DE60030267T2 - Wärmeableitung von einer leiterplatte mit blossen chips - Google Patents

Wärmeableitung von einer leiterplatte mit blossen chips Download PDF

Info

Publication number
DE60030267T2
DE60030267T2 DE60030267T DE60030267T DE60030267T2 DE 60030267 T2 DE60030267 T2 DE 60030267T2 DE 60030267 T DE60030267 T DE 60030267T DE 60030267 T DE60030267 T DE 60030267T DE 60030267 T2 DE60030267 T2 DE 60030267T2
Authority
DE
Germany
Prior art keywords
circuit board
gel composition
composition
gel
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60030267T
Other languages
German (de)
English (en)
Other versions
DE60030267D1 (de
Inventor
G. Paul Redwood City SCHOENSTEIN
L. Benjamin Los Altos SITLER
H. Robert Palo Alto REAMEY
E. Christine Sunnyvale VOGDES
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of DE60030267D1 publication Critical patent/DE60030267D1/de
Application granted granted Critical
Publication of DE60030267T2 publication Critical patent/DE60030267T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
DE60030267T 1999-04-20 2000-04-19 Wärmeableitung von einer leiterplatte mit blossen chips Expired - Lifetime DE60030267T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/295,081 US6162663A (en) 1999-04-20 1999-04-20 Dissipation of heat from a circuit board having bare silicon chips mounted thereon
US295081 1999-04-20
PCT/US2000/010561 WO2000063968A1 (en) 1999-04-20 2000-04-19 Dissipation of heat from a circuit board having bare silicon chips mounted thereon

Publications (2)

Publication Number Publication Date
DE60030267D1 DE60030267D1 (de) 2006-10-05
DE60030267T2 true DE60030267T2 (de) 2007-07-05

Family

ID=23136132

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60030267T Expired - Lifetime DE60030267T2 (de) 1999-04-20 2000-04-19 Wärmeableitung von einer leiterplatte mit blossen chips

Country Status (9)

Country Link
US (1) US6162663A (https=)
EP (1) EP1171914B1 (https=)
JP (2) JP5084987B2 (https=)
KR (1) KR100742521B1 (https=)
AT (1) ATE337614T1 (https=)
DE (1) DE60030267T2 (https=)
MX (1) MXPA01010665A (https=)
TW (1) TW549011B (https=)
WO (1) WO2000063968A1 (https=)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6342398B1 (en) * 1998-12-17 2002-01-29 Taiwan Semiconductor Manufacturing Company Method of backside emission analysis for BGA packaged IC's
US6399209B1 (en) * 1999-04-16 2002-06-04 The Bergquist Company Integrated release films for phase-change interfaces
US6605238B2 (en) * 1999-09-17 2003-08-12 Honeywell International Inc. Compliant and crosslinkable thermal interface materials
JP2001168246A (ja) * 1999-11-30 2001-06-22 Three M Innovative Properties Co 熱伝導性シート及びその製造方法
US6794030B1 (en) 1999-11-30 2004-09-21 3M Innovative Properties Company Heat conductive sheet and method of producing the sheet
US6673434B2 (en) 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
US7075112B2 (en) * 2001-01-31 2006-07-11 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
US7060747B2 (en) * 2001-03-30 2006-06-13 Intel Corporation Chain extension for thermal materials
US6469379B1 (en) 2001-03-30 2002-10-22 Intel Corporation Chain extension for thermal materials
JP4796704B2 (ja) * 2001-03-30 2011-10-19 株式会社タイカ 押出可能な架橋済グリース状放熱材を充填・封入した容器の製法
JP4054986B2 (ja) 2001-04-23 2008-03-05 信越化学工業株式会社 放熱部材
US6617683B2 (en) * 2001-09-28 2003-09-09 Intel Corporation Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material
US6597575B1 (en) 2002-01-04 2003-07-22 Intel Corporation Electronic packages having good reliability comprising low modulus thermal interface materials
US7208192B2 (en) 2002-05-31 2007-04-24 Parker-Hannifin Corporation Thermally or electrically-conductive form-in-place gap filter
US6992893B2 (en) * 2003-01-10 2006-01-31 Hewlett-Packard Development Company, L.P. Heat sink attachment
US8119191B2 (en) 2003-01-16 2012-02-21 Parker-Hannifin Corporation Dispensable cured resin
US6921974B2 (en) * 2003-03-28 2005-07-26 United Test & Assembly Center Ltd. Packaged device with thermal enhancement and method of packaging
JP4334542B2 (ja) * 2003-08-28 2009-09-30 富士通株式会社 パッケージ構造
US20060237168A1 (en) * 2005-04-21 2006-10-26 Belady Christian L Air mover with thermally coupled guide vanes
US7447019B2 (en) * 2005-10-31 2008-11-04 Hewlett-Packard Development Company, L.P. Computer having an axial duct fan
US7326032B2 (en) * 2005-10-31 2008-02-05 Hewlett-Packard Development Company, L.P. Cooling fan with adjustable tip clearance
US7443671B2 (en) * 2005-10-31 2008-10-28 Hewlett-Packard Development Company, L.P. Axial duct cooling fan
US7558061B2 (en) * 2006-08-04 2009-07-07 Hewlett-Packard Development Company, L.P. Cooling fan module
US20080067669A1 (en) * 2006-09-18 2008-03-20 Buttel Nicole A Systems, devices and methods for controlling thermal interface thickness in a semiconductor die package
US20080068803A1 (en) * 2006-09-18 2008-03-20 Shyh-Ming Chen Heat dissipating device holder structure with a thin film thermal conducting medium coating
US8545987B2 (en) * 2007-11-05 2013-10-01 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US8445102B2 (en) * 2007-11-05 2013-05-21 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US9795059B2 (en) 2007-11-05 2017-10-17 Laird Technologies, Inc. Thermal interface materials with thin film or metallization
US8076773B2 (en) * 2007-12-26 2011-12-13 The Bergquist Company Thermal interface with non-tacky surface
US20090208722A1 (en) * 2008-02-18 2009-08-20 John Francis Timmerman Oriented Members for Thermally Conductive Interface Structures
CA2770719C (en) 2009-08-12 2017-12-12 Jonathan Bergin Fully-cured thermally or electrically-conductive form-in-place gap filler
CN104136569A (zh) * 2012-03-02 2014-11-05 富士高分子工业株式会社 油灰状传热材料及其制造方法
JPWO2014136503A1 (ja) * 2013-03-07 2017-02-09 日産自動車株式会社 回転電機
US20150092352A1 (en) * 2013-09-29 2015-04-02 International Business Machines Corporation Thermal Interface Solution With Reduced Adhesion Force
US11121125B2 (en) 2018-12-12 2021-09-14 Micron Technology, Inc. Thermal chamber for a thermal control component
USD893484S1 (en) 2018-12-12 2020-08-18 Micron Technology, Inc. Thermal control component
TWI896542B (zh) 2019-07-23 2025-09-11 德商漢高股份有限及兩合公司 高熱通量多元件總成之熱管理
US11334129B2 (en) * 2019-12-11 2022-05-17 Micron Technology, Inc. Temperature control component for electronic systems
US11493550B2 (en) 2019-12-11 2022-11-08 Micron Technology, Inc. Standalone thermal chamber for a temperature control component
WO2022113921A1 (ja) * 2020-11-25 2022-06-02 信越化学工業株式会社 半導体パッケージ及びその製造方法
EP4301805A1 (en) 2021-03-04 2024-01-10 Momentive Performance Materials Inc. Thermal gel composition

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3020260A (en) * 1960-08-18 1962-02-06 Dow Corning Organosiloxane potting compound
US4600261A (en) * 1982-10-12 1986-07-15 Raychem Corporation Apparatus and method for protection of electrical contacts
US4634207A (en) * 1982-10-12 1987-01-06 Raychem Corporation Apparatus and method for protection of a substrate
US5357057A (en) * 1982-10-12 1994-10-18 Raychem Corporation Protected electrical connector
US4654754A (en) * 1982-11-02 1987-03-31 Fairchild Weston Systems, Inc. Thermal link
US4595635A (en) * 1985-05-02 1986-06-17 Raychem Corporation Organopolysiloxane materials having decreased surface tack
US4777063A (en) * 1985-05-02 1988-10-11 Raychem Corporation Curable organopolysiloxane composition
JPH04503825A (ja) * 1989-03-01 1992-07-09 レイケム・コーポレイション オルガノポリシロキサン組成物の硬化法およびそれからなる物品
US4979074A (en) * 1989-06-12 1990-12-18 Flavors Technology Printed circuit board heat sink
JPH087535Y2 (ja) * 1989-07-17 1996-03-04 三菱電機株式会社 光ピックアップ装置
US5227663A (en) * 1989-12-19 1993-07-13 Lsi Logic Corporation Integral dam and heat sink for semiconductor device assembly
US5175612A (en) * 1989-12-19 1992-12-29 Lsi Logic Corporation Heat sink for semiconductor device assembly
US5104930A (en) * 1990-02-27 1992-04-14 Raychem Corporation Polyurea gel compositions and articles therefrom
US5291371A (en) * 1990-04-27 1994-03-01 International Business Machines Corporation Thermal joint
US5060114A (en) * 1990-06-06 1991-10-22 Zenith Electronics Corporation Conformable pad with thermally conductive additive for heat dissipation
US5315480A (en) * 1991-11-14 1994-05-24 Digital Equipment Corporation Conformal heat sink for electronic module
US5268815A (en) * 1992-02-14 1993-12-07 International Business Machines Corporation High density, high performance memory circuit package
US5440172A (en) * 1993-06-28 1995-08-08 Sundstrand Corporation Integral heat sink interface
US5467251A (en) * 1993-10-08 1995-11-14 Northern Telecom Limited Printed circuit boards and heat sink structures
KR970005712B1 (ko) * 1994-01-11 1997-04-19 삼성전자 주식회사 고 열방출용 반도체 패키지
MY112145A (en) * 1994-07-11 2001-04-30 Ibm Direct attachment of heat sink attached directly to flip chip using flexible epoxy
KR970706356A (ko) * 1994-09-30 1997-11-03 허버트 지. 버카드 고도의 응력완화율을 나타내는 실리콘 밀봉물질(Silicone Sealing Material Exhibiting High Stress Relaxation)
US5604978A (en) * 1994-12-05 1997-02-25 International Business Machines Corporation Method for cooling of chips using a plurality of materials
CA2211652C (en) * 1995-01-27 2008-03-25 Tyco Electronics Corporation Gels from anhydride-containing polymers
TW373308B (en) * 1995-02-24 1999-11-01 Agere Systems Inc Thin packaging of multi-chip modules with enhanced thermal/power management
US5741579A (en) * 1995-04-28 1998-04-21 Shin-Etsu Polymer Co., Ltd. Heat-conductive sheet
JPH0982882A (ja) * 1995-09-20 1997-03-28 Nec Corp マルチチップモジュール
JPH08208993A (ja) * 1995-11-27 1996-08-13 Toshiba Silicone Co Ltd 熱伝導性シリコーン組成物
US5847929A (en) * 1996-06-28 1998-12-08 International Business Machines Corporation Attaching heat sinks directly to flip chips and ceramic chip carriers
US5812374A (en) * 1996-10-28 1998-09-22 Shuff; Gregg Douglas Electrical circuit cooling device
JP3479206B2 (ja) * 1997-07-09 2003-12-15 北川工業株式会社 熱伝導スペーサ

Also Published As

Publication number Publication date
DE60030267D1 (de) 2006-10-05
JP5084987B2 (ja) 2012-11-28
ATE337614T1 (de) 2006-09-15
KR20020005694A (ko) 2002-01-17
JP2002542626A (ja) 2002-12-10
KR100742521B1 (ko) 2007-08-02
EP1171914A1 (en) 2002-01-16
JP2012054578A (ja) 2012-03-15
EP1171914B1 (en) 2006-08-23
TW549011B (en) 2003-08-21
WO2000063968A1 (en) 2000-10-26
MXPA01010665A (es) 2002-07-02
US6162663A (en) 2000-12-19

Similar Documents

Publication Publication Date Title
DE60030267T2 (de) Wärmeableitung von einer leiterplatte mit blossen chips
DE69937413T2 (de) Wärmesenke für elektronisches Bauteil
DE69807567T2 (de) Belaganordnung für thermische Zwischenlage
DE69406201T2 (de) Stiftkühlkörper
EP0511162A1 (de) Wärmeleitende Klebfilme, Laminate mit wärmeleitenden Klebschichten und deren Verwendung
JP4121152B2 (ja) 電子部品用の適合性熱境界面材料
DE68918380T2 (de) Gehäuse für integrierte Schaltungen mit Kühlvorrichtung.
DE3782646T2 (de) Vorrichtung und verfahren zur verbindung von schaltungspackungen.
DE102015118245A1 (de) Thermisches Schnittstellenmaterial mit definierten thermischen, mechanischen und elektrischen Eigenschaften
EP3437128B1 (en) Thermal interface material
DE2536316C2 (de) Schaltungskarte für integrierte Halbleiterschaltungen
DE102010043904A1 (de) Leistungselektroniksubstrat für direkte Substratkühlung
DE10297225T5 (de) Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zur Herstellung von Halbleiterbauelementen und nach derartigen Verfahren hergestellte Halbleiterbauelemente
DE102015221062B4 (de) Halbleiterschaltungsanordnung mit gepresstem gel und montageverfahren
CN112159647A (zh) 一种低硬度易返工的单组分导热凝胶及其制备方法
DE112017004465T5 (de) Flexible gedruckte Leiterplatte und Verfahren zum Herstellen einer flexiblen gedruckten Leiterplatte
US6242799B1 (en) Anisotropic stress buffer and semiconductor device using the same
US6794030B1 (en) Heat conductive sheet and method of producing the sheet
DE112017005682T5 (de) Halbleitereinheit und verfahren zur herstellung derselben sowie drahtlose datenübertragungsvorrichtung
DE10338087A1 (de) Elektronische Schaltungsvorrichtung und deren Herstellungsverfahren
JP3283454B2 (ja) 放熱スペーサー
DE102011083224A1 (de) Wärmeleitpaste, Leistungshalbleiteranordnung mit Wärmeleitpaste und Verfahren zum Aufbringen eines Wärmeleitmediums auf eine Wärmeableitfläche
DE102011083002A1 (de) Elektrisches Steuergerät mit Moldgehäuse
DE10109083B4 (de) Elektronische Baugruppe
JP4530283B2 (ja) 熱伝導性シート及びその製造方法

Legal Events

Date Code Title Description
8364 No opposition during term of opposition