KR100614187B1 - Substrate processing method and apparatus - Google Patents

Abstract

In the substrate processing method and apparatus of the present invention, treatment (cleaning treatment, drying treatment) by a processing liquid or a processing gas is performed between a pair of holding plates 14 and 30 that are pressed and held through the substrate 10 to be processed. In this case, the processing region of the substrate to be processed is limited by the elastic members 18 and 34 such as an O-ring. The processing liquid or the processing gas is supplied and discharged through the hole near the bottom of the spherical recesses 16 and 32 formed in the respective holding plates. However, a cleaning liquid or pure water is used as the treatment liquid, and an inert gas such as N ₂ (nitrogen) is used as the treatment gas. Moreover, it is applicable also to the plasma etching apparatus by a microwave discharge plasma.

Description

Substrate processing method and apparatus

BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows the mode which moves out a to-be-processed board | substrate with respect to the single wafer type substrate processing apparatus which concerns on 1st Example of this invention.

It is sectional drawing along the XX 'line | wire of FIG. 1 which shows the state which press-holds a to-be-processed board | substrate between the holding plates of the said substrate processing apparatus, and performs a washing process.

3 is a cross-sectional view showing the first modification of the substrate processing apparatus according to the first embodiment.

4 is a cross-sectional view showing the second modification of the substrate processing apparatus according to the first embodiment.

FIG. 5 is a cross-sectional view showing a state in which a cleaning treatment is performed on a substrate to be processed in the sheet type substrate processing apparatus according to the second embodiment of the present invention.

FIG. 6 is a cross-sectional view showing a state in which the substrate to be processed is cleaned in the sheet type substrate processing apparatus according to the third embodiment of the present invention.

FIG. 7 is a cross sectional view of an essential part showing how the substrate to be processed is cleaned in the sheet type substrate processing apparatus according to the fourth embodiment of the present invention. FIG.

Fig. 8 shows a modification of the fourth embodiment of the present invention, and is a sectional view of the essential parts showing a state in which a cleaning process is performed on a substrate to be processed in a sheet type substrate processing apparatus.

It is sectional drawing which shows an example of the principal part structure of the conventional single wafer type substrate processing apparatus.

FIG. 10 shows a sheet type substrate processing apparatus according to a fifth embodiment of the present invention, and is an application example to a plasma etching apparatus.

It is a perspective view which shows the principal part of the sheet | seat type | mold substrate processing apparatus which concerns on 6th Example of this invention.

<Explanation of symbols for the main parts of the drawings>

10: substrate to be processed 18, 34, 80, 82: O-ring

12a, 12b: Robot Arm 20, 22, 36, 38, 88, 90: Pipe

14, 30: holding plate 24, 26: guide member

16, 32: recessed part 24A, 30A: drive arm

16a, 16b, 32a, 32b, 30a, 84a, 86a, 86b, 16c, 32c: hole

28: support 84: cover member

28A, 28B: bearing 28C: support shaft

92, 96: Euro 94a, 94b: spacer

The present invention relates to a sheet type substrate processing method and apparatus for treating a substrate such as a semiconductor substrate with cleaning, drying, and the like.

Conventionally, what is shown in FIG. 9 is known as a single wafer processing apparatus (for example, see Japanese Patent Laid-Open No. 11-176787).

In the substrate processing apparatus of FIG. 9, the substrate mounting base 2 which holds the substrate 1 to be processed by engaging the fixing pieces 2a and 2b is fixed to the upper surface of the spin base 3, and this spin base 3 is rotatably held by the hollow rotating shaft 3a. The board | substrate mounting stand 2 is provided in the closed loop shape along the outer periphery of the board | substrate 1, and has the hole 2A, 2B which communicates from the inner side of this closed loop to the outer side.

The bottom cover 4 is provided below the spin base 3. Moreover, the upper cover 5 which covers the board | substrate 1, the spin base 3, the bottom cover 4, etc. is provided. A partition 6 is provided between the upper cover 5 and the lower cover 4. The inner peripheral portion of the partition 6 is combined with the outer peripheral portion of the substrate mounting table 2 to form a labyrinth structure 6a. By this labyrinth structure 6a, the board | substrate mounting base 2 can be rotated in the liquid sealing state. A discharge path 7 is formed between the bottom cover 4 and the partition 6, and similarly, a discharge path 8 is also formed between the top cover 5 and the partition 6. The upper cover 5 has a supply pipe 5a.

At the time of a process, the board | substrate 1 is rotated by the rotating shaft 3a, and supplies a process liquid from the supply pipe 5a to the upper surface 1a of the board | substrate 1, and discharges it from the discharge path 8. Further, the processing liquid is supplied to the lower surface 1b of the substrate 1 through the hollow portion of the rotating shaft 3a and discharged from the discharge path 7. In this way, the washing | cleaning process can be performed simultaneously with respect to the upper surface 1a and the lower surface 1b of the board | substrate 1. As shown in FIG. Moreover, if desired, predetermined treatment (for example, etching treatment) can be performed on only one of the upper surface 1a or the lower surface 1b.

As described above, the conventional technique has a problem in that the amount of the processing liquid is increased because the processing liquid is circulated on both sides of the substrate 1 over a wide area from the center portion beyond the cross section. Moreover, in the prior art, since the substrate 1 is rotated or the partition 6 or labyrinth structure 6a is formed, there is also a problem in that the apparatus is enlarged.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a novel substrate cleaning method capable of reducing the amount of processing liquid or processing gas used. Another object of the present invention is to provide a compact substrate processing apparatus with a low amount of processing liquid or processing gas.

In the substrate processing method and apparatus of the present invention, treatment (cleaning treatment, drying treatment) with a processing liquid or a processing gas is performed between a pair of holding plates that are pressed and held through a substrate to be treated. The processing region of the substrate to be processed is defined by an elastic member such as a ring.

In detail, concave portions are formed in each of the upper and lower retaining plates corresponding to the substrate to be inserted, and an O-ring of a closed loop shape is arranged to surround the concave portion. That is, the main surfaces on both sides of the substrate to be processed are pressed and held between the upper and lower holding plates via the O-rings, thereby limiting the treatment region. Each recessed part is formed in spherical shape, for example, and two holes are formed in the vicinity of the bottom part. That is, the processing liquid or the processing gas is supplied from one hole into the recessed portion of the holding plate, and the inside of the recessed portion is passed through and then discharged into the other hole. Thereby, the process by a process liquid or a process gas is performed with respect to each main surface of a to-be-processed substrate. Specifically, a cleaning treatment is performed on the main surface of the substrate to be treated using a cleaning liquid or pure water as the treatment liquid, or a drying treatment is performed using an inert gas such as N ₂ as the treatment gas.

In this case, only one surface of the substrate to be processed may be processed, or both surfaces may be processed simultaneously. In addition, the processing range need not be limited to the main surface of the substrate to be processed, and the cross section or the like may be the processing target. That is, a cover member is provided so as to cover the superposition body which consists of a holding plate which pressed-processed the to-be-processed board | substrate, and the said engagement part is pressed to the end surface of a holding plate through the closed loop-shaped O-ring. As a result, a closed loop flow path is formed along the cross section of the substrate to be processed, and the processing liquid or the processing gas is passed through the passage so that the cross section of the substrate to be processed or a portion thereof is processed.

In the above description, a plurality of spacers may be provided in place of the O-ring between one main surface of the substrate to be processed and the holding plate disposed to face each other. In this case, the cross section of the substrate to be processed and the main surface on the spacer side can be simultaneously processed.

As a method of supplying / discharging the processing liquid or the processing gas to the substrate to be processed, not only the supply-discharging through the hole formed in the recessed portion of each holding plate but also various methods can be adopted. For example, the hole which communicates with the bottom part of the recessed part of a holding plate is formed, and two types of pipes are made to pass through it. That is, the processing liquid or the processing gas is supplied to the nozzle disposed in the concave portion through one pipe, and the processing liquid or the processing gas is jetted and supplied from the jet port to the main surface of the substrate to be processed, and then the other pipe is supplied. It may be discharged to the outside through.

In addition, the holding plate or the like may be appropriately rotated to improve processing efficiency and processing uniformity. Moreover, this invention can also be applied easily also to the plasma etching apparatus by a microwave discharge.

As mentioned above, in this invention, since a process area | region is defined beforehand when processes, such as a washing | cleaning and drying, with respect to board | substrates, such as a semiconductor substrate, the usage-amount of a process liquid or a process gas can be reduced.

<Embodiment of the invention>

<First Embodiment>

Fig. 1 shows a sheet type substrate processing apparatus according to a first embodiment of the present invention, wherein a substrate 10 such as a semiconductor substrate (wafer) has a robot arm 12a, It enters and exits in the direction of arrow A in the state maintained by 12b).

The holding plate 14 provided in the lower portion of the substrate processing apparatus is, for example, rectangular in shape, and has a size slightly larger than that of the substrate 10 to be processed. In the central portion of the main surface of the holding plate 14, a spherical concave portion 16 for flowing-circulating the processing liquid or the processing gas is formed. The O-ring 18 is provided to surround the concave portion 16. The O-ring 18 is made of an elastic member such as rubber or plastic, and the substrate 10 to be processed is disposed on the O-ring 18. 2 is a cross-sectional view taken along the line X-X 'of FIG.

The holding plate 14 is provided with holes 16a and 16b communicating from the inside of the concave portion 16 to the outside (back side of the holding plate 14), and the holes 16a and 16b are each provided with a pipe ( 20 and 22 are connected. On both sides of the retaining plate 14, portions 14a and 14b cut out at opposing positions via the recessed portions 16 are formed. These cut out portions 14a and 14b are fitted to the distal ends of the robot arms 12a and 12b, respectively.

A support shaft 28C is provided on the side of the end face 14s of the holding plate 14, and the support shaft 28C is supported by the bearings 28A and 28B provided on the support 28 so as to be rotatable. have. Moreover, two guide members 24 and 26 are erected at predetermined intervals substantially along the support shaft 28C in the vicinity of the end face 14s of the holding plate 14.

On the other hand, the holding plate 30 provided on the upper side of the substrate processing apparatus has two holes respectively fitted to the tip portions of the guide members 24 and 26. That is, the holding plate 30 is guided by the guide members 24 and 26 so that it can move to an up-down direction. The upper retaining plate 30 has a rectangular shape similar to the lower retaining plate 14, and is substantially the same size as the retaining plate 14. Both the holding plates 14 and 30 can be formed by processing metal or plastic, and can be formed in any shape other than a rectangle such as a circle or an ellipse.

The main surface of the holding plate 30 faces downward against the holding plate 14, and a spherical concave portion 32 for flowing-circulating the processing liquid or the processing gas is formed in the center thereof. That is, the recessed part 32 of the retaining plate 30 is formed corresponding to the recessed part 16 of the retaining plate 14. An O-ring 34 is provided to surround the concave portion 32. The O ring 34 is made of the same elastic member as the O ring 18. As a material suitable for these O-rings 18 and 34, fluorine-containing materials, such as fluororubber, are mentioned, for example.

The holding plate 30 is formed with holes 32a and 32b communicating from the inside of the concave portion 32 to the outside (back side of the holding plate 30). Pipes 36 and 38 are connected to these holes 32a and 32b, respectively. On both sides of the retaining plate 30, portions 30a and 30b cut out at opposing positions via the concave portions 32 are formed. The cutout portions 30a and 30b of the holding plate 30 correspond to the cutout portions 14a and 14b of the holding plate 14, respectively. That is, when the retaining plate 30 is lowered and folded on the retaining plate 14, the robot arms 12a and 12b are formed in a space formed by the corresponding cut portions 30a and 14a and the cut portions 30b and 14b. The leading ends of are each inserted-fit. 30 A of drive arms are provided in the vicinity of the side surface in which the part 30a cut out from the back surface side of the holding plate 30 is formed, and the holding plate 30 is shown by arrow B by this drive arm 30A. It is driven in the vertical direction.

At the time of processing, the substrate 10 to be processed is placed on the O-ring 18 of the holding plate 14, and then the holding plate 30 is guided by the driving members 30A to guide the guide members 24 and 26. Therefore, it is lowered and piled on the to-be-processed substrate 10 through the O-ring 34. In this way, the substrate 10 to be processed is pressed and held between the holding plates 14 and 30. The board | substrate 10 is formed in substantially disk shape, and has the 1st, 2nd surface 10a, 10b which contact | connects the holding plate 14, 30 side, respectively. That is, in the state where the board | substrate 10 was sandwiched between the holding plates 14 and 30 as shown in FIG. 2, with respect to the 1st surface 10a to the O-ring 18 of the holding plate 14 side. The first processing region enclosed by the display is limited and the second processing region enclosed by the O-ring 34 on the holding plate 30 side with respect to the second surface 10b is defined. Thereafter, the processing liquid or the processing gas is supplied into the recessed portion 16 through the pipe 20 and the hole 16a on the holding plate 14 side, and circulates in the recessed portion 16 to circulate the hole 16b and the pipe. Through 22. Thereby, a process can be performed with respect to the 1st process area | region of the board | substrate 10. FIG. Further, the processing liquid or the processing gas is supplied into the recessed portion 32 through the pipe 36 and the hole 32a on the holding plate 30 side, and circulates in the recessed portion 32 to circulate the hole 32b and the pipe. Discharge through 38. Thereby, a process can be performed with respect to the 2nd process area | region of the board | substrate 10. FIG.

In the above processing, when the cleaning liquid, pure water or the like is used as the processing liquid, the substrate 10 can be cleaned. In addition, when an inert gas such as N ₂ is used as the processing gas, the substrate 10 can be dried. Or you may make it switch to a drying process after a washing process. When using a process liquid, you may connect a vacuum pump to a discharge side (namely, the pipes 22 and 38 side). When using process gas, you may supply pressurized gas from a supply side (namely, the pipes 20 and 36 side). If necessary, the processing liquid or the processing gas may be different for the first and second processing regions of the substrate 10 to be processed, or one of the processing liquids may be used as the processing liquid and the other may be used as the processing gas. .

In the substrate processing apparatus according to the first embodiment shown in FIGS. 1 and 2, since the first and second processing regions of the substrate 10 to be processed are defined by the O rings 18 and 34, respectively, the processing liquid or The amount of processing gas used can be reduced. Moreover, since the size of the holding plates 14 and 30 is a little larger than the to-be-processed board | substrate 10, it is not necessary to provide the rotational motion mechanism of the to-be-processed board | substrate 10, and the miniaturization of the whole board | substrate processing apparatus can be realized have.

In addition, when the processing is simultaneously performed on the first and second processing regions of the substrate 10 to be processed, the overall processing efficiency can be improved. Since spherical internal shapes were adopted for both of the concave portions 16 and 32 of the holding plates 14 and 30 in contact with the substrate 10 to be processed, the flow of the processing liquid or the processing gas was smoothed, and the processing uniformity. Can improve the sex.

However, 24 A of drive arms are provided in the front-end | tip of the guide member 24, and, thereby, the rotational movement angle of the superposition body which consists of the holding plates 14 and 30, the board | substrate 10, etc. can be controlled. In other words, by moving the drive arm 24A in the direction of the arrow C, the rotational movement angle of the superposed body can be arbitrarily controlled by the principle of lever with the support shaft 28C as the supporting point. For example, before the start of the treatment, the rotational movement angle of the superposed body can be set in advance so that the flow of the treatment liquid becomes smooth. During processing, the rotational movement angle of the superposed body may be changed periodically or aperiodically. Thus, by adjusting the rotational movement angle of a superposition body, process uniformity and process efficiency can be improved further.

Various modifications can be configured with respect to the substrate processing apparatus according to the first embodiment. FIG. 3 shows a first modification of the substrate processing apparatus, and the same components as those shown in FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description thereof will be omitted.

The characteristic of the 1st modification shown in FIG. 3 is the change of the arrangement | positioning of the hole of the holding plates 14 and 30, and a pipe. That is, a hole 16c is formed in the bottom of the recessed part 16 with respect to the holding plate 14, and it connects with the pipe 42, and the pipes 40a and 40b are respectively connected to the holes 16a and 16b from the side surface. do. In addition, a hole 32c is formed in the bottom of the concave portion 32 with respect to the holding plate 30 to connect with the pipe 46, and the pipes 44a and 44b are respectively provided in the holes 32a and 32b from the side surface. Connect. First, the processing liquid or the processing gas is supplied from the pipes 40a and 40b on both sides of the holding plate 14 into the recessed portion 16 to circulate the inside of the recessed portion 16, and then the hole 16c and the pipe 42 Discharge to the outside through). Moreover, after supplying a process liquid or process gas from the pipes 44a and 44b of both sides of the holding plate 30 to the recessed part 32, and circulating in the recessed part 32, the hole 32c and the pipe 46 Discharge to the outside through). With the above configuration, the flow of the processing liquid or the processing gas can be made more smooth, and the processing uniformity and the processing efficiency can be improved.

In the first modification shown in FIG. 3, the flow path of the processing liquid or the processing gas may be reversed. That is, the processing liquid or the processing gas may be introduced into the concave portion 16 through the pipe 42 and the hole 16c and discharged to the outside through the holes 16a and 16b and the pipes 40a and 40b. Similarly, the processing liquid or the processing gas may be introduced into the concave portion 32 through the pipe 46 and the hole 32c, and discharged to the outside through the holes 32a and 32b and the pipes 44a and 44b. It is not necessary to limit the number of the holes 16a and 16b to two, and a plurality of holes 16a and 16b may be distributed along the inner circumferential surface of the concave portion 16. Similarly, the holes 32a and 32b need not be limited to two, and a plurality of holes 32a and 32b may be distributed along the inner circumferential surface of the concave portion 32.

FIG. 4 shows a second modified example of the substrate processing apparatus, and the same components as those shown in FIGS. 1 and 3 are denoted by the same reference numerals, and detailed description thereof will be omitted. The characteristic of the second modification shown in Fig. 4 is that the inner shape of the concave portions 16 and 32 of the retaining plates 14 and 30 is not spherical but rather slightly rounded. Although functionally not so different from the above, there is an effect that processing of the holding plate becomes simple as compared with making the concave portion spherical.

Second Embodiment

FIG. 5 shows the sheet processing apparatus according to the second embodiment of the present invention, and since the same configuration as that of the first embodiment shown in FIG. 1 is partially employed, the same components as those shown in FIG. Are given the same reference numerals.

Also in the second embodiment, the substrate 10 to be processed is interposed between the holding plates 14 and 30 via the O-rings 18 and 34 to be pressed and held. Unlike the first embodiment, the upper holding plate 30 is not formed with a concave portion facing the surface of the substrate 10. Moreover, in the recessed part 16 of the lower holding plate 14, the plate-shaped member 50a of the movable nozzle 50 is arrange | positioned. This dish-shaped member 50a is covered by the disk 50b which has many ejection openings. That is, the movable nozzle 50 is arrange | positioned in the recessed part 16 of the holding plate 14 so that the ejection opening of the original plate 50b may face the opening part of the recessed part 16. As shown in FIG.

A hole 16c is formed in the bottom of the recessed portion 16 of the retaining plate 14, and the pipe 52 having an outer diameter smaller than the inner diameter of the hole 16c is recessed through the hole 16c. It is connected to the movable nozzle 50 inside. In addition, one end of the pipe 54 is connected to the hole 16c, extends downward from the hole 16c, and is bent in an L shape. The pipe 52 extends downward in the pipe 54, is led outward through the sealing member 56 from the L-shaped bent portion, and extends downward. That is, the pipe 52 is attached to the pipe 54 by the sealing member 56 so that the liquid can be rotated in a liquid sealed state and can be driven up and down.

A support 60 is provided below the retaining plate 14 and the pipe 54. A flange 58 is provided in the pipe 52 extending below the sealing member 56, and the flange 58 is rotatably supported by the bearing 62 of the support 60. . A motor (M) 64 is provided on the support 60 having a substantially U-shaped cross section, and its rotation is transmitted to the pipe 52 through the power transmission mechanism 66. That is, the pipe 52 is driven to rotate in the direction of the arrow P by the motor 64.

The support 60 is disposed on the vertical drive device 68 disposed on the support surface 70. In other words, the support 60 is driven in the vertical direction as shown by an arrow Q through the driving rods 68a and 68b of the vertical drive device 68. According to the vertical drive of the support 60, the pipe 52 is also driven to an up-down direction. Therefore, the movable nozzle 50 in the recessed part 16 of the holding plate 14 rotates with the pipe 52, and will drive up and down. However, the pipe 52 supports the movable nozzle so that a slight clearance may arise between the lower surface of the movable nozzle 50 and the bottom surface of the recessed part 16, even if the movable nozzle 50 drives up and down.

The pipe 52 extends downward through the hole 70a of the support surface 70, and its lower end part is immersed in the processing liquid 74 filled in the container 72. As shown in FIG. When one end of the pipe 54 is connected to a pump (not shown) to depressurize the inside of the recessed portion 16 of the retaining plate 14, the processing liquid 74 in the container 72 rises inside the pipe 52. A surface that reaches the movable nozzle 50 and is ejected from a plurality of ejection openings of the disc 50b covering the dish-shaped portion 50a and surrounded by the processing region (ie, the O-ring 18) of the substrate 10 to be processed. Part). Thereafter, the processing liquid is discharged from the pipe 54 to the outside through a gap between the movable nozzle 50 and the bottom of the concave portion 16 and the hole 16c. As a result, processing (for example, cleaning processing) with the processing liquid is performed to the processing region of the substrate 10 to be processed.

Also in the substrate processing apparatus according to the second embodiment shown in FIG. 5, the amount of the processing liquid used can be reduced similarly to the first embodiment shown in FIG. 1. In addition, since the processing liquid is supplied to the processing region of the substrate 10 to be processed from a plurality of jetting ports formed in the disc 50b of the movable nozzle 50, the processing efficiency can be improved. In addition, the size of the holding plates 14 and 30 is a little larger than the substrate 10 to be processed, and the rotation mechanism is unnecessary with respect to the substrate 10 as in the first embodiment. In the second embodiment, since the processing liquid is supplied and discharged through the holes 16c formed at the bottom of the concave portion 16 of the holding plate 14, the entire substrate processing apparatus can be miniaturized. When the movable nozzle 50 is properly rotated or driven up and down during the processing, the processing efficiency and the processing uniformity are further improved. In the second embodiment, the treatment of the substrate 10 with the treatment liquid has been described, but instead of the treatment liquid, the treatment gas may be circulated to perform the drying treatment of the substrate 10.

Third Embodiment

FIG. 6 shows a sheet type substrate processing apparatus according to a third embodiment of the present invention, and since the same configuration as that of each of the embodiments shown in FIGS. Are given the same reference numerals. That is, in the substrate processing apparatus according to the third embodiment shown in FIG. 6, the lower portion of the substrate 10 and the holding plate 14 adopt the same configuration as that of the second embodiment shown in FIG. 5. The detailed description thereof is omitted. In addition, the upper part of the to-be-processed substrate 10 applies the structure of 2nd Example.

Similarly to the above embodiment, also in the third embodiment, the substrate 10 to be processed is interposed between the holding plates 14 and 30 at the time of processing, and is pressed and held through the O-rings 18 and 34. In addition, concave portions 16 and 32 are formed on both sides of the holding plates 14 and 30, respectively, similarly to the first embodiment, so that both surfaces of the substrate 10 can be processed. That is, the region to be treated is defined by the concave portion 16 and the O-ring 18 of the retaining plate 14 with respect to the lower side of the substrate 10 to be processed, and the retaining plate 30 also with respect to the upper side thereof. The treatment region is defined by the concave portion 32 and the O-ring 34 of FIG.

As in the second embodiment, in the concave portion 16 of the retaining plate 14, the plate-shaped portion 50a of the movable nozzle 50 is covered with a disc 50b having a plurality of ejection openings. In the third embodiment, the plate-shaped portion 150a of the movable nozzle 150 is also covered with the disc 150b having a plurality of jet holes in the recessed portion 32 of the holding plate 30. Moreover, the blowing port of the disc 150b faces the opening part of the recessed part 32. As shown in FIG.

The pipe 152 extending upward from the retaining plate 30 has an outer diameter smaller than the inner diameter of the hole 32c formed at the bottom of the concave portion 32 of the retaining plate 30, and through the hole 32c. It is connected to the movable nozzle 150. The pipe 154 is also connected to the hole 32c, extends upward from the hole 32c, and is bent in an L shape. The pipe 152 extends upward in the pipe 154 and is led out of the L-shaped bent portion of the pipe 154 through the sealing member 156 and extends upward. The pipe 152 is attached to the pipe 154 so as to be rotatable in a sealed state by the sealing member 156 and to be able to be driven up and down.

Furthermore, the support base 160 provided with the motor (M) 164 is provided upward, and the flange 158 with which the pipe 152 was equipped is rotatably supported by the bearing 162 of the support 160. It is. Rotation of the motor 164 is transmitted to the pipe 152 through the power transmission mechanism 166. That is, the pipe 152 is driven to rotate in the direction of the arrow P 'by the motor 164.

The support base 160 is connected with the up-and-down drive device 168 provided in the support surface 170, and is shown by the arrow Q 'through the drive rods 168a and 168b of the up-and-down drive device 168. It is driven in the vertical direction. In addition to the vertical drive of the support 160, the pipe 152 is also driven in the vertical direction. Therefore, the movable nozzle 150 in the recessed part 32 of the holding plate 30 will rotate and drive up and down with the pipe 152. However, regardless of the vertical movement of the movable nozzle 150, the pipe 152 opens the movable nozzle 150 so that a gap is formed between the movable nozzle 150 and the bottom surface of the concave portion 32 of the retaining plate 30. I support it.

The pipe 152 extends upwardly through the holes 170a of the support surface 170 and then bends in the horizontal direction and is bent L-shaped downwards, so that the upper end thereof is filled in the container 172. It is immersed into the liquid 174. The support mechanism made of the support surface 170 and the like can be driven up and down together with the retaining plate 30 by being connected to the retaining plate 30. When the one end of the pipe 154 is connected with a pump (not shown) to depress the concave portion 32 of the holding plate 30, the processing liquid 174 in the container 172 rises and falls inside the pipe 152. Reaching the movable nozzle 150 and ejecting downward from a plurality of ejection openings of the original plate 150b covering the dish-shaped portion 150a, that is, the processing region (ie, the O-ring 34 on the upper side of the substrate 10). Is enclosed). Thereafter, the processing liquid is discharged from the pipe 154 to the outside through the gap and the hole 32c between the movable nozzle 150 and the bottom surface of the concave portion 32 of the holding plate 30. As a result, the processing areas on both sides of the substrate 10 to be processed can be processed (for example, washed) simultaneously with the processing liquid.

Also in the substrate processing apparatus according to the third embodiment shown in FIG. 6, the same effects as those of the second embodiment shown in FIG. 5 can be obtained. In the third embodiment, since both surfaces of the substrate 10 can be processed simultaneously, the processing effect can be further improved. However, in the third embodiment, the processing gas may be passed in place of the processing liquid to perform the drying treatment of the substrate 10 to be processed.

Fourth Example

Fig. 7 shows a sheet type substrate processing apparatus in accordance with a fourth embodiment of the present invention, in which like parts have been assigned the same reference numerals.

Also in the fourth embodiment, the substrate 10 to be processed is interposed between the holding plates 14 and 30 at the time of processing, and is pressed and held through the O-rings 18 and 34. Unlike the respective embodiments described above, concave portions are not formed in any of the holding plates 14 and 30, and the substrate 10 to be processed is merely connected between the holding plates 14 and 30 through the O-rings 18 and 34. It is fitted. The O-ring 18 is provided in a closed loop shape so as to surround an inner predetermined area of the holding plate 14 main surface, and the O-ring 34 surrounds an inner predetermined area of the main plate 30 main surface. It is installed in a closed loop shape.

In addition, a separate O-ring 80 is provided in a closed loop shape along the cross section of the retaining plate 14, and similarly, a separate O-ring 82 is closed in a closed loop shape along the cross section of the retaining plate 30. It is installed. These O-rings 80 and 82 are both made of an elastic member such as rubber or plastic.

The cover member 84 covers the overlapped body in the state in which the holding plates 14 and 30 were pressed and held through the to-be-processed substrate 10. That is, the cover member 84 has the recessed part 86 which receives the superposition body which consists of the holding plates 14 and 30, the to-be-processed substrate 10, etc. The side wall of the recessed part 86 is comprised by the closed loop shaped engaging part 86A. The engagement portion 86A engages with the O-rings 80 and 82, respectively, in the state where the overlap is inserted into the recessed portion 86 of the cover member 84. As shown in FIG. In addition, holes 86a and 86b communicating with the outside are formed in the engaging portion 86A, and these holes are located between the O-rings 80 and 82 when the superposed body is inserted. In addition, the pipes 88 and 90 are connected to the holes 86a and 86b, respectively.

The engagement portion 86A is pressed against the end faces of the holding plates 14 and 30 by the holding means (not shown) through the O-rings 80 and 82, respectively. As a result, the inside of the overlapped body via the substrate 10 is sealed by the inner walls of the O-rings 80 and 82 and the engaging portion 86A, and flows along the cross section of the substrate 10 to be processed. A flow path 92 of fluid is formed. That is, the processing liquid or the processing gas is supplied into the flow path 92 from the pipe 88 connected to the hole 86a and then discharged from the pipe 90 connected to the hole 86b. At this time, the processing liquid or the processing gas flows through the flow path 92 so that the processing (for example, a cleaning process or a drying process) is performed on the end surface of the substrate 10 or in the vicinity thereof.

In the substrate processing apparatus according to the fourth embodiment shown in FIG. 7, the processing liquid or the processing gas flow path 92 is limited to a closed loop path along the cross section of the substrate 10 to be processed. The amount of gas used is small. Although it is difficult to process the cross section of the to-be-processed board | substrate 10 in the board | substrate processing apparatus which concerns on each said Example, the cross section of the to-be-processed board | substrate 10 can be limitedly processed by the board | substrate processing apparatus which concerns on 4th Example. . Therefore, the fourth embodiment may be used to process the cross section of the substrate 10 to be processed which has not been processed in the above embodiments.

FIG. 8 shows a modification of the fourth embodiment shown in FIG. 7, the same components are given the same reference numerals, and detailed description thereof will be omitted.

The characteristics of the modified example shown in FIG. 8 are as follows.

(1) The O-ring 34 is closed, and instead, the plurality of spacers 94a and 94b are dispersed and disposed on the main surface of the holding plate 30 that faces the substrate 10 to be processed. Thereby, the flow path 96 is newly formed between the main surface of the spacer side of the holding plate 30 which mutually opposes, and the upper surface of the to-be-processed substrate 10. FIG. The flow path 96 is connected to the flow path 92 so that a predetermined fluid (that is, a processing liquid or a processing gas) flows.

(2) The hole 84a is formed in the center part of the cover member 84, and the hole 30a is formed also in the center part of the holding plate 30. As shown in FIG. The pipe 46 is provided through these holes 30a and 84a, and the fluid in the flow path 96 is led out through the pipe 46 to the outside. That is, the processing liquid or processing gas supplied from the pipes 88 and 90 flows through the flow paths 92 and 96, respectively, and is then discharged to the outside through the pipe 46 at the center. In this case, the pipe 90 may be a discharge port instead of a supply port for the processing liquid or the processing gas. However, it is preferable to use those having a small contact area as the spacers 94a and 94b so as not to disturb the processing in the processing region of the substrate 10 to be processed. For example, although the protrusion shape may be used as the spacers 94a and 94b, in this case, it is necessary to consider the surface of the to-be-processed substrate 10 not to be damaged. As a material of this spacer, fluorine-containing materials, such as fluororubber, are mentioned, for example.

In the substrate processing apparatus of FIG. 8, the processing liquid or the processing gas is supplied from the pipes 88 and 90 to the flow paths 92 and 96 and discharged from the pipe 46 to the outside. Washing or drying can be performed simultaneously with respect to the end surface or the main surface on the spacer side. In this case, since the flow path of the processing liquid or the processing gas is limited to the space region along the end surface of the substrate 10 and the main surface on the spacer side, when the processing is performed on the entire surface of the substrate 10 In comparison, the amount of processing liquid or processing gas used can be reduced. In addition, since the flow of the processing liquid or the processing gas can be made more smooth, the processing uniformity and the processing efficiency can be improved.

In FIG. 8, the flow direction of the processing liquid or the processing gas may be reversed. That is, the processing liquid or the processing gas may be supplied from the pipe 46 to flow through the flow paths 92 and 96 from the center portion to the end portion, and then discharged from the pipes 88 and 90 on both sides. In addition, the O-ring 18 may be replaced with a spacer, a hole may be formed in the retaining plate 14, and a pipe may be connected to discharge the processing liquid or the processing gas. In this case, both surfaces of the substrate 10 can be processed simultaneously. Moreover, it is preferable to disperse | distribute many holes 86a and 86b of the cover member 84 along the closed loop of 86A of engagement parts.

Fifth Embodiment

10 shows a substrate processing apparatus according to a fifth embodiment of the present invention, and is an application example to a plasma etching apparatus by microwave discharge. 10 to 10, the same components as those in the third embodiment shown in FIG. 6 are denoted by the same reference numerals, and detailed description thereof will be omitted. In the fifth embodiment, the substrate surface is cleaned with chemically active species (radicals) generated by subjecting the processing gas to microwave discharge treatment.

In detail, the holding plates 14 and 30 are each formed of quartz material, and hold | maintain the to-be-processed board | substrate 10 between them. As the material of the O rings 18 and 34, fluororesins such as perchloroelastomer are used. In addition, the vacuum pumps are exhausted to the pipes 54 and 154.

A UV tube (i.e., a discharge starter) is placed at the end and a transport tube (quartz material) that mixes three types of gases (GAS ₁ (O ₂ ), GAS ₂ (N ₂ ), GAS _n (H ₂ )) It is connected with the pipes 52 and 152 through the microwave generators M1 and M2, respectively. As a result, a processing gas generated by the microwave discharge plasma is generated, supplied to each main surface of the substrate 10 to be processed, and cleaning processing is performed.

In addition, although the process was performed to both surfaces of the to-be-processed board | substrate 10 in FIG. 10, you may make it process only to a cross section.

Sixth Embodiment

It is a perspective view which shows the principal part of the substrate processing apparatus which concerns on the 6th Example of this invention. In the sixth embodiment, a cleaning process is performed on a square substrate, for example, a display substrate, and the like, and the square to-be-processed substrate 10 is interposed between the rectangular holding plates 14 and 30 to be pressed and held. The rectangular holding plates 14 and 30 are formed with appropriately recessed portions and holes, and the treatment agent (chemicals, water, treatment gas, etc.) is supplied and discharged through the pipe. Moreover, the O-ring 18 is engaged with the groove | channel in the square cross section of the upper side of the holding plate 14, and similarly the O-ring is also engaged in the cross section of the square below the holding plate 30. As shown in FIG. Thereby, a square processing area | region is defined separately with respect to both surfaces of the square to-be-processed substrate 10, respectively.

However, the O-ring 18 may be engaged with the groove having a circular cross section, or may be engaged with the groove using a plate-shaped O-ring having a rectangular cross section.

As described above, the substrate processing method and apparatus according to the present invention have various technical features and effects, which will be described below.

(1) In the substrate processing method and apparatus of the present invention, the substrate to be processed is sandwiched and held between a pair of holding plates, and a predetermined treatment is performed using a processing liquid or a processing gas (hereinafter referred to as a processing agent). That is, the washing treatment and the drying treatment) are performed.

(2) In detail, each holding plate is pressed through a closed loop-shaped elastic member (O-ring) facing the main surface of the substrate to be processed, thereby processing region surrounded by the elastic member on the main surface of the substrate to be processed. This division is limited. Moreover, in each holding plate, the recessed part is formed in the area | region enclosed with an elastic member, and a process is performed with respect to the process area | region of a to-be-processed substrate by flowing a processing agent through this recessed part. However, the cleaning treatment may be performed in the treatment region using a washing liquid or pure water as the treatment liquid, or the treatment treatment may be dried in the treatment region using an inert gas such as N ₂ as the treatment gas. The processing region is limited to an area smaller than the main surface of the substrate to be processed, and the area of the recessed portion of the holding plate is also about this processing region. For this reason, the usage-amount of a processing agent can be reduced. When the inside of the recessed part of the holding plate is spherical (semi-spherical), the flow of the treatment agent can be smoothed, and treatment uniformity is improved. In addition, providing an observation window from the outside at least in a portion of the holding plate corresponding to the processing area makes it extremely convenient for the operator to confirm and measure the progress of the processing on the processing target substrate and the like. For example, this window is realized by constituting a part of the holding plate with a transparent material (transparent glass, acrylic or the like).

(3) In the above, when both main surfaces of the substrate to be processed are simultaneously processed, the processing efficiency is improved. Moreover, the kind of treatment agent can be different from the main surface of one side and the main surface of the other side. For example, one main surface may be cleaned by a processing liquid, and the other main surface may be dried by a processing gas.

(4) The whole overlapping body which consists of a pair of holding plates etc. which hold | maintain the to-be-processed board | substrate is covered with a cover member, and the elastic member (O-ring) between the closed loop-shaped engagement part and the end surface of each holding plate It may be configured to arrange. That is, when a flow path is formed along the end surface of a to-be-processed substrate, a process agent is circulated in this flow path and a process is performed to the end surface of a to-be-processed substrate. That is, the cleaning treatment, the drying treatment, and the like are limited to the cross section of the substrate to be processed and its vicinity. In this case, since the treatment area is limited, the amount of the treatment agent used can be reduced.

(5) In the above description, a plurality of spacers may be disposed between the one holding plate and the substrate to be processed in place of the closed loop-shaped elastic member. That is, the flow path is formed not only along the end face of the substrate to be processed but also along the main surface on the spacer side. Thereby, a process is selectively performed with respect to the cross section and main surface of a to-be-processed substrate.

(6) In the substrate processing apparatus, since there is no need to provide a rotating mechanism of the substrate to be processed as in the prior art, miniaturization of the entire apparatus can be realized. Moreover, the superposition body which consists of a pair of holding plates etc. which hold | maintain and hold | maintain the to-be-processed board | substrate can be rotatably supported, or the rotational movement angle can also be controlled. As a result, the processing uniformity and the processing efficiency can be improved by setting the desired rotational movement angle at which the flow of the treatment agent is smoothed or by periodically changing the rotational movement angle during the treatment.

(7) The treatment agent may be ejected from a plurality of ejection openings of the nozzles arranged in the recessed portions of the respective holding plates, and may be supplied toward the treatment region of the substrate to be processed. Moreover, you may make a pipe which supports a nozzle and supplies a processing agent up-down driveable or rotatable. This further improves the processing efficiency and the processing uniformity.

(8) It is also possible to apply the present invention to a plasma etching apparatus, and to perform a cleaning process by acting a processing gas by microwave discharge plasma on a substrate to be pressurized and held between quartz holding plates. .

(9) The shape of the substrate to be processed is not limited to a circular one, and may be, for example, a rectangular substrate such as a display substrate. In that case, in order to distinguish a process area of a rectangular shape, a rectangular shape is used as the holding plate.

However, the present invention is not limited to the above embodiments, and various modifications are possible within the scope of the invention.

Claims (12)

A concave portion 16 is formed on one side, and is closed to surround the concave portion with respect to the holding plate 14 on which the first and second holes 16a and 16b communicate from the inside of the concave portion to the outside. Arrange the elastic member 18 installed in a loop shape, In the state where the main surface of the substrate 10 to be processed is opposed to one surface of the holding plate via the elastic member, the substrate to be processed is pressed and held by the holding plate, whereby the main surface of the substrate to be processed is To distinguish and define the treatment area surrounded by the elastic member, The processing liquid or the processing gas is supplied to the concave portion through the first hole, and the processing liquid or the processing gas that has flowed through the concave portion is discharged to the outside through the second hole, thereby to the processing region of the substrate to be processed. The substrate processing method which made it process with the process liquid or process gas. A concave portion 16 is formed on one side and surrounds the concave portion with respect to the first holding plate 14 on which the first and second holes 16a and 16b communicate from the inside of the concave portion to the outside. Cheaply arrange the first elastic member 18 installed in a closed loop shape, A concave portion 32 is formed on one surface and surrounds the concave portion with respect to the second holding plate 32 on which third and fourth holes 32a and 32b communicate from the inside of the concave portion to the outside. Cheaply arranged second elastic member 34 installed in a closed loop shape, The first and second retaining plates are disposed to face each other, and are pressed and held in a state with the substrate 10 interposed therebetween through the first and second elastic members therebetween, whereby the main portions of both sides of the substrate to be processed are thereby maintained. The first and second treatment regions are respectively defined in terms of The treatment liquid or the processing gas is supplied to the recessed portion of the first holding plate through the first hole, and the treatment liquid or the processing gas having passed through the recessed portion is discharged to the outside through the second hole. Processing is performed by the processing liquid or the processing gas to the first processing region of the substrate; The treatment liquid or the processing gas is supplied to the recessed portion of the second holding plate through the third hole, and the treatment liquid or the processing gas having passed through the recessed portion is discharged to the outside through the fourth hole. A substrate processing method in which a processing by a processing liquid or a processing gas is performed on a second processing region of a substrate. While arranging the closed loop-shaped first elastic member 18 on one side of the first holding plate 14, the second loop-shaped elastic member 80 in the closed loop shape is also disposed, While arranging the closed third loop-shaped elastic member 34 on one side of the second holding plate 30, the closed fourth loop-shaped elastic member 82 is also disposed in its cross section, The first and second retaining plates are disposed to face each other, and are pressed and held in a state interposed between the substrate 10 through the first and third elastic members between both sides. A closed loop engaging portion 84A covering the overlap formed of the first and second retaining plates on which the substrate to be processed is pressed with a cover member 84 and constituting sidewalls of the cover member 84. ) Is pressed against the end faces of the first and second retaining plates through the second and fourth elastic members, whereby the flow path 92 includes the end face of the substrate to be processed and its vicinity. And formed between the first and second retaining plates, A processing liquid into the flow path through a first hole 86a formed at a position between the second and fourth elastic members in a closed loop-shaped engagement portion constituting the sidewall of the cover member on one side of the cover member; A process gas is supplied, and the process liquid or process gas which flows through this flow path is connected between the second and fourth elastic members in a closed loop-shaped engaging portion constituting the side wall of the cover member on the other side of the cover member. The substrate processing method of discharging through the 2nd hole (86b) formed in the position to process with the processing liquid or the processing gas to the cross section of the said to-be-processed substrate, and its vicinity. While arranging the closed loop-shaped first elastic member 18 on one side of the first holding plate 14, the second loop-shaped elastic member 80 in the closed loop shape is also disposed, While arranging the plurality of spacers 94a and 94b on one surface of the second holding plate 30, the third elastic member 82 having a closed loop shape is also arranged in the cross section thereof. The first and second retaining plates are disposed to face each other, and are pressed and held through the substrate 10 to be processed through the first elastic member and the plurality of spacers therebetween, A closed loop engaging portion 84A covering the overlap formed of the first and second retaining plates on which the substrate to be processed is pressed with a cover member 84 and constituting sidewalls of the cover member 84. ) Is pressed into the end faces of the first and second retaining plates through the second and third elastic members, whereby the first flow path 92 is included to include the end face of the substrate to be processed and the vicinity thereof. While forming between the cover member and the first and second holding plates, the second flow path 96 is formed along the main surface of the spacer side of the substrate to be processed, A processing liquid into the flow path through a first hole 86a formed at a position between the second and third elastic members in a closed loop-shaped engaging portion constituting the sidewall of the cover member on one side of the cover member; A process gas is supplied, and the process liquid or process gas that flows through this flow path is connected between the second and third elastic members in a closed loop-shaped engagement portion that forms the side wall of the cover member on the other side of the cover member. The substrate processing method of discharging through the 2nd hole (86b) formed in the position to perform processing by a process liquid or a process gas to the cross section of the said to-be-processed substrate, its vicinity, and the main surface on the spacer side. 5. A pipe according to claim 4, further comprising a pipe (46) penetrating approximately the central portion of the second retaining plate and the approximately central portion of the cover member, respectively, wherein the second and third elastic members are at the engaging portions of the cover member. The processing liquid or the processing gas is supplied to the flow path through the holes 86a and 86b formed at a position therebetween, and the cross section of the substrate to be processed and the processing gas are discharged through the pipe. The substrate processing method which made it process with the processing liquid or the processing gas with respect to the main surface of the vicinity part and the spacer side. A first holding plate 14 having a first concave portion 16 formed on one surface thereof, and having first and second holes 16a and 16b communicating from the inside of the concave portion to the outside; A first elastic member 18 provided in a closed loop shape so as to surround the first concave portion of the first holding plate; A second holding plate 30 having a second concave portion 32 formed on one surface thereof, and having third and fourth holes 32a and 32b communicating from the inside of the concave portion to the outside; A second elastic member 34 provided in a closed loop shape to surround the second concave portion of the second holding plate; Support means 28 for supporting the first retaining plate with an opening in a first concave portion and a first elastic member surrounding the first holding plate facing upward; Retention guide means 24 for guiding the second retaining plate in a vertical direction opposite to the first retaining plate while supporting the second retaining plate with an opening in a second concave portion and a second elastic member surrounding the lower portion. , 26),  30A means for guiding the second holding plate to the holding guide means and driving in the vertical direction, wherein the substrate 10 to be processed is disposed on the first elastic means surrounding the first concave portion of the first holding plate. In this state, the second holding plate is driven toward the first holding plate, whereby the substrate to be processed is interposed between the first and second holding plates via the first and second elastic means. Press-holding, thereby defining the first processing region surrounded by the first elastic member with respect to the lower side of the substrate to be processed, while the second processing region surrounded by the second elastic member with respect to the upper surface of the substrate to be processed. Means for distinguishing between The first substrate of the substrate to be processed by supplying the processing liquid or the processing gas into the first concave portion through the first hole and being discharged from the second hole while the substrate to be processed is pressed and held between the first and second holding plates. First processing means for processing the processing region; The second substrate of the substrate to be processed by supplying the processing liquid and the processing gas into the second concave portion through the third hole and holding the substrate under pressure between the first and second holding plates. The substrate processing apparatus provided with the 2nd processing means which performs a process with respect to a process area. The said supporting means supports the superposition body of the state which hold | maintained the to-be-processed board | substrate between the said 1st and 2nd holding plate so that rotational movement was possible, and controls the rotational movement angle of this superposition body. Substrate processing apparatus further provided with control means (24A). A holding plate 14 having a recessed portion formed on one side thereof, and having a hole 16c communicating from the bottom of the recessed portion to the outside; An elastic member 18 provided in a closed loop shape so as to surround the recessed portion of the holding plate; First support means (60) for supporting the retaining plate with the elastic member facing upward; A nozzle 50 having a plurality of jets disposed in the recess toward the opening of the recess of the retaining plate; A pipe 52 having an outer diameter smaller than the inner diameter of the hole formed in the recessed portion of the holding plate, and connected to the nozzle through the hole; Second supporting means (68, 70) for supporting the nozzle through the pipe such that the nozzle is spaced apart from the bottom of the concave portion of the holding plate; Means for delimiting the treatment region surrounded by the elastic member from the main surface of the substrate by pressing and holding the main surface of the substrate 10 to be opposed to the surface of the holding plate through the elastic member ( 30), Processing means for supplying the processing liquid or the processing gas into the recessed portion of the holding plate through the pipe and the nozzle and discharging it through a hole formed in the bottom of the recessed portion, thereby processing the processing region of the substrate to be processed ( The substrate processing apparatus provided with 72, 74. A first holding plate 14 having a first recessed portion 16 formed on one surface thereof, and having a first hole 16c communicating with the outside from the bottom of the first recessed portion; A first elastic member 18 provided in a closed loop shape so as to surround the first concave portion of the first holding plate; A second holding plate 30 having a second concave portion 32 formed on one surface thereof, and having a second hole 32c communicating with the outside from the bottom of the second concave portion; A second elastic member 34 provided in a closed loop shape to surround the second concave portion of the second holding plate; First supporting means (60) for supporting the first retaining plate with the first elastic member facing upward; A first nozzle 50 disposed in the first concave portion toward the opening of the first concave portion of the first retaining plate; A first pipe 52 having an outer diameter smaller than the inner diameter of the first hole formed in the first concave portion of the first holding plate, and connected to the first nozzle through the first hole; Second supporting means (68, 70) for supporting the first nozzle through the first pipe such that the first nozzle is spaced apart from the bottom of the first concave portion of the first retaining plate; Third supporting means 160 for supporting the second retaining plate with the second elastic member facing downward; A second nozzle 150 disposed in the second concave portion toward the opening of the second concave portion of the second holding plate; A second pipe 152 having an outer diameter smaller than the inner diameter of the second hole formed in the second concave portion of the second holding plate, and connected to the second nozzle through the second hole; Fourth supporting means (168, 170) for supporting the second nozzle through the second pipe such that the second nozzle is spaced apart from the bottom of the second concave portion of the second holding plate; The substrate 10 to be processed is interposed between the first and second retaining plates via the first and second elastic members and pressed to hold the substrate 10 to thereby hold the first elastic member on the first main surface of the substrate to be processed. Means for dividing and defining a first treatment region surrounded by the second treatment region surrounded by the second elastic member on a second main surface of the substrate; The substrate to be processed is supplied through the first pipe and the first nozzle to supply the processing liquid or the processing gas into the first concave portion of the first retaining plate, and to discharge it through the first hole formed in the bottom of the first concave portion. Processing means (72, 74) for performing processing on the first processing region of The substrate to be processed is supplied by supplying a processing liquid or a processing gas into the second concave portion of the second holding plate through the second pipe and the second nozzle and discharging it through a second hole formed in the bottom of the second concave portion. The substrate processing apparatus provided with the processing means (172, 174) which performs a process with respect to the 2nd process area | region. The substrate processing apparatus according to claim 8 or 9, wherein a processing gas by microwave discharge plasmas (M1, M2) is supplied through the pipe and the nozzle to perform a cleaning process on the substrate to be processed. The first holding plate 14, A closed loop-shaped first elastic member 18 provided on the surface of the first retaining plate, A second holding plate 30 disposed to face the first holding plate; A second closed loop-shaped second elastic member 34 provided on the surface of the second retaining plate, A cover member 84 for covering the superposed body in a state where the substrate 10 is pressed and held between the first and second holding plates via the first and second elastic members; A closed loop-shaped third elastic member 80 disposed between the closed loop engaging portion 86A constituting the sidewall of the cover member and the end face of the first holding plate; A closed loop-shaped engaging portion 86A constituting the sidewall of the cover member and a fourth closed elastic loop member 82 disposed between the end face of the second holding plate; The processing liquid or the processing gas is supplied toward the superposed body through the first hole 86a penetrating through the engaging portion of the cover member at a position between the third and fourth elastic members, thereby along the cross section of the substrate to be processed. The substrate processing apparatus which made it discharge through the 2nd hole (86b) which penetrates the engagement part of the said cover member at the position between the said 3rd and 4th elastic member after having passed through the flow path (92). The first holding plate 14, A closed loop-shaped first elastic member 18 provided on the surface of the first retaining plate, A second holding plate 30 disposed to face the first holding plate; A plurality of spacers 94a and 94b disposed on a surface of the second holding plate; A cover member 84 for covering the superposed body in a state where the substrate 10 is pressed and held between the first and second holding plates via the first elastic member and the plurality of spacers 94a and 94b; A closed loop-shaped third elastic member 80 disposed between the closed loop engaging portion 86A constituting the sidewall of the cover member and the end face of the first holding plate; A closed loop-shaped engaging portion 86A constituting the sidewall of the cover member and a fourth closed elastic loop member 82 disposed between the end face of the second holding plate; The processing liquid or the processing gas is supplied toward the superposed body through the first holes 86a and 86b passing through the engaging portion of the cover member at a position between the third and fourth elastic members, so that the cross section of the substrate to be processed After passing through the flow path 92 and the flow path 96 between the second holding plate and the substrate to be processed, through the pipe 46 penetrating substantially the center of each of the second holding plate and the cover member. Exhaust Substrate Processing Equipment.

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