KR100634862B1 - 방열부를 구비한 냉각 유닛과, 냉각 유닛이 탑재된 전자장치 - Google Patents

방열부를 구비한 냉각 유닛과, 냉각 유닛이 탑재된 전자장치 Download PDF

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Publication number
KR100634862B1
KR100634862B1 KR1020050036433A KR20050036433A KR100634862B1 KR 100634862 B1 KR100634862 B1 KR 100634862B1 KR 1020050036433 A KR1020050036433 A KR 1020050036433A KR 20050036433 A KR20050036433 A KR 20050036433A KR 100634862 B1 KR100634862 B1 KR 100634862B1
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South Korea
Prior art keywords
heat dissipation
heat
impeller
passage
housing
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Expired - Fee Related
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KR1020050036433A
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English (en)
Korean (ko)
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KR20060047669A (ko
Inventor
유키히코 하타
겐타로 도미오카
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가부시끼가이샤 도시바
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020050036433A 2004-04-30 2005-04-29 방열부를 구비한 냉각 유닛과, 냉각 유닛이 탑재된 전자장치 Expired - Fee Related KR100634862B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00136727 2004-04-30
JP2004136727A JP4377742B2 (ja) 2004-04-30 2004-04-30 放熱器、冷却装置および冷却装置を有する電子機器

Publications (2)

Publication Number Publication Date
KR20060047669A KR20060047669A (ko) 2006-05-18
KR100634862B1 true KR100634862B1 (ko) 2006-10-17

Family

ID=34939292

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050036433A Expired - Fee Related KR100634862B1 (ko) 2004-04-30 2005-04-29 방열부를 구비한 냉각 유닛과, 냉각 유닛이 탑재된 전자장치

Country Status (6)

Country Link
US (1) US7539009B2 (https=)
EP (1) EP1591872A3 (https=)
JP (1) JP4377742B2 (https=)
KR (1) KR100634862B1 (https=)
CN (1) CN100377633C (https=)
TW (1) TWI266590B (https=)

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JP4056504B2 (ja) 2004-08-18 2008-03-05 Ｎｅｃディスプレイソリューションズ株式会社 冷却装置及びこれを備えた電子機器
US7218515B2 (en) * 2005-05-19 2007-05-15 Hewlett-Packard Development Company, L.P. Cooling fan with external circuit board
JP4842040B2 (ja) 2006-07-25 2011-12-21 富士通株式会社 電子機器
JP4781929B2 (ja) 2006-07-25 2011-09-28 富士通株式会社 電子機器
JP5283836B2 (ja) 2006-07-25 2013-09-04 富士通株式会社 液冷ユニット用受熱器および液冷ユニット並びに電子機器
JP2008027374A (ja) 2006-07-25 2008-02-07 Fujitsu Ltd 液冷ユニット用受熱器および液冷ユニット並びに電子機器
JP2008027370A (ja) 2006-07-25 2008-02-07 Fujitsu Ltd 電子機器
JP5133531B2 (ja) * 2006-07-25 2013-01-30 富士通株式会社 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
JP5148079B2 (ja) 2006-07-25 2013-02-20 富士通株式会社 液冷ユニット用熱交換器および液冷ユニット並びに電子機器
KR101239975B1 (ko) * 2007-08-28 2013-03-06 삼성전자주식회사 정보처리장치
JP4724197B2 (ja) * 2008-03-27 2011-07-13 富士通株式会社 電子機器
US8432679B2 (en) 2010-06-15 2013-04-30 Apple Inc. Silicone barrier for drive window
JP5310706B2 (ja) * 2010-12-06 2013-10-09 富士通株式会社 電子機器
WO2014035362A1 (en) * 2012-08-27 2014-03-06 Razer (Asia-Pacific) Pte. Ltd. Computer systems, parts of a housing for a computer system, heat exchangers, and methods for assembling parts of a computer system
US20150226492A1 (en) * 2014-02-12 2015-08-13 Asia Vital Components Co., Ltd. Heat Pipe Structure and Thermal Module Using Same
WO2015167419A1 (en) * 2014-04-28 2015-11-05 Hewlett-Packard Development Company, L.P. A heat-dissipating device including a vapor chamber and a radial fin assembly
TWI636724B (zh) * 2017-03-01 2018-09-21 雙鴻科技股份有限公司 具有散熱功能的電子設備及其水冷排總成
CN110162157A (zh) 2019-03-29 2019-08-23 联想(北京)有限公司 散热系统
CN112486291B (zh) * 2019-09-12 2023-04-28 英业达科技有限公司 散热系统
CN112788910A (zh) * 2019-11-08 2021-05-11 研能科技股份有限公司 行动装置散热组件
CN113655868B (zh) * 2020-05-12 2025-03-25 中兴通讯股份有限公司 散热结构、散热方法、终端及存储介质
US12457723B2 (en) 2022-03-30 2025-10-28 Hl Mando Corporation Electromagnetic shielding housing and electromagnetic shielding circuit unit
KR102876541B1 (ko) * 2022-03-30 2025-10-30 에이치엘만도 주식회사 전자파 차폐형 하우징 및 회로 유닛

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Publication number Priority date Publication date Assignee Title
JP3458527B2 (ja) 1995-05-26 2003-10-20 松下電器産業株式会社 ヒートシンク装置
JPH10209659A (ja) 1997-01-20 1998-08-07 Fujikura Ltd 冷却ファンを有する冷却システム
JPH10303582A (ja) * 1997-04-22 1998-11-13 Toshiba Corp 回路モジュールの冷却装置および回路モジュールを搭載した携帯形情報機器
US6111748A (en) * 1997-05-15 2000-08-29 Intel Corporation Flat fan heat exchanger and use thereof in a computing device
US6118655A (en) * 1997-12-08 2000-09-12 Compaq Computer Corporation Cooling fan with heat pipe-defined fan housing portion
US6333850B1 (en) * 1999-02-05 2001-12-25 Foxconn Precision Components Co., Ltd. Heat sink system
US6832646B1 (en) * 1999-02-26 2004-12-21 Nippon Thermostat Co., Ltd. Cooler for electronic device
TW540982U (en) * 2000-03-21 2003-07-01 Neng-Chau Jang Liquid and air cooling heat sink device used in computer CPU
JP4386219B2 (ja) * 2000-03-31 2009-12-16 富士通株式会社 放熱機構及び当該放熱機構を有する電子機器
US6407916B1 (en) * 2000-06-12 2002-06-18 Intel Corporation Computer assembly for cooling high powered microprocessors
US6328097B1 (en) * 2000-06-30 2001-12-11 Intel Corporation Integrated heat dissipation apparatus
JP2002151638A (ja) * 2000-11-08 2002-05-24 Hitachi Ltd 電子機器の冷却装置
JP3594238B2 (ja) * 2001-03-29 2004-11-24 インターナショナル・ビジネス・マシーンズ・コーポレーション 電子機器用冷却装置及び電子機器
JP3519710B2 (ja) 2001-09-21 2004-04-19 株式会社東芝 冷却装置及び冷却装置を内蔵した電子機器
JP3637304B2 (ja) * 2001-11-29 2005-04-13 株式会社東芝 小型電子機器
JP4126929B2 (ja) 2002-03-01 2008-07-30 ソニー株式会社 放熱装置及び情報処理装置
US20030214786A1 (en) * 2002-05-15 2003-11-20 Kyo Niwatsukino Cooling device and an electronic apparatus including the same
JP3673249B2 (ja) * 2002-08-27 2005-07-20 株式会社東芝 電子機器および冷却装置
JP2004139187A (ja) * 2002-10-15 2004-05-13 Toshiba Corp 電子機器
JP3981628B2 (ja) * 2002-11-28 2007-09-26 株式会社東芝 冷却用ポンプ並びに電気機器及びパーソナルコンピュータ

Also Published As

Publication number Publication date
JP4377742B2 (ja) 2009-12-02
EP1591872A3 (en) 2007-02-14
EP1591872A2 (en) 2005-11-02
US7539009B2 (en) 2009-05-26
JP2005317877A (ja) 2005-11-10
TW200601954A (en) 2006-01-01
KR20060047669A (ko) 2006-05-18
CN1694611A (zh) 2005-11-09
TWI266590B (en) 2006-11-11
US20050243511A1 (en) 2005-11-03
CN100377633C (zh) 2008-03-26

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