KR100700394B1 - 와이핑 장치, 이를 구비한 묘화 장치, 전기 광학 장치의제조 방법, 전기 광학 장치 및 전자기기 - Google Patents
와이핑 장치, 이를 구비한 묘화 장치, 전기 광학 장치의제조 방법, 전기 광학 장치 및 전자기기 Download PDFInfo
- Publication number
- KR100700394B1 KR100700394B1 KR1020050002952A KR20050002952A KR100700394B1 KR 100700394 B1 KR100700394 B1 KR 100700394B1 KR 1020050002952 A KR1020050002952 A KR 1020050002952A KR 20050002952 A KR20050002952 A KR 20050002952A KR 100700394 B1 KR100700394 B1 KR 100700394B1
- Authority
- KR
- South Korea
- Prior art keywords
- wiping
- cleaning
- head
- functional
- opening
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 37
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 238000004140 cleaning Methods 0.000 claims abstract description 208
- 239000007921 spray Substances 0.000 claims abstract description 84
- 238000004804 winding Methods 0.000 claims abstract description 51
- 238000002347 injection Methods 0.000 claims abstract description 33
- 239000007924 injection Substances 0.000 claims abstract description 33
- 239000007788 liquid Substances 0.000 claims description 180
- 230000007246 mechanism Effects 0.000 claims description 60
- 239000000463 material Substances 0.000 claims description 31
- 230000033001 locomotion Effects 0.000 claims description 16
- 238000005406 washing Methods 0.000 claims description 12
- 238000007599 discharging Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 5
- 238000007654 immersion Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 123
- 239000010408 film Substances 0.000 description 53
- 239000004973 liquid crystal related substance Substances 0.000 description 51
- 239000000758 substrate Substances 0.000 description 51
- 230000001105 regulatory effect Effects 0.000 description 32
- 230000003028 elevating effect Effects 0.000 description 26
- 230000015572 biosynthetic process Effects 0.000 description 25
- 239000000203 mixture Substances 0.000 description 20
- 230000008569 process Effects 0.000 description 19
- 238000012423 maintenance Methods 0.000 description 16
- 239000011159 matrix material Substances 0.000 description 16
- 238000005507 spraying Methods 0.000 description 14
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 13
- 230000008439 repair process Effects 0.000 description 12
- 230000001681 protective effect Effects 0.000 description 11
- 230000000630 rising effect Effects 0.000 description 11
- 125000006850 spacer group Chemical group 0.000 description 11
- 238000012545 processing Methods 0.000 description 10
- 238000005401 electroluminescence Methods 0.000 description 9
- 239000002346 layers by function Substances 0.000 description 9
- 239000012454 non-polar solvent Substances 0.000 description 9
- 239000010409 thin film Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000005192 partition Methods 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000003566 sealing material Substances 0.000 description 7
- 238000000926 separation method Methods 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 238000003491 array Methods 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 6
- 239000011344 liquid material Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000035939 shock Effects 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- 239000000725 suspension Substances 0.000 description 5
- 238000007667 floating Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000011010 flushing procedure Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 230000002940 repellent Effects 0.000 description 2
- 239000005871 repellent Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 206010040844 Skin exfoliation Diseases 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
- 230000004886 head movement Effects 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012792 lyophilization process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 210000000050 mohair Anatomy 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- HBEQXAKJSGXAIQ-UHFFFAOYSA-N oxopalladium Chemical compound [Pd]=O HBEQXAKJSGXAIQ-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000010349 pulsation Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 210000000582 semen Anatomy 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/165—Prevention or detection of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
- B41J2/16585—Prevention or detection of nozzle clogging, e.g. cleaning, capping or moistening for nozzles for paper-width or non-reciprocating print heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/165—Prevention or detection of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
- B41J2/16517—Cleaning of print head nozzles
- B41J2/16535—Cleaning of print head nozzles using wiping constructions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/165—Prevention or detection of nozzle clogging, e.g. cleaning, capping or moistening for nozzles
- B41J2/16517—Cleaning of print head nozzles
- B41J2/16552—Cleaning of print head nozzles using cleaning fluids
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Coating Apparatus (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Ink Jet (AREA)
- Cleaning In General (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
Claims (14)
- 기능 액적(液滴) 토출 헤드의 노즐면을 기능액을 용해하는 세정액을 도착(塗着)시킨 와이핑 시트에 의해 클리닝하는 와이핑 장치에 있어서,와이핑 시트를 조출(繰出)하는 조출 릴과,상기 조출 릴로부터 조출된 상기 와이핑 시트에 세정액을 분무·도착시키는 분무 헤드와,세정액이 도착된 상기 와이핑 시트를 기능 액적 토출 헤드의 노즐면에 눌러 클리닝 동작시키는 클리닝 부재와,클리닝 부재를 경유한 상기 와이핑 시트를 감는 와인딩 릴과,적어도 상기 조출 릴, 상기 와인딩 릴, 상기 클리닝 부재 및 상기 분무 헤드와, 상기 클리닝 부재를 경유하여 상기 조출 릴로부터 상기 와인딩 릴에 이르는 상기 와이핑 시트의 시트 공급 경로를 덮는 커버 박스와,이들 구성 부품을 지지(支持)하는 장치 프레임을 구비하고,상기 커버 박스에는 상기 클리닝 부재가 돌출하는 부재 개구가 형성되어 있으며,상기 부재 개구의 개구 가장자리부에는 상기 부재 개구와 상기 클리닝 부재와의 틈을 밀봉하는 에어타이트재가 배열 설치되어 있는 것을 특징으로 하는 와이핑 장치.
- 삭제
- 기능 액적 토출 헤드의 노즐면을 기능액을 용해하는 세정액을 도착시킨 와이핑 시트에 의해 클리닝하는 와이핑 장치에 있어서,와이핑 시트를 조출하는 조출 릴과,상기 조출 릴로부터 조출된 상기 와이핑 시트에 세정액을 분무·도착시키는 분무 헤드와,세정액이 도착된 상기 와이핑 시트를 기능 액적 토출 헤드의 노즐면에 눌러 클리닝 동작시키는 클리닝 부재와,클리닝 부재를 경유한 상기 와이핑 시트를 감는 와인딩 릴과,적어도 상기 조출 릴, 상기 와인딩 릴, 상기 클리닝 부재 및 상기 분무 헤드와, 상기 클리닝 부재를 경유하여 상기 조출 릴로부터 상기 와인딩 릴에 이르는 상기 와이핑 시트의 시트 공급 경로를 덮는 커버 박스━상기 커버 박스에는 상기 클리닝 부재가 돌출하는 부재 개구가 형성되어 있음━와,이들 구성 부품을 지지하는 장치 프레임과,상기 클리닝 부재를 지지함과 동시에, 상기 부재 개구로부터 출몰(出沒)시키는 출몰 운동 기구와,상기 부재 개구를 개폐하는 개폐 덮개와,상기 출몰 운동 기구에 의한 상기 클리닝 부재의 몰입(沒入) 동작에 연동(連動)하여, 상기 개폐 덮개를 폐색(閉塞)하는 덮개 연동 기구를 구비한 것을 특징으로 하는 와이핑 장치.
- 제 1 항에 있어서,상기 클리닝 부재는 상단(上端)부에, 상기 분무 헤드는 상부(上部)에, 상기 조출 릴 및 상기 와인딩 릴은 하부(下部)에 각각 배열 설치되어 있고,상기 커버 박스는 상부를 덮는 상부 덮개부와, 하부를 덮는 하부 덮개부로 이루어지며,상기 상부 덮개부 및 상기 하부 덮개부는 상기 장치 프레임에 대하여 각각 착탈 가능하게 설치되어 있는 것을 특징으로 하는 와이핑 장치.
- 제 4 항에 있어서,상기 상부 덮개부는 상기 부재 개구를 분단하는 분할 구조로 구성되고,상기 장치 프레임에 대하여 각각 착탈 가능하게 설치되어 있는 것을 특징으로 하는 와이핑 장치.
- 제 4 항에 있어서,상기 분무 헤드를 지지하는 캐리어 암(arm)과, 상기 캐리어 암을 통하여 상기 분무 헤드를 상기 와이핑 시트의 폭방향으로 분무 주사시키는 헤드 주사 기구를 더 구비하고,상기 상부 덮개부에는 상기 캐리어 암이 면하는 슬릿 개구가 형성되어 있는 것을 특징으로 하는 와이핑 장치.
- 제 1 항에 있어서,상기 커버 박스는 상호 평행하게 대치(對峙)하는 한쌍의 측판(側板)을 갖고,상기 한쌍의 측판 중 적어도 한쪽은 상기 장치 프레임을 겸하고 있는 것을 특징으로 하는 와이핑 장치.
- 제 1 항에 있어서,상기 커버 박스에는 배기 설비에 연결되는 배기관로가 접속되어 있는 것을 특징으로 하는 와이핑 장치.
- 제 1 항에 있어서,상기 커버 박스 내에 배열 설치한 가습 장치를 더 구비한 것을 특징으로 하는 와이핑 장치.
- 제 1 항에 있어서,상기 커버 박스의 저면(底面)에 세정액을 받는 방액(防液) 팬을 더 구비한 것을 특징으로 하는 와이핑 장치.
- 제 1 항에 기재된 와이핑 장치와,상기 기능 액적 토출 헤드를 구비하고,워크(work)에 대하여 기능 액적 토출 헤드를 상대적으로 이동시키면서, 상기 기능 액적 토출 헤드를 토출 구동함으로써, 상기 워크에 기능 액적에 의한 묘화(描畵)를 행하는 것을 특징으로 하는 묘화 장치.
- 제 11 항에 기재된 묘화 장치를 사용하여, 상기 워크 상에 기능 액적에 의한 성막부(成膜部)를 형성하는 것을 특징으로 하는 전기 광학 장치의 제조 방법.
- 제 11 항에 기재된 묘화 장치를 사용하여, 상기 워크 상에 기능 액적에 의한 성막부를 형성한 것을 특징으로 하는 전기 광학 장치.
- 제 12 항에 기재된 전기 광학 장치의 제조 방법에 의해 제조한 전기 광학 장 치, 또는 제 13 항에 기재된 전기 광학 장치를 탑재(搭載)한 것을 특징으로 하는 전자기기.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2004-00014723 | 2004-01-22 | ||
JP2004014723 | 2004-01-22 | ||
JP2004299435A JP3823994B2 (ja) | 2004-01-22 | 2004-10-13 | ワイピング装置、これを備えた描画装置、電気光学装置の製造方法 |
JPJP-P-2004-00299435 | 2004-10-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050076739A KR20050076739A (ko) | 2005-07-27 |
KR100700394B1 true KR100700394B1 (ko) | 2007-03-28 |
Family
ID=34797777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050002952A KR100700394B1 (ko) | 2004-01-22 | 2005-01-12 | 와이핑 장치, 이를 구비한 묘화 장치, 전기 광학 장치의제조 방법, 전기 광학 장치 및 전자기기 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7311378B2 (ko) |
JP (1) | JP3823994B2 (ko) |
KR (1) | KR100700394B1 (ko) |
CN (1) | CN100336666C (ko) |
TW (1) | TWI245710B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200446002Y1 (ko) * | 2009-02-18 | 2009-09-24 | 김대순 | 개폐가 가능한 보도 커버용 지붕장치 |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4431114B2 (ja) * | 2004-01-07 | 2010-03-10 | ヒューレット・パッカード インダストリアル プリンティング リミテッド | インクジェット記録ヘッド |
US7770518B2 (en) * | 2005-03-16 | 2010-08-10 | Hewlett-Packard Development Company, L.P. | Web apparatus for cleaning arcuate printhead arrangement |
US7695093B2 (en) * | 2005-10-11 | 2010-04-13 | Silverbrook Research Pty Ltd | Method of removing flooded ink from a printhead using a disposable sheet |
US7506952B2 (en) * | 2005-10-11 | 2009-03-24 | Silverbrook Research Pty Ltd | Method of removing particulates from a printhead using film transfer |
US7510261B2 (en) * | 2005-10-11 | 2009-03-31 | Silverbrook Research Pty Ltd | Printhead assembly comprising ink reservoir containing cleaning liquid |
US7815302B2 (en) | 2006-04-12 | 2010-10-19 | Hewlett-Packard Development Company, L.P. | Printhead cleaning web assembly |
JP2008068253A (ja) * | 2006-08-17 | 2008-03-27 | Semiconductor Energy Lab Co Ltd | 液滴吐出方法及び液滴吐出装置 |
JP4379509B2 (ja) * | 2007-10-01 | 2009-12-09 | セイコーエプソン株式会社 | キャッピング治具 |
JP5191422B2 (ja) * | 2009-03-13 | 2013-05-08 | 富士フイルム株式会社 | 吐出面清掃装置及び液体吐出装置並びに吐出面清掃方法 |
US20100315463A1 (en) * | 2009-06-16 | 2010-12-16 | Daniel Blanch Escude | Servicing print heads in printing systems |
KR101822354B1 (ko) * | 2009-09-25 | 2018-01-25 | 가부시키가이샤 니콘 | 기판 카트리지 및 그 응용 |
JP2011104979A (ja) * | 2009-10-20 | 2011-06-02 | Seiko Epson Corp | ヘッド保守装置、該ヘッド保守装置を備えた液体噴射装置 |
US8313164B2 (en) * | 2009-11-04 | 2012-11-20 | Lexmark International, Inc. | Touch-free nozzle sealant removal |
US8342638B2 (en) * | 2009-11-30 | 2013-01-01 | Hewlett-Packard Development Company, L.P. | Servicing article |
JP2011183764A (ja) * | 2010-03-11 | 2011-09-22 | Seiko Epson Corp | 液体噴射装置 |
CN102947101B (zh) * | 2010-06-18 | 2016-03-16 | 帕达鲁玛喷墨解决方案有限两合公司 | 打印头模块 |
JP5698567B2 (ja) * | 2010-08-31 | 2015-04-08 | 富士フイルム株式会社 | 液滴吐出装置、及び液滴吐出ヘッドのメンテナンス方法 |
JP5689651B2 (ja) * | 2010-11-09 | 2015-03-25 | エスアイアイ・プリンテック株式会社 | 液体噴射ヘッド、液体噴射装置及び液体噴射ヘッドの駆動方法 |
JP2012139829A (ja) * | 2010-12-28 | 2012-07-26 | Ricoh Co Ltd | 画像形成装置 |
JP2013166299A (ja) * | 2012-02-15 | 2013-08-29 | Seiko Epson Corp | 液体噴射装置 |
JP6075856B2 (ja) * | 2012-03-28 | 2017-02-08 | キヤノン株式会社 | 記録装置 |
JP6332908B2 (ja) * | 2012-03-29 | 2018-05-30 | キヤノン株式会社 | インクジェット記録装置およびインクジェット記録装置の制御方法 |
US8684494B2 (en) | 2012-07-23 | 2014-04-01 | Xerox Corporation | Fluid applicator for a printhead face |
US8820885B2 (en) | 2012-11-19 | 2014-09-02 | Xerox Corporation | Printhead having apertures for application of a surface treatment fluid |
US9067415B2 (en) * | 2012-11-30 | 2015-06-30 | Seiko Epson Corporation | Ink-jet recording apparatus |
EP3107736B1 (en) * | 2014-02-18 | 2021-01-06 | Hewlett-Packard Development Company, L.P. | Printhead wiping |
CN105984226B (zh) * | 2015-02-27 | 2018-09-14 | 北大方正集团有限公司 | 防喷墨印刷机喷头长时间晾干的方法及系统 |
JP6471547B2 (ja) * | 2015-03-13 | 2019-02-20 | セイコーエプソン株式会社 | 液体噴射装置 |
CN106269591B (zh) * | 2015-05-29 | 2023-04-18 | 深圳市富云帝科技有限公司 | 一种自动清洁机及自动清洁方法 |
JP6969232B2 (ja) * | 2017-09-01 | 2021-11-24 | セイコーエプソン株式会社 | ワイパーユニット、液体噴射装置及びワイピング部材のエンド状態判断方法 |
CN108594485B (zh) * | 2018-04-20 | 2020-12-25 | 中电科风华信息装备股份有限公司 | 液晶玻盒全自动整平封口机的玻盒液晶灌注口封口机构 |
CN117922167A (zh) * | 2024-03-22 | 2024-04-26 | 苏州优备精密智能装备股份有限公司 | 一种全自动喷头清洁装置及喷头清洁方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02276663A (ja) * | 1989-01-24 | 1990-11-13 | Tokyo Electric Co Ltd | サーマルヘッドのクリーニング方法およびそのクリーニングシート |
JPH0780386A (ja) * | 1993-09-10 | 1995-03-28 | Hirata Corp | 塗布ヘッドのクリーニング方法及び塗布ヘッドクリーニング装置 |
KR20010005322A (ko) * | 1999-06-30 | 2001-01-15 | 이형도 | 잉크젯 프린터 |
JP2003033712A (ja) | 2001-07-25 | 2003-02-04 | Toppan Printing Co Ltd | 塗布ヘッドのクリーニング装置およびクリーニング方法 |
JP2003270426A (ja) * | 2002-03-15 | 2003-09-25 | Seiko Epson Corp | 製膜装置及びヘッドクリーニング方法及びデバイス製造装置及びデバイス |
JP2004000841A (ja) * | 2002-05-31 | 2004-01-08 | Nec Corp | ペースト材塗布装置及びペースト材塗布方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5907335A (en) | 1996-11-13 | 1999-05-25 | Hewlett-Packard Company | Wet wiping printhead cleaning system using a non-contact technique for applying a printhead treatment fluid |
US5905514A (en) * | 1996-11-13 | 1999-05-18 | Hewlett-Packard Company | Servicing system for an inkjet printhead |
JP2001212969A (ja) * | 2000-02-03 | 2001-08-07 | Canon Inc | インクジェット記録装置 |
JP2002019132A (ja) * | 2000-07-07 | 2002-01-23 | Mimaki Engineering Co Ltd | プロッタのインクジェットヘッドのクリーニング機構及びクリーニング方法 |
JP4141674B2 (ja) * | 2001-10-22 | 2008-08-27 | セイコーエプソン株式会社 | 液滴吐出ヘッド、その拭取り方法およびこれを備えた電子機器 |
JP2003288030A (ja) | 2002-03-27 | 2003-10-10 | Seiko Epson Corp | 電気光学装置とその製造方法及びデバイス並びに電子機器 |
US6692100B2 (en) * | 2002-04-05 | 2004-02-17 | Hewlett-Packard Development Company, L.P. | Cleaning apparatus and method of assembly therefor for cleaning an inkjet print head |
JP4389443B2 (ja) * | 2002-12-20 | 2009-12-24 | セイコーエプソン株式会社 | インクジェットヘッドのワイピングユニット、これを備えた液滴吐出装置および電気光学装置の製造方法 |
-
2004
- 2004-10-13 JP JP2004299435A patent/JP3823994B2/ja not_active Expired - Fee Related
- 2004-12-17 TW TW093139542A patent/TWI245710B/zh not_active IP Right Cessation
-
2005
- 2005-01-12 KR KR1020050002952A patent/KR100700394B1/ko active IP Right Grant
- 2005-01-21 CN CNB2005100046595A patent/CN100336666C/zh active Active
- 2005-02-21 US US11/062,209 patent/US7311378B2/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02276663A (ja) * | 1989-01-24 | 1990-11-13 | Tokyo Electric Co Ltd | サーマルヘッドのクリーニング方法およびそのクリーニングシート |
JPH0780386A (ja) * | 1993-09-10 | 1995-03-28 | Hirata Corp | 塗布ヘッドのクリーニング方法及び塗布ヘッドクリーニング装置 |
KR20010005322A (ko) * | 1999-06-30 | 2001-01-15 | 이형도 | 잉크젯 프린터 |
JP2003033712A (ja) | 2001-07-25 | 2003-02-04 | Toppan Printing Co Ltd | 塗布ヘッドのクリーニング装置およびクリーニング方法 |
JP2003270426A (ja) * | 2002-03-15 | 2003-09-25 | Seiko Epson Corp | 製膜装置及びヘッドクリーニング方法及びデバイス製造装置及びデバイス |
JP2004000841A (ja) * | 2002-05-31 | 2004-01-08 | Nec Corp | ペースト材塗布装置及びペースト材塗布方法 |
Non-Patent Citations (2)
Title |
---|
15270426 * |
16000841 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200446002Y1 (ko) * | 2009-02-18 | 2009-09-24 | 김대순 | 개폐가 가능한 보도 커버용 지붕장치 |
Also Published As
Publication number | Publication date |
---|---|
TWI245710B (en) | 2005-12-21 |
CN1644377A (zh) | 2005-07-27 |
US20050162461A1 (en) | 2005-07-28 |
JP2005231343A (ja) | 2005-09-02 |
CN100336666C (zh) | 2007-09-12 |
JP3823994B2 (ja) | 2006-09-20 |
US7311378B2 (en) | 2007-12-25 |
KR20050076739A (ko) | 2005-07-27 |
TW200524753A (en) | 2005-08-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100700394B1 (ko) | 와이핑 장치, 이를 구비한 묘화 장치, 전기 광학 장치의제조 방법, 전기 광학 장치 및 전자기기 | |
JP3849676B2 (ja) | 液滴吐出装置、電気光学装置の製造方法、電気光学装置、および電子機器 | |
KR100668271B1 (ko) | 와이핑 장치, 액적 토출 장치, 전기 광학 장치, 전기 광학장치의 제조 방법 및 전자 기기 | |
KR100671814B1 (ko) | 액체방울 토출 장치 및 전기 광학 장치의 제조 방법, 전기광학 장치 및 전자 기기 | |
US20050190225A1 (en) | Liquid droplet ejection apparatus, method of manufacturing electro-optical device, electro-optical device, and electronic apparatus | |
KR20070092675A (ko) | 토출 검사 장치, 액적 토출 장치, 전기 광학 장치의 제조방법, 전기 광학 장치 및 전자 기기 | |
JP5671975B2 (ja) | 液滴吐出装置の描画方法 | |
JP2004195932A (ja) | 液滴吐出ヘッドの保全方法、保全キャップのクリーニング装置およびこれを備えた液滴吐出装置、並びに電気光学装置、電気光学装置の製造方法および電子機器 | |
JP4752822B2 (ja) | 液滴吐出装置および電気光学装置の製造方法 | |
JP4371037B2 (ja) | 液滴吐出装置および電気光学装置の製造方法 | |
JP4561298B2 (ja) | 洗浄液噴霧方法、洗浄液噴霧装置、これを備えたワイピング装置、描画装置および電気光学装置の製造方法 | |
JP4586485B2 (ja) | 液滴吐出装置、並びに電気光学装置の製造方法、電気光学装置および電子機器 | |
JP5397297B2 (ja) | 液滴吐出装置 | |
JP4026637B2 (ja) | 液滴吐出装置、並びに電気光学装置の製造方法および電気光学装置 | |
JP4654948B2 (ja) | 吐出検査装置、液滴吐出装置および電気光学装置の製造方法 | |
JP4626257B2 (ja) | 液滴吐出装置 | |
JP2005230801A (ja) | ワイピング方法、ワイピング装置、これを備えた描画装置、電気光学装置の製造方法、電気光学装置、および電子機器 | |
JP2005254799A (ja) | 機能液滴吐出ヘッドのワイピング方法、ワイピング装置およびこれを備えた液滴吐出装置、並びに電気光学装置の製造方法、電気光学装置および電子機器 | |
JP4742768B2 (ja) | 機能液滴吐出ヘッドの保守装置およびこれを備えた液滴吐出装置、並びに電気光学装置の製造方法 | |
JP2008188807A (ja) | フラッシングユニット、液滴吐出装置、電気光学装置の製造方法、電気光学装置および電子機器 | |
JP4670848B2 (ja) | 液滴吐出装置、および電気光学装置の製造方法 | |
JP2006239620A (ja) | ワイピング装置およびこれを備えた液滴吐出装置、並びに電気光学装置の製造方法、電気光学装置および電子機器 | |
JP2007069132A (ja) | 機能液滴吐出ヘッドの保守方法、機能液滴吐出ヘッドの保守装置およびこれを備えた液滴吐出装置、並びに電気光学装置の製造方法、電気光学装置および電子機器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130227 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20140220 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20150224 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20160219 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20170824 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20180308 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20190320 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20200311 Year of fee payment: 14 |