KR100742521B1 - 베어 실리콘 칩을 기판상에 실장한 회로 기판의 열 방산 - Google Patents

베어 실리콘 칩을 기판상에 실장한 회로 기판의 열 방산 Download PDF

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Publication number
KR100742521B1
KR100742521B1 KR1020017013327A KR20017013327A KR100742521B1 KR 100742521 B1 KR100742521 B1 KR 100742521B1 KR 1020017013327 A KR1020017013327 A KR 1020017013327A KR 20017013327 A KR20017013327 A KR 20017013327A KR 100742521 B1 KR100742521 B1 KR 100742521B1
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South Korea
Prior art keywords
pad
gel composition
composition
gel
circuit board
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Expired - Fee Related
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KR1020017013327A
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English (en)
Korean (ko)
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KR20020005694A (ko
Inventor
폴 지. 쇼엔스타인
벤자민 엘. 시틀러
로버트 에이치. 레미
크리스틴 이. 보그데스
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다우 코닝 코포레이션
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Publication of KR20020005694A publication Critical patent/KR20020005694A/ko
Application granted granted Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
KR1020017013327A 1999-04-20 2000-04-19 베어 실리콘 칩을 기판상에 실장한 회로 기판의 열 방산 Expired - Fee Related KR100742521B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/295,081 US6162663A (en) 1999-04-20 1999-04-20 Dissipation of heat from a circuit board having bare silicon chips mounted thereon
US09/295,081 1999-04-20

Publications (2)

Publication Number Publication Date
KR20020005694A KR20020005694A (ko) 2002-01-17
KR100742521B1 true KR100742521B1 (ko) 2007-08-02

Family

ID=23136132

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020017013327A Expired - Fee Related KR100742521B1 (ko) 1999-04-20 2000-04-19 베어 실리콘 칩을 기판상에 실장한 회로 기판의 열 방산

Country Status (9)

Country Link
US (1) US6162663A (https=)
EP (1) EP1171914B1 (https=)
JP (2) JP5084987B2 (https=)
KR (1) KR100742521B1 (https=)
AT (1) ATE337614T1 (https=)
DE (1) DE60030267T2 (https=)
MX (1) MXPA01010665A (https=)
TW (1) TW549011B (https=)
WO (1) WO2000063968A1 (https=)

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US6794030B1 (en) 1999-11-30 2004-09-21 3M Innovative Properties Company Heat conductive sheet and method of producing the sheet
US6673434B2 (en) 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
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US6469379B1 (en) 2001-03-30 2002-10-22 Intel Corporation Chain extension for thermal materials
JP4796704B2 (ja) * 2001-03-30 2011-10-19 株式会社タイカ 押出可能な架橋済グリース状放熱材を充填・封入した容器の製法
JP4054986B2 (ja) 2001-04-23 2008-03-05 信越化学工業株式会社 放熱部材
US6617683B2 (en) * 2001-09-28 2003-09-09 Intel Corporation Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material
US6597575B1 (en) 2002-01-04 2003-07-22 Intel Corporation Electronic packages having good reliability comprising low modulus thermal interface materials
US7208192B2 (en) 2002-05-31 2007-04-24 Parker-Hannifin Corporation Thermally or electrically-conductive form-in-place gap filter
US6992893B2 (en) * 2003-01-10 2006-01-31 Hewlett-Packard Development Company, L.P. Heat sink attachment
US8119191B2 (en) 2003-01-16 2012-02-21 Parker-Hannifin Corporation Dispensable cured resin
US6921974B2 (en) * 2003-03-28 2005-07-26 United Test & Assembly Center Ltd. Packaged device with thermal enhancement and method of packaging
JP4334542B2 (ja) * 2003-08-28 2009-09-30 富士通株式会社 パッケージ構造
US20060237168A1 (en) * 2005-04-21 2006-10-26 Belady Christian L Air mover with thermally coupled guide vanes
US7447019B2 (en) * 2005-10-31 2008-11-04 Hewlett-Packard Development Company, L.P. Computer having an axial duct fan
US7326032B2 (en) * 2005-10-31 2008-02-05 Hewlett-Packard Development Company, L.P. Cooling fan with adjustable tip clearance
US7443671B2 (en) * 2005-10-31 2008-10-28 Hewlett-Packard Development Company, L.P. Axial duct cooling fan
US7558061B2 (en) * 2006-08-04 2009-07-07 Hewlett-Packard Development Company, L.P. Cooling fan module
US20080067669A1 (en) * 2006-09-18 2008-03-20 Buttel Nicole A Systems, devices and methods for controlling thermal interface thickness in a semiconductor die package
US20080068803A1 (en) * 2006-09-18 2008-03-20 Shyh-Ming Chen Heat dissipating device holder structure with a thin film thermal conducting medium coating
US8545987B2 (en) * 2007-11-05 2013-10-01 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US8445102B2 (en) * 2007-11-05 2013-05-21 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US9795059B2 (en) 2007-11-05 2017-10-17 Laird Technologies, Inc. Thermal interface materials with thin film or metallization
US8076773B2 (en) * 2007-12-26 2011-12-13 The Bergquist Company Thermal interface with non-tacky surface
US20090208722A1 (en) * 2008-02-18 2009-08-20 John Francis Timmerman Oriented Members for Thermally Conductive Interface Structures
CA2770719C (en) 2009-08-12 2017-12-12 Jonathan Bergin Fully-cured thermally or electrically-conductive form-in-place gap filler
CN104136569A (zh) * 2012-03-02 2014-11-05 富士高分子工业株式会社 油灰状传热材料及其制造方法
JPWO2014136503A1 (ja) * 2013-03-07 2017-02-09 日産自動車株式会社 回転電機
US20150092352A1 (en) * 2013-09-29 2015-04-02 International Business Machines Corporation Thermal Interface Solution With Reduced Adhesion Force
US11121125B2 (en) 2018-12-12 2021-09-14 Micron Technology, Inc. Thermal chamber for a thermal control component
USD893484S1 (en) 2018-12-12 2020-08-18 Micron Technology, Inc. Thermal control component
TWI896542B (zh) 2019-07-23 2025-09-11 德商漢高股份有限及兩合公司 高熱通量多元件總成之熱管理
US11334129B2 (en) * 2019-12-11 2022-05-17 Micron Technology, Inc. Temperature control component for electronic systems
US11493550B2 (en) 2019-12-11 2022-11-08 Micron Technology, Inc. Standalone thermal chamber for a temperature control component
WO2022113921A1 (ja) * 2020-11-25 2022-06-02 信越化学工業株式会社 半導体パッケージ及びその製造方法
EP4301805A1 (en) 2021-03-04 2024-01-10 Momentive Performance Materials Inc. Thermal gel composition

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US5604978A (en) * 1994-12-05 1997-02-25 International Business Machines Corporation Method for cooling of chips using a plurality of materials
US5741579A (en) * 1995-04-28 1998-04-21 Shin-Etsu Polymer Co., Ltd. Heat-conductive sheet

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EP0453764A1 (en) * 1990-04-27 1991-10-30 International Business Machines Corporation Thermal joint
US5604978A (en) * 1994-12-05 1997-02-25 International Business Machines Corporation Method for cooling of chips using a plurality of materials
US5741579A (en) * 1995-04-28 1998-04-21 Shin-Etsu Polymer Co., Ltd. Heat-conductive sheet

Also Published As

Publication number Publication date
DE60030267D1 (de) 2006-10-05
JP5084987B2 (ja) 2012-11-28
ATE337614T1 (de) 2006-09-15
KR20020005694A (ko) 2002-01-17
JP2002542626A (ja) 2002-12-10
EP1171914A1 (en) 2002-01-16
JP2012054578A (ja) 2012-03-15
EP1171914B1 (en) 2006-08-23
TW549011B (en) 2003-08-21
WO2000063968A1 (en) 2000-10-26
MXPA01010665A (es) 2002-07-02
DE60030267T2 (de) 2007-07-05
US6162663A (en) 2000-12-19

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