KR100656065B1 - 평판표시소자 검사용 전기적 접촉 단자 - Google Patents
평판표시소자 검사용 전기적 접촉 단자 Download PDFInfo
- Publication number
- KR100656065B1 KR100656065B1 KR1020050100560A KR20050100560A KR100656065B1 KR 100656065 B1 KR100656065 B1 KR 100656065B1 KR 1020050100560 A KR1020050100560 A KR 1020050100560A KR 20050100560 A KR20050100560 A KR 20050100560A KR 100656065 B1 KR100656065 B1 KR 100656065B1
- Authority
- KR
- South Korea
- Prior art keywords
- electrical contact
- circuit board
- contact terminal
- printed circuit
- flexible printed
- Prior art date
Links
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06744—Microprobes, i.e. having dimensions as IC details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
Abstract
Description
Claims (3)
- 연성 인쇄 회로 기판의 배면에 소정의 단면적을 갖는 완충재질과 고정 블록으로 압축 복원되게 구성하여 구동 PCB의 전기적 신호를 프로브 블록에 전달되게 한 전기적 접촉단자
- 제 1항에 있어서 완충재질은 단면적이 0.02 ~ 30제곱밀리미터인 것을 특징으로 하는 전기적 접촉단자
- 제 1항에 있어서 고정블록에 연성 인쇄회로 기판을 넣을 수 있게 소정의 각도로 홈을 구성한 전기적 접촉단자
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050100560A KR100656065B1 (ko) | 2005-10-25 | 2005-10-25 | 평판표시소자 검사용 전기적 접촉 단자 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050100560A KR100656065B1 (ko) | 2005-10-25 | 2005-10-25 | 평판표시소자 검사용 전기적 접촉 단자 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050107351A KR20050107351A (ko) | 2005-11-11 |
KR100656065B1 true KR100656065B1 (ko) | 2006-12-08 |
Family
ID=37283949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050100560A KR100656065B1 (ko) | 2005-10-25 | 2005-10-25 | 평판표시소자 검사용 전기적 접촉 단자 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100656065B1 (ko) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002311051A (ja) | 2001-04-13 | 2002-10-23 | Oshin Kagi Kofun Yugenkoshi | メンブレン・プローブ・ブロック |
US6603467B1 (en) | 2000-10-04 | 2003-08-05 | Industrial Technologies Research Institute | Method and apparatus for LCD panel power up test |
KR20050082431A (ko) * | 2005-07-25 | 2005-08-23 | 백종수 | 평판표시소자 검사용 프로브 조립체 |
KR20060108426A (ko) * | 2005-04-13 | 2006-10-18 | 주식회사 코디에스 | 액정 디스플레이 패널 검사용 프로브 유니트 |
-
2005
- 2005-10-25 KR KR1020050100560A patent/KR100656065B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6603467B1 (en) | 2000-10-04 | 2003-08-05 | Industrial Technologies Research Institute | Method and apparatus for LCD panel power up test |
JP2002311051A (ja) | 2001-04-13 | 2002-10-23 | Oshin Kagi Kofun Yugenkoshi | メンブレン・プローブ・ブロック |
KR20060108426A (ko) * | 2005-04-13 | 2006-10-18 | 주식회사 코디에스 | 액정 디스플레이 패널 검사용 프로브 유니트 |
KR20050082431A (ko) * | 2005-07-25 | 2005-08-23 | 백종수 | 평판표시소자 검사용 프로브 조립체 |
Also Published As
Publication number | Publication date |
---|---|
KR20050107351A (ko) | 2005-11-11 |
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