、温度制御方法、および検査装置
KR20220034173A (ko) * 2019-07-19 2022-03-17 도쿄엘렉트론가부시키가이샤 온도 제어 장치, 온도 제어 방법, 및 검사 장치
JP7266481B2 (ja) 2019-07-19 2023-04-28 東京エレクトロン株式会社 温度制御装置、温度制御方法、および検査装置
TWI843870B (zh) * 2019-07-19 2024-06-01 日商東京威力科創股份有限公司 溫度控制裝置、溫度控制方法及檢查裝置
KR102703947B1 (ko) * 2019-07-19 2024-09-05 도쿄엘렉트론가부시키가이샤 온도 제어 장치, 온도 제어 방법, 및 검사 장치
WO2025191634A1 (ja) * 2024-03-11 2025-09-18 株式会社日立ハイテク プラズマ処理装置

Also Published As

Publication number Publication date
KR100755295B1 (ko) 2007-09-05
WO2000004582A9 (en) 2000-07-20
DE19983379B4 (de) 2011-08-18
WO2000004582A8 (en) 2000-05-18
JP2002520630A (ja) 2002-07-09
DE19983379T1 (de) 2001-09-13
AU4991799A (en) 2000-02-07
KR20010071917A (ko) 2001-07-31
WO2000004582A1 (en) 2000-01-27

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