KR100646170B1 - 박막트랜지스터의 제조방법 - Google Patents
박막트랜지스터의 제조방법 Download PDFInfo
- Publication number
- KR100646170B1 KR100646170B1 KR1020000022491A KR20000022491A KR100646170B1 KR 100646170 B1 KR100646170 B1 KR 100646170B1 KR 1020000022491 A KR1020000022491 A KR 1020000022491A KR 20000022491 A KR20000022491 A KR 20000022491A KR 100646170 B1 KR100646170 B1 KR 100646170B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- gate electrode
- ohmic contact
- ohmic
- metal layer
- Prior art date
Links
- 239000010409 thin film Substances 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 45
- 239000002184 metal Substances 0.000 claims abstract description 45
- 238000002161 passivation Methods 0.000 claims abstract description 30
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000000151 deposition Methods 0.000 claims abstract description 11
- 238000005530 etching Methods 0.000 claims abstract description 7
- 238000000059 patterning Methods 0.000 claims abstract description 6
- 238000004380 ashing Methods 0.000 claims abstract description 5
- 238000001312 dry etching Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 12
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 239000011733 molybdenum Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 description 4
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- BCCOBQSFUDVTJQ-UHFFFAOYSA-N octafluorocyclobutane Chemical compound FC1(F)C(F)(F)C(F)(F)C1(F)F BCCOBQSFUDVTJQ-UHFFFAOYSA-N 0.000 description 4
- 235000019407 octafluorocyclobutane Nutrition 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 229910001182 Mo alloy Inorganic materials 0.000 description 3
- -1 acryl Chemical group 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 241001239379 Calophysus macropterus Species 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910016024 MoTa Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66765—Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Thin Film Transistor (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims (7)
- 투명기판 상의 소정 부분에 게이트전극 및 게이트라인을 형성하는 단계와;상기 투명기판 상에 상기 게이트전극 및 게이트라인을 덮도록 게이트절연막, 활성층 및 오믹접촉층을 순차적으로 증착하는 단계와;상기 오믹접촉층 상에 오믹금속층을 증착하고 상기 오믹금속층을 패터닝하여 상기 게이트라인과 수직되는 데이터라인과 상기 게이트전극 상에 소오스 및 드레인전극을 형성함과 아울러 상기 게이트전극과 대응되는 영역에 상기 활성층이 노출되도록 상기 오믹접촉층을 패터닝하는 단계와;상기 활성층 상에 상기 소오스 및 드레인전극과 오믹금속층을 덮도록 패시베이션층을 형성하고 상기 패시베이션층 상에 상기 데이터라인을 포함하는 상기 소오스 및 드레인전극과 대응하는 부분에 포토레지스트 패턴을 형성하는 단계와;상기 포토레지스트 패턴을 마스크로 사용하여 상기 패시베이션층, 오믹금속층, 오믹접촉층 및 활성층의 노출된 부분을 순차적으로 식각하고 SF6 + O2의 혼합 가스로 애싱(ashing) 처리하는 단계와;상기 포토레지스트 패턴을 제거하는 단계를 포함하는 것을 특징으로 하는 박막트랜지스터의 제조방법.
- 제 1 항에 있어서,상기 게이트전극은 알루미늄(Al)과 네오딤(Nd)의 합금으로 이루어진 하부층과 몰리브덴(Mo)으로 이루어진 상부층의 복수 층으로 형성되는 것을 특징으로 하는 박막트랜지스터의 제조방법.
- 제 1 항에 있어서,상기 패시베이션층, 오믹금속층, 오믹접촉층 및 활성층을 순차적으로 식각하는 단계는,상기 패시베이션층을 SF6 + He의 혼합 가스로 건식 식각하는 제1 단계와, 상기 오믹금속층을 SF6 + He + O2의 혼합 가스로 건식 식각하는 제2 단계와, 상기 오믹접촉층 및 활성층을 SF6 + He + HCl의 혼합 가스로 건식 식각하는 제3 단계를 포함하는 것을 특징으로 하는 박막트랜지스터의 제조방법.
- 제 3 항에 있어서,상기 제1 단계는,상기 게이트전극과 대응하는 부분은 상기 패시베이션층뿐만 아니라 상기 오믹접촉층 및 활성층도 함께 식각되는 것을 특징으로 하는 박막트랜지스터의 제조방법.
- 제 3 항에 있어서,상기 제 2 단계는,상기 오믹접촉층뿐만 아니라 상기 게이트절연막이 함께 식각되어 상기 게이트전극이 노출되는 것을 특징으로 하는 박막트랜지스터의 제조방법.
- 제 3 항에 있어서,상기 제 3 단계는,상기 SF6 + He + HCl의 혼합 가스가 상기 게이트전극의 노출된 부분과 접촉되어 Cl 성분이 잔류되는 것을 특징으로 하는 박막트랜지스터의 제조방법.
- 제 6 항에 있어서,상기 게이트전극의 노출된 부분에 잔류하는 Cl 성분을 SF6 + O2의 혼합 가스로 애싱(ashing) 처리하여 제거하는 것을 특징으로 하는 박막트랜지스터의 제조방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000022491A KR100646170B1 (ko) | 2000-04-27 | 2000-04-27 | 박막트랜지스터의 제조방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000022491A KR100646170B1 (ko) | 2000-04-27 | 2000-04-27 | 박막트랜지스터의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010097961A KR20010097961A (ko) | 2001-11-08 |
KR100646170B1 true KR100646170B1 (ko) | 2006-11-14 |
Family
ID=19667266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000022491A KR100646170B1 (ko) | 2000-04-27 | 2000-04-27 | 박막트랜지스터의 제조방법 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100646170B1 (ko) |
-
2000
- 2000-04-27 KR KR1020000022491A patent/KR100646170B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20010097961A (ko) | 2001-11-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7636135B2 (en) | TFT-LCD array substrate and method for manufacturing the same | |
US6107640A (en) | Semiconductor device for a thin film transistor | |
US8476123B2 (en) | Method for manufacturing thin film transistor array panel | |
KR20080036282A (ko) | 박막 트랜지스터 기판의 제조 방법 | |
US7479415B2 (en) | Fabrication method of polycrystalline silicon liquid crystal display device | |
US7125756B2 (en) | Method for fabricating liquid crystal display device | |
US6411356B1 (en) | Liquid crystal display device with an organic insulating layer having a uniform undamaged surface | |
KR100675317B1 (ko) | 박막트랜지스터 및 그의 제조방법 | |
KR100658068B1 (ko) | 수직형 박막 트랜지스터 액정표시소자의 제조방법 | |
KR100646170B1 (ko) | 박막트랜지스터의 제조방법 | |
KR100272255B1 (ko) | 박막트랜지스터제조방법 | |
KR100696264B1 (ko) | 박막트랜지스터의 제조방법 | |
KR100648214B1 (ko) | 박막 트랜지스터 액정표시장치의 제조방법 | |
KR100637059B1 (ko) | 액정표시소자의 제조방법 | |
JP2692914B2 (ja) | 薄膜トランジスタの製造方法 | |
KR100275957B1 (ko) | 박막트랜지스터의 제조방법 | |
KR100336890B1 (ko) | 박막트랜지스터액정표시소자의제조방법 | |
KR20070042451A (ko) | 막의 패턴형성방법 및 박막 트랜지스터의 제조 방법과 박막트랜지스터 기판의 제조 방법 및 박막 트랜지스터 기판 | |
KR100776505B1 (ko) | 액정표시장치의 화소전극 제조 방법 | |
KR100696262B1 (ko) | 액정표시장치의 제조방법 | |
KR100658057B1 (ko) | 박막 트랜지스터의 제조 방법 | |
KR20060021531A (ko) | 박막트랜지스터 액정표시장치의 어레이 기판 제조방법 | |
KR100613767B1 (ko) | 박막 트랜지스터 액정 표시소자의 제조방법 | |
KR100752370B1 (ko) | 박막트랜지스터 및 그 제조 방법 | |
KR20060057874A (ko) | 트랜지스터의 제조 방법 및 어레이 기판의 제조 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20120928 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20130930 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20141021 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20151028 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20161012 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20171016 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20181015 Year of fee payment: 13 |