TW559927B - Substrate processing method and apparatus - Google Patents

Abstract

In the substrate processing method and apparatus of this invention, the processing using the processing solution or processing gas is performed on a pair of holding boards (14, 30) that hold a processed substrate (10) under pressure therebetween, wherein it is characterized by limiting processed areas of the processed substrate by elastic members (18, 34) such as O-rings. The processing solution or processing gas is supplied and exhausted via holes that are formed in proximity to the bottom of the hollow (16, 32) having a hemispherical shape, which is provided in each holding board. Incidentally, the cleaning solution or pure water is used as the processing solution, and the inert gas such as N2 is used as the processing gas. In addition, this invention is applicable to the plasma etching apparatus using microwave discharge plasma.

Description

559927 A7 B7 V. Description of the Invention (Technical Field) The present invention relates to a blade-type substrate processing method and system for subjecting substrates such as semiconductor substrates to cleaning, drying, and the like. BACKGROUND ART I know the conventional blade-type substrate processing systems. As shown in FIG. 9 (for example, refer to Japanese Patent Application Laid-Open No. 11-176787). In the substrate processing system shown in FIG. 9, the substrate mounting table 2 is held by the engagement of the claws 2a and 2b to maintain the substrate to be processed 1 on the rotary table. On the (Spin base) 3, the rotary table 3 can be freely rotated by the support of the hollow rotary shaft 3a. The substrate mounting table 2 is set into a closed ring along the outer circumference of the substrate 1, and the closed ring is connected to the inside of the closed ring Openings 2A, 2B to the outside. A lower cover 4 is provided below the rotary table 3. In addition, an upper cover 5 covering the substrate 1, the rotary table 3, the lower cover 4, etc. is provided. The upper cover 5 is provided with a middle between the lower covers 4. Interval 6. The inner peripheral portion of the septum 6 and the outer peripheral portion of the substrate mounting table 2 constitute a labyrinth structure 6a. With this labyrinth structure 6a, the substrate mounting table 2 can be rotated in a liquid-tight state. A discharge path 7 is formed between the lower cover 4 and the septum 6; similarly The discharge path 8 is also formed between the upper cover 5 and the septum 6. The upper cover 5 has a supply pipe 5a. During processing, the substrate 1 is rotated by the rotating shaft 3a, and the processing liquid is supplied to the substrate 1 by the supply pipe 5a. The processing liquid is discharged through the discharge path 8 on the surface la. In addition, the processing liquid supplied to the lower surface 1b of the substrate 1 is discharged through the discharge path 7 through the hollow portion of the rotary shaft 3a. In this way, the upper surface of the substrate 1 can be discharged. The surface la and the lower surface lb are cleaned. In addition, a given treatment can be given to either the upper surface la or the lower surface lb according to the wishes (for example, -4-This paper size applies Chinese National Standard (CNS) A4 Specifications (210 X 297 mm) 559927 A7 -____ B7 ___ V. Description of the invention (2) Etching process. As described above, the structure using the conventional technology is attached to both sides of the substrate 1 to be processed, so that the processing liquid reaches the center of the substrate. Flowing over a wide area beyond the surface side, there is a problem that the amount of processing liquid is increased. Furthermore, the conventional technology provided the partition 6 and the labyrinth structure 6a to rotate the substrate 1 and also caused a problem that the device is enlarged. The present invention considers The object of the above-mentioned circumstances is to provide a novel substrate cleaning method capable of reducing the amount of processing liquid or processing gas used. In addition, another object of the present invention is to provide a small-sized substrate processing apparatus having a low amount of processing liquid or processing gas used. The substrate processing method and device of the invention are characterized in that the substrate to be processed is pushed and maintained between a group of maintenance plates, and a given treatment (that is, a washing treatment or a drying treatment) is given using a processing liquid or a processing gas. The processing range of the substrate to be processed is defined by using an elastic member such as a O-shaped circle. In detail, that is, the recesses are individually formed on the holding plates corresponding to the upper and lower sides of the substrate to be inserted, and the configuration can be closed around the recesses. Ring 0-ring. This means that the main surfaces on both sides of the substrate to be processed pass through the o-rings and are maintained under pressure between the upper and lower holding plates to define the processing range. For example, each recess is formed in a spherical shape, and two openings are provided near the bottom thereof. In other words, the processing liquid or the processing gas is supplied from the openings on one side into the recessed portion of the holding plate, and then circulated through the recessed portion of the competition plate, and then discharged through the openings on the other side. Thereby, the main surface of the substrate to be processed is processed with a processing liquid or a processing gas. In specific methods, use a cleaning solution or pure water as the processing solution for the substrate to be processed. -5-This paper size is suitable for towel g g standard (CNS) A4 specification (21GX⑽7 public love) 559927

Or, an inert gas such as & is used as the main surface of the processing gas, and the cleaning process is applied to the drying process. In the above case, one side of the substrate to be processed can be processed separately, or both sides can be processed. In addition, the processing range does not need to be limited to the main surface of the substrate to be processed, and its surface and edges can also be used as processing objects. That is, a covering member 'provided with an overlapping body formed by covering a holding plate (pressurizing and maintaining a processing substrate) is provided with a closed loop-shaped engaging portion. Ring to push the face and edge of the holding plate | If this 'forms a closed loop flow path along the face and edge of the processing substrate', the processing liquid or processing gas in the flow channel is circulated to the face and edge of the substrate to be processed And its surrounding parts. In the above, a plurality of spacers may be provided between the main surface of one side of the substrate to be processed and the maintenance plate disposed opposite to the main surface, instead of the O-rings. In this case, the main surface of the surface of the substrate to be processed and the separator may be processed. With regard to the method of supplying and discharging the processing liquid or the processing gas of the substrate to be processed, various methods have been adopted other than simply supplying and discharging through the openings provided in the recesses of the respective holding plates. For example, an opening is provided at the bottom of the recessed portion of the communication maintaining plate, and the small hole is penetrated by two kinds of flow tubes. That is, the processing liquid or the processing gas may be supplied to the nozzle (nozzle) arranged in the recess through one side flow tube. The processing liquid or the processing gas may be supplied to the main surface of the substrate to be processed from the nozzle discharge port. Discharge to the outside through the other side of the flow tube. Furthermore, it is also possible to appropriately operate the maintenance plate or the like to improve processing efficiency and uniformity in processing. In addition, the present invention can also be easily applied to the use of -6-This paper size applies to China National Standard (CNS) A4 specification (210X 297 public reply) 559927 A7

Microwave discharge on a plasma etching device. As described above, the present invention limits the processing range in advance to substrate cleaning and drying processes for semiconductor substrates and the like, so that the amount of processing liquid or processing gas used can be reduced. Brief Description of the Drawings Fig. 1 is a perspective view of a sample receiving and feeding state of a substrate to be processed in a blade-type substrate processing apparatus according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view taken along the line X-χ in Fig. 1 between the holding plates of the substrate processing apparatus and pressing the processed substrate to maintain and give a cleaning treatment. Fig. 3 is a cross-sectional view showing a first modified example of the substrate processing apparatus in the first embodiment. Fig. 4 is a cross-sectional view showing a second modification example of the substrate processing apparatus in the first embodiment. Fig. 5 is a sectional view showing a state in which a substrate to be processed is subjected to a cleaning treatment in a blade-type substrate processing apparatus according to a second embodiment of the present invention. Fig. 6 is a sectional view showing a state in which a substrate to be processed is subjected to a cleaning treatment in a blade-type substrate processing apparatus according to a third embodiment of the present invention. Fig. 7 is a cross-sectional view showing a state in which a substrate to be processed is subjected to a cleaning process in a blade-type substrate processing apparatus according to a fourth embodiment of the present invention. Fig. 8 is a cross-sectional view of an important part of a modified embodiment of the fourth embodiment of the present invention, in which a substrate to be processed is subjected to a cleaning treatment in a blade-type substrate processing apparatus. Figure 9 shows an example of the structure of an important part of a conventional blade-type substrate processing apparatus. The paper size is in accordance with the Chinese National Standard (CNS) A4 (210 X 297 mm) 559927

5. Sectional view of invention description (5). The figure shows an example of application in the fifth embodiment of the present invention. 'Application to Plasma Etching Apparatus' Blade Type Substrate Processing Apparatus FIG. 11 is a perspective view of an important part of a sixth embodiment of the present invention. Best Mode for Carrying Out the Invention First Embodiment FIG. 1 shows a blade-type substrate processing apparatus according to an i-th embodiment of the present invention. In the processing space of the apparatus, semiconductor substrates (wafers) and other processed substrates 10 are borrowed. The robot arms 12a, 12b of the conveying device are taken in the direction of arrow A while being maintained. Taking the holding plate 14 provided at the lower portion of the substrate processing apparatus as an example, the holding plate 14 is quadrangular and has a size slightly larger than the substrate 10 to be processed. A spherical recess 16 is formed in the central portion of the main surface of the holding plate 14 to circulate and circulate the processing liquid or the processing gas. It is assumed that an O-ring 1 around the recess 16 is §. The O-ring 1 § is composed of an elastic member such as rubber or plastic, and the substrate to be processed is placed on the O-ring 18. A sectional view taken along the line IX · X 'is shown in FIG. 2. The holding plate 14 is provided with openings 16 a and 16 b that communicate from the inside of the recessed portion 16 to the outside (inside of the holding plate 14). The openings 16 a and 16 b are connected to the flow tubes 20 and 22 respectively. Notches 14a and 14b are formed at the respective relative positions where the recesses 16 are held on both sides of the holding plate 14. The cutouts 14a and 14b are respectively wedged with the front ends of the robot arms 12a and 12b. A support shaft 28C is provided near the side 14s of the maintenance plate 14. The support shaft 28C is supported by bearings 28A and 28B provided on the support table 28 and operates from this paper scale to the Chinese National Standard (CNS) A4 specification ( 210X 297 mm) 559927

As described above, two guide members 24 and 26 are provided upright along the support shaft 28c at a predetermined interval between the six sides of the surface side 143 of the holding plate 14. The square holding plate 30 is similar to the holding plate 14 below, and is approximately the same size as the holding plate 14. Both the holding plates 14 and 30 can be formed by processing metal or plastic, and the shape can be any shape other than circular or oval. The ten thousand face has two openings which are individually engaged with the front end portions of the guide members 24 and 26 on a holding plate provided above the substrate processing apparatus. That is, only the holding plate 30 is guided by the guide members 24 and 26, and the main surface of the holding plate 30 and the holding plate 14 can be moved downward in a vertical direction. A central portion of the holding plate 30 is formed for circulation and circulation processing. Liquid or processing gas spherical recess 32. That is, the concave portion 32 of the holding plate 30 and the concave portion 16 of the holding plate 14 are provided correspondingly. An O-ring 34 is provided to surround the periphery of the concave portion 32. The o-ring 34 is formed of an elastic member similarly to the aforementioned o-ring 18. Taking a material suitable for the O-rings 18 and 34 as an example, a fluorine-containing material such as fluorinated rubber may be exemplified. The holding plate 30 is provided with openings 32 a and 32 b that communicate from the inside of the recessed portion 32 to the outside (the inner surface of the holding plate 30). The openings 32 a and 32 b are respectively connected to the flow pipes 36 and 38. The cutouts 30a, 30b are formed at the respective relative positions where the recesses 32 are held on both sides of the holding plate 30. The cutouts 30a and 30b of the holding plate 30 and the cutouts 14a and 14b of the holding plate 14 correspond to each other. That is, when the holding plate 30 falls and coincides with the holding plate 14, the front ends of the aforementioned robot arms 2a, i2b can be individually inserted into the spaces formed by the corresponding cutouts 30a, 14a and 30b, 14b. A driving arm 30A is provided on the side of the maintenance plate 30 with a cutout 30a on the inner surface, and the driving arm 30A is used to make the maintenance plate 30 as shown by the arrow b. -9-This paper size applies the Chinese National Standard (CNS) A4 specification. (210 X 297 mm) 559927 A7 B7 V. Description of the invention (7) Drive in the up and down direction. During processing, after the substrate 10 to be processed is placed on the O-ring 18 of the holding plate 14, the holding plate 30 is lowered along the guide members 24 and 26 by the driving arm 30A, and passes through the O-ring 34 to overlap the substrate. The substrate 10 is processed. After that, the substrate 10 to be processed is held between the holding plates 14 and 30 for maintenance. The substrate 10 is formed in a substantially circular plate shape, and has first and second surfaces 10a, 10b that are in contact with the holding plates 14, 30, respectively. That is, as shown in FIG. 2, the substrate 10 is in a state between the holding plates 14 and 30, and the first treatment is drawn on the first surface i 0a by the 0-ring 18 on the holding plate 14. range. In addition, the second processing range is drawn on the second surface 10b by the o-ring 34 on the holding plate 30. After that, through the flow tube 20 and the opening 16a on the holding plate, the processing liquid or processing gas is supplied to the recessed portion! Within 6, after circulating inside the recessed portion 16, it is discharged through the opening 16b and the flow tube 22. Thereby, processing can be performed on the first processing range of the substrate 10. In addition, through the flow tube 36 and the opening 32a on the holding plate 30, the processing liquid or the processing gas is supplied into the recessed portion 32, and after circulating in the recessed portion 32, it is discharged through the opening 32b and the flow tube 38. Thereby, the second processing range of the substrate 10 can be processed. In the above processing, when a cleaning liquid or pure water is used as the processing liquid, the substrate 10 can be cleaned. When an inert gas such as% is used as the processing gas, the substrate 10 may be dried. Alternatively, it may be switched to a drying process after the washing process. In the case of using a treatment liquid, the discharge surface (that is, the flow tubes 2 2, 3, 8) can also be connected to a vacuum pump. When using a process gas, pressurized gas can also be supplied from the supply side (ie, the flow tubes 20 and 36). The 1st and 2nd processing range of the substrate 10 to be processed as required -10-This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 559927 A7 _____ B7 V. Description of the invention (8) Use Different processing liquids or processing gases may be applied to alternative processing in which one side uses the processing liquid and the other side uses the processing gas. As shown in FIGS. 1 and 2, in the substrate processing apparatus according to the first embodiment, the first and second processing ranges of the substrate 10 to be processed are individually limited by the o-rings 18 and 34, so that the processing liquid or the The amount of process gas used. Furthermore, the size of the maintenance plates 14 and 30 may be somewhat larger than that of the substrate 10 to be processed. Therefore, the operation mechanism of the substrate 10 to be processed is not provided, and the entire substrate processing apparatus can be miniaturized. Furthermore, if the first and second processing ranges of the substrate 10 to be processed can be processed at the same time, the overall processing efficiency can be improved. The concave portions 16, 32 on the holding plates 14, 30 which are in contact with the substrate 10 to be processed have a spherical internal shape, so that the processing liquid or the processing gas can flow smoothly and the uniformity of processing can be improved. In addition, a driving arm 24A is provided at the front end of the guide member 24, whereby the operation angle of the superimposed body formed by the holding plates 14, 30, and the substrate 10 can be controlled. That is, by the "lever principle" in which the driving arm 24A moves in the direction of the arrow C and the supporting shaft 28C is used as a fulcrum, the operating angle of the above-mentioned superimposed body can be arbitrarily controlled. For example, the operation angle of the superimposed body that allows the processing liquid to flow can be set in advance before the aforementioned processing is started. During the process, the operating angle of the overlap can also be changed periodically or aperiodically. In this way, the fine adjustment of the operating angle of the overlap can further improve the uniformity and efficiency of processing. Regarding the substrate processing apparatus in the first embodiment, various variations and derivation examples can be formed. Figure 3 shows the first variation and derivation of the substrate processing apparatus. (210X 297 mm) 559927

The same components as those shown in Figs. 1 and 2 are assigned the same reference numerals, and detailed descriptions thereof are omitted. No. shown in Figure 3! The variation example is characterized by changing the arrangement of the openings of the maintenance plates 14, 30 and the flow tubes. That is, an opening i6c is provided at the bottom of the recessed portion 16 on the holding plate 14 to be connected to the flow S42 ', and the opening i6a is individually connected to the flow tubes ⑽a and 40b from the side direction. In addition, for the holding plate 30, a hole 32c is provided at the bottom of the recess 32 to be connected to the flow tube 46, and the holes 32a and 32b are respectively connected to the flow tubes 44a and 44b from the side. First, the process liquid or process gas is supplied into the recessed portion 16 from the flow tubes 40a and 40b on both sides of the holding plate 14, and after circulating in the recessed portion 16, it is discharged to the outside through the opening 32c and the mud pipe 46. With the above-mentioned composition, the processing liquid or the processing gas can flow smoothly, and the uniformity in processing and the processing efficiency can be improved. In the first modification example shown in Fig. 3, the flow path of the processing liquid or the processing gas may be reversed. That is, the processing liquid or the processing gas may flow into the recessed portion 16 through the flow tube 42 and the openings 6c, and may be discharged to the outside through the openings i6a, 16b and the flow tubes 40a, 40b. Similarly, the processing liquid or the processing gas can be made to flow into the recessed portion 32 through the flow tube 46 and the hole 32c, and can be discharged to the outside through the 32a and 32b and the flow tubes 44a and 44b. The openings 16a and 16b are not necessarily limited to two, and a plurality of openings 16a and 16b may be arranged along the inner circumferential surface of the recessed portion 16. Similarly, the openings 32a and 32b need not be limited to two, and a plurality of openings 32a and 32b may be arranged along the inner circumferential surface of the recess 32. Fig. 4 shows a second variation of the above-mentioned substrate processing apparatus. The same constituent elements as those shown in Figs. 1 and 3 are denoted by the same reference numerals, and detailed descriptions thereof are omitted. -12-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 559927

The second variation example of π shown in FIG. 4 is that the internal shapes of the recesses 16 and 32 of the holding plates 14 and 30 are not made into a spherical surface, but a slightly flat circular portion is not functionally different from the foregoing. Very large, compared with making a spherical surface, it has the effect that the processing of the tie and holding plate can be simplified. Eighth-dimensional second embodiment FIG. 5 shows the blade-type substrate embedded in the second embodiment of the present invention, and the same composition as in the aforementioned first embodiment shown in FIG. 1 is used, so it is the same as that shown in FIG. 1 The same components are assigned the same symbols. In the second embodiment, the substrate 10 to be processed under the condition of the o-rings ΐ8 and μ is held between the holding plates 14 and 30 for maintenance. Different from the aforementioned first embodiment, the upper holding plate 30 is not provided with a recessed portion corresponding to the mounting surface of the substrate 10. Further, a dish-like member 50a of the movable nozzle 50 is arranged inside the recessed portion 16 of the lower holding plate 14. The dish-like member 50a is covered by a circular plate 50b having a plurality of ejection ports. That is, the ejection port of the circular plate 50b is directed toward the opening of the recessed portion μ, and the movable nozzle 50 is arranged in the recessed portion Η of the holding plate 14. An opening 16e is provided on the bottom of the recess 16 of the maintaining plate 14, and a flow tube 52 having an outer diameter smaller than the inner diameter of the opening 16c passes through the opening 16c and connects to the movable nozzle 50 in the recess 16. In addition, one end of the flow tube 54 is connected to the opening 16c, extends downward from the opening 16c, and is bent into an L shape. The flow tube 52 extends downward from the middle of the flow tube 54, passes through the closing member 56, is led out from its L-shaped bent portion, and then extends downward. That is, the flow tube 52 is brought into a liquid-tight state by the closing member 56, and can be mounted on the flow tube 54 freely and vertically. A support table 60 is provided below the maintaining plate 14 and the flow tube 54. A flange 58 is provided on the flow tube 52 below the%. The flange 58 borrows the support table 60 to -13.-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 559927

The bearing 62 is supported for free operation. A motor (M) 64 is provided on the support platform 60 having a slightly gate-shaped cross section, and its rotation is transmitted to the flow pipe 52 through the power transmission mechanism%. That is, the flow tube 52 is driven to rotate in the direction of arrow p by the motor 64. A support table 60 is placed on the up-and-down driving device 68 disposed on the support surface 70. That is, the support table 60 is driven in the up-down direction as shown by an arrow P through the driving rods 6 and 6 of the up-and-down driving device 68. As the support table 60 is driven up and down, the flow tube 52 is also driven in the up and down direction. Therefore, the movable nozzle 50 and the flow tube 52 in the recessed portion 16 of the holding plate 14 rotate and rotate up and down. In addition, even if the movable nozzle 50 is moved up and down, the flow tube 52 supports the movable nozzle 50 with a slight gap between the lower surface of the movable nozzle 50 and the bottom surface of the recess 16. The flow tube 52 extends downward through the opening 70a on the support surface 70, and its lower end is immersed in the container 72 filled with the processing liquid 74. When one end of the flow tube 54 is connected to a pump (not shown), and the pressure in the recess 16 of the holding plate 14 is reduced, the processing liquid 74 in the container 72 rises in the flow tube 52 and reaches the movable nozzle 5. It is ejected from a plurality of ejection ports on the circular plate 50b covering the dish-like portion 50a, and the processing liquid 74 is supplied to the processing range of the substrate 10 to be processed (that is, the surface portion surrounded by the o-ring 18). Thereafter, the treatment liquid passes through the gap between the movable nozzle 50 and the bottom surface of the recessed portion 16 and the opening 16c, and is discharged from the flow tube 54 to the outside. As a result, a processing liquid (for example, a cleaning process) is applied to the processing range of the substrate 10 to be processed. The substrate processing apparatus in the second embodiment as shown in FIG. 5 can reduce the use amount of the processing liquid similarly to the first embodiment shown in FIG. I. In addition, since the processing liquid is mostly ejected from the circular plate 50b of the movable nozzle 50-14-this paper size is in accordance with China National Standard (CNS) A4 (210 X 297 mm) 559927

Since the processing liquid or the processing gas is supplied to the processing target of the substrate 1G to be processed, the processing efficiency can be improved. In addition, the sizes of the 'maintaining plates 14, 30 are only slightly larger than the substrate 10 to be processed, which is the same as the first embodiment described above, and it is not necessary to provide an operation mechanism related to the substrate 10 to be processed. In the second embodiment, since the processing liquid is further supplied and discharged through the opening 16e provided in the bottom surface of the recessed portion 16 of the holding plate 14, the entire substrate processing apparatus can be miniaturized. If the movable nozzle 50 can be appropriately rotated and moved up and down in processing, the processing efficiency and the uniformity in processing will be further improved. Although the processing of the processing substrate 1G with the processing liquid has been described in the second embodiment, the processing liquid may be used instead of the processing liquid to dry the processing substrate 10. Third Embodiment FIG. 6 shows a blade-type substrate processing apparatus according to a third embodiment of the present invention, which uses the same components in each of the embodiments shown in FIG. 1 and FIG. 5, and therefore is the same as that of each embodiment. Attach the same symbols. That is, in the substrate processing apparatus of the third embodiment shown in FIG. 6, the portion below the substrate maintenance plate 14 to be processed uses the same composition as that of the second embodiment shown in FIG. 5, so detailed description thereof is omitted. The components above the substrate 1 () and the holding plate 14 are the composition of the second embodiment. In the same manner as in the example of heart penetration, in the third embodiment, the substrate 10 to be processed passes through the 0-rings 18 and 34 during processing, and is held between the holding plates 14 and 30 by pressing. In addition, similar to the aforementioned first embodiment, both of the holding plates 14 and 30 are formed with recesses 16 and 32 separately, and both sides of the substrate 10 to be processed can be processed. That is, the lower side of the substrate 10 to be processed draws the processing range by the recess 16 of the holding plate 14 and the O-ring U, and the upper side of the processed substrate 10 draws the recess 32 of the holding plate 30 and the 0-ring 34-15-This paper size applies Chinese national standards (CNS) A4 specification (21〇X 297 public love) 559927 A7 B7 V. Description of the invention (13 draws the processing range. As in the second embodiment, there is more than one outlet within the recess 16 of the maintenance plate 14 The circular plate 50b covers the dish-like member 50a of the movable nozzle 50. In the third embodiment, a circular plate 150b having a large number of ejection ports is also provided in the recess 32 of the holding plate 30 to cover the movable nozzle. The plate-shaped member 15a of 15 °. In addition, the ejection port of the circular plate 150b faces the opening of the recessed portion 32. The flow f 152 extends upward from the sustaining plate 30, and its outer diameter is smaller than the opening provided at the bottom of the recessed portion 32 of the sustaining plate 30. The inner diameter of the hole 32c is connected to the movable nozzle 150 through the opening 32c. The flow tube 154 is also connected to the opening 32e and extends upward from the opening 32c into an L shape, and the flow tube 152 extends upward from the middle of the flow tube 154. Passing through the closing member 56, it is led out from its L-shaped bent portion, and then extends further upward. The flow tube 152 The closing member 156 is in a liquid-tight state, and can be freely moved and installed on the flow pipe 154. Further above, a support table 160 having a motor (M) 164 is provided, and a flange 158 provided on the flow pipe 152 is borrowed. The bearing 162 of the support table 160 supports free operation. The rotation of the motor 164 is transmitted to the flow tube 152 through the power transmission mechanism 166. That is, the flow tube 152 is driven to rotate in the direction of arrow P by the motor 164. The support table 160 and the support surface 170 are disposed on the support surface 170. The upper and lower driving devices 168 are connected, and the driving rods 168a and 168b of the upper and lower driving devices 168 are driven in the up and down direction as shown by the arrow Q '. With the up and down driving of the support table 160, the flow tube 152 is also in the up and down direction. The movable nozzle 150 and the flow tube 152 in the recessed portion 32 of the plate 30 are maintained to rotate and move up and down. In addition, the movable nozzle 150 is not limited to actuated vertically, and the lower surface of the movable nozzle 150 and the bottom surface of the recessed portion 16 Under the gap, the flow tube 152 supports the movable nozzle 150. -16-This paper size applies to China National Standard (CNS) A4 (210 X 29? Mm) 559927 A7 B7 V. Description of the invention (14) Flow tube 1 52 passes through the opening 170a in the support surface 170 and then extends upward, then bends horizontally, and then bends downward into an L shape, so that the upper end portion thereof is immersed in the container 172 filled with the treatment liquid 174. The support surface 170, etc. The support mechanism formed is connected to the maintenance plate 30, so that the support mechanism and the maintenance plate 30 can move up and down. One end of the flow pipe 154 is connected to a pump (not shown), so that the recess 32 of the maintenance plate 30 is reduced. When pressed, the processing liquid 174 in the container 172 rises and falls in the flow tube 152 and reaches the movable nozzle 150. Most of the ejection ports on the circular plate 150b covering the dish-shaped portion 15a are discharged downward and supplied. A processing range from the processing liquid 174 to the upper side of the substrate 10 to be processed (that is, a portion surrounded by the O-ring 34). Thereafter, the treatment liquid passes through the gap between the movable nozzle 15 and the bottom surface of the recessed portion 32 of the holding plate 30 and the opening 32c, and is discharged to the outside through the flow tube 154. As a result, the processing range of both sides of the substrate 10 to be processed is treated with a processing liquid (for example, a cleaning process). The substrate processing apparatus according to the third embodiment shown in FIG. 6 can also obtain the same effects as those of the second embodiment shown in FIG. 5. In addition, in the third embodiment, both sides of the substrate 10 to be processed can be processed at the same time, so the processing efficiency can be further improved. Furthermore, in the third embodiment, the flow of the processing gas may be used instead of the processing liquid, and the substrate 10 to be processed may be dried. The fourth embodiment is shown in FIG. 7. FIG. 7 shows a blade substrate according to the fourth embodiment of the present invention. The same reference numerals are assigned to the same portions of the processing device as those in the first embodiment and the like described above. In the fourth embodiment, similarly, the substrate to be processed 10 is held between the holding plates 14 and 3G through the o-rings 18 and μ. And each implementation

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559927

For example, the difference is that at 4 o'clock ..., Thai ,, there are no recesses on the holding plates 14, 30, and the substrate 10 to be processed passes through the 0-rings 18, 34 'early and stays between the holding plates U, 30. The ring 18 is set in a closed loop to surround a given range inside the main surface of the main plate 而, and the O-ring 34 is set in a closed loop to surround the given range of the main side of the maintenance plate 3G. In addition, another closed annular O-ring 80 is provided along the surface of the holding plate 14; similarly, another closed annular O-ring U is provided along the surface of the holding plate 30. The 0-rings 8G and 82 are made of elastic members such as rubber or plastic. The second covering member 84 is used to cover the maintaining plates 14 and 30 while holding the substrate to be processed and pressing and maintaining the overlapped body. That is, the covering member 84 has a recessed portion 86 for receiving an overlapping body composed of the holding plates 14, 30, the substrate to be processed 10, and the like. The side wall of the recessed portion 86 is constituted by a closed annular engagement portion 86a. The engaging portion is formed in the recessed portion 86 of the covering member 84, and the O-rings 80 and 82 are individually engaged with the overlapped body inserted. In addition, the engaging portion 86 is formed with openings 86a and 86b which communicate with the outside. The openings are located between the O-rings 80 and 82 when the overlapped body is inserted. The flow tubes 88 and 90 are connected to the openings L 86a and 86b, respectively. During processing, the engaging portion 86A presses and maintains the surfaces of the holding plates 14 and 30 through the o-rings 80 and 82, respectively, by a maintenance means (not shown). Thereby, the inside of the superimposed body holding the substrate 10 to be processed is sealed by the O-rings 80 and 82 and the inner wall of the engaging portion 86A, and a fluid flow path 92 is formed along the surface of the substrate 10 to be processed. That is, the processing liquid or the processing gas is supplied into the flow path 92 through the flow tube 88 connected to the opening 86a, and is then discharged through the flow tube 90 connected to the opening 86b. At this time, with the circulation of the processing liquid or the processing gas in the flow path 92, -18-This paper size is applicable ® National Standard (CNS) A4 specification (210 X 297 mm) 559927 A7 B7 V. Description of the invention (16 The surface of the substrate 10 to be processed and its edges are treated (for example, a washing process or a drying process). As shown in FIG. 7, in the substrate processing apparatus according to the fourth embodiment of the present invention, The flow path 92 is defined as a closed loop path along the side of the substrate 10 to be processed. Therefore, a small amount of the processing liquid or the processing gas may be used. In the substrate processing apparatus according to each of the embodiments, the substrate 10 to be processed is processed. The surface edge has its difficulties, but in the substrate processing apparatus related to the fourth embodiment, 'the surface edge of the substrate 10 to be processed can be limitedly processed. Therefore, the processing is not performed in the foregoing embodiments. In the case of the surface of the substrate 10, the fourth embodiment can be adopted. Fig. 8 is a modified derivative example of the fourth embodiment shown in Fig. 7, and the same constituent elements are attached with the same symbols, and detailed descriptions thereof are omitted. Example changes shown There are two points as follows. (1) The O-ring 34 is abolished, and the spacers 94a and 94b are dispersedly arranged on the main surface of the holding plate 30 opposite to the substrate 10 to be treated. By doing so, the separation is maintained on the holding plate 30 A new flow path 96 is formed between the main surface in the object direction and the upper surface of the substrate 10 opposite to each other. This flow path 96 is connected to the aforementioned flow path 92 and circulates a given fluid (ie, a processing liquid or a processing gas). (2) An opening hole 84a is provided in the central portion of the covering member 84, and an opening hole 30a is also provided in the central portion of the holding plate 30. A flow pipe 46 is passed through the opening holes 30a and 84a, and the flow pipe 46 is used as an intermediate. The fluid in the above-mentioned flow path 96 is discharged to the outside. That is, the processing liquid or the processing gas supplied from the flow tubes 88 and 90 individually flows in the flow paths 92 and 96, and then the flow tube 46 in the center portion is used.-This paper Applicable to China National Standard (CNS) A4 specification (210 X 297 mm) 559927

Discharge to the outside. At this time, the flow pipe 90 may not be used as a supply port for the processing liquid or processing gas, but may be used as a discharge port. In addition, as for the partitions 94a and 94b, it is preferable to use a low contact area so that the processing range of the substrate 10 to be processed does not hinder the processing. For example, a protrusion may be used as the spacer, but in this case, it is necessary to consider that the surface of the substrate 10 to be processed does not cause scratches. For example, the separator can be made of a fluorine-containing material such as fluorine rubber. In the substrate processing apparatus of FIG. 8, the processing liquid or the processing gas is supplied from the flow tubes 88 and 90 to the flow paths 92 and 96, and is discharged to the outside by the flow tube 46. The main surface is cleaned or dried. In this case, the flow path of the processing liquid or the processing gas is limited to the space range along the main surface of the substrate 10 to be processed and the direction of the other spacers. Therefore, it is compared with the case where the substrate 10 is fully processed. , Can reduce the use of processing liquid or processing gas. In addition, since the flow of the processing liquid or the processing gas can be smoother, the uniformity and efficiency of the processing can be improved. In FIG. 8, the flow direction of the processing liquid or the processing gas is reversed, which means that the processing liquid or the processing gas is supplied from the flow tube 46, and the flow paths 92 and 96 flow from the central portion to the edge portion. The side flow tubes 88 and 90 may also be discharged. In addition, an o-ring 18 may be used in place of the separator, and an open-hole connection flow pipe may be formed on the maintenance plate 14 to discharge the processing liquid or processing gas. In this case, it is possible to process both sides of the substrate 10 to be processed. In addition, it is better to make the openings 86a, 86b of the covering member 84 along the closed ring of the engaging portion 86A-20-This paper size applies to China National Standard (CNS) A4 specifications (210X 297 mm) 559927 A7 _____B7 V. SUMMARY OF THE INVENTION (18) The number is distributed. Fifth Embodiment Fig. 10 shows an example of application of a substrate processing apparatus according to a fifth embodiment of the present invention to a plasma etching apparatus using microwave discharge. The same components as those in the third embodiment shown in FIG. 6 are assigned the same reference numerals in FIG. 0, and detailed descriptions thereof are omitted. The fifth embodiment is a method of cleaning the surface of a substrate by using a chemical radical generated by applying a processing gas to a microwave discharge treatment. In detail, the maintenance plates 14 and 30 are individually formed of quartz material, and the processing substrate 10 is pushed and maintained therebetween. The o-rings 18 and 34 are made of fluororesin. The convection pipes 54 and 154 are further subjected to vacuum pump exhaust. A UV lamp (ie, a discharge starter) is arranged at the edge, and three kinds of gases GASJ02 are mixed. ≫ The ducts (quartz material) of GAS2 (N2) and GASn (H2) are connected by microwave generators M1 and M2. Tube 52, 52. Thereby, the processing gas which generates a microwave discharge plasma is supplied to each main surface of the to-be-processed substrate, and a cleaning process is performed. In addition, in FIG. 10, both sides of the substrate 10 to be processed may be processed, or only one side may be processed. Sixth Embodiment Fig. 11 is a perspective view showing an important part of a substrate processing apparatus according to a sixth embodiment of the present invention. In the sixth embodiment, an angular substrate such as a display substrate is subjected to a cleaning process, and the angular substrate 10 to be pressed is maintained between the holding plates 14 and 30. Appropriate recesses and openings are formed in the angled maintenance plates 14 and 30, and the processing agent (medicine, water, processing gas, etc.) is supplied and discharged through the flow tube. In addition, on the side of the angled surface on the upper side of the maintenance plate 14, O-ring 18 _____-21-Zhang Jiji Shicai S country transfer standard (CNS) 559927 A7 ___B7 V. Description of the invention (19) Fitted into the grooved foot; similarly, the angled surface edge of the lower side of the plate is also maintained , Fit the O-ring into the groove. Thereby, the angular processing ranges of the two sides of the substrate 10 to be processed which are angularly fixed are individually drawn. In addition, the O-ring 18 fitted into the groove may be a circular cross-section, or a plate-shaped O-ring having a square cross-section may be used to fit into the groove. As described above, the substrate processing method and apparatus of the present invention have various technical features and effects, and are described below. (1) The substrate processing method and device of the present invention are used to push and maintain a substrate to be processed between a group of maintenance plates, and use a processing liquid or a processing gas (hereinafter referred to as a processing agent) to give a given treatment (that is, Washing treatment or drying treatment). (2) In detail, the holding plate opposite to the main surface of the substrate to be processed is urged by a closed ring-shaped elastic member (ring), whereby the main surface of the substrate to be processed is elasticized. Set the processing range around the drawing. In addition, a recessed portion is formed in a range surrounded by the elastic member on each of the holding plates. With the recessed portion as a flow-through processing agent, the processing range of the substrate to be processed can be treated by comparison, or the processing range can be imparted with an inert gas such as Yoshida. Drying. The processing range is set to a smaller area than the main surface of the substrate to be processed; moreover, the area of the concave portion of the maintenance plate is also the same as that of the processing range. As a result, the amount of treatment agent can be reduced. Spherical (hemispherical) interior of the recessed part of the holding plate can smooth the flow of the treatment agent and improve the uniformity of the treatment. In addition, on the maintenance board, a part corresponding to the processing range is provided with an external inward observation window, and the operator is processing the substrate to be processed-22-This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) ) 559927 A7 B7 5. It is very convenient to confirm and measure the processing progress status of the invention description (2〇). For example, 'a part of the holding plate may be made of a transparent material (transparent glass, acrylic, etc.) to realize the observation window. (3) In the above method, the main surface on both sides of the substrate to be processed and processed can improve the processing efficiency. In addition, different types of treatment agents may be applied to the main surface on one side and the main surface on the other side. For example, the main surface of one side may be washed with a treatment liquid, and the main surface of the other side may be dried with a processing gas. (4) The covering member covers the entire overlapping body composed of a set of holding plates that presses and maintains the substrate to be processed, and an elastic member is arranged between the closed annular engaging portion and the sides of each holding plate. Composition is also possible. In other words, a flow path is formed along the surface of the substrate to be processed, and a processing agent is flowed through the channel to treat the surface of the substrate. In other words, the surface of the substrate to be processed and its edges are limitedly subjected to cleaning treatment or drying treatment. In this case, since the processing range is limited, the amount of the processing agent used can be reduced. (5) In the foregoing, a plurality of spacers may be arranged between the one side of the holding plate and the substrate to be processed instead of the closed loop elastic member. That is, the flow path is formed not only on the surface side of the substrate to be processed, but also along the main surface of the separator. Thereby, selective processing is performed on the surface edge and the main surface of the substrate to be processed. (6) In the substrate processing apparatus, it is not necessary to provide a turning mechanism for the substrate to be processed as in the past, so that the entire apparatus can be miniaturized. In addition, it can support a group of maintenance plates to do the processing of the substrate. -23-This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 male sauce) 559927 A7 B7 V. Description of the invention (21) It can operate freely while maintaining the formed overlap, and can control its operation angle. In this way, setting a desired operating angle allows the processing agent to circulate smoothly and periodically changes the operating angle during processing, which can improve uniformity and efficiency in processing. (7) The processing agent may be ejected from a plurality of nozzles arranged on the nozzles provided in the recessed portion of the holding plate and supplied to the processing range of the substrate to be processed. In addition, the flow tube supporting the nozzle and supplying the treatment agent can be made to move up and down freely and freely. This can improve processing uniformity and processing efficiency. (8) The present invention can also be applied to a plasma etching apparatus, or a processing gas generated by a microwave discharge plasma can be used to press a substrate to be treated held between a quartz-made holding plate and perform a cleaning treatment. (9) The shape of the substrate to be processed is not limited to a circular shape, and angular substrates such as display substrates can also be processed. In this case, the holding plate uses a corner shape to draw a square processing range. In addition, the present invention is not limited to the foregoing embodiments, and various changes can be made within the scope of the invention.

Claims (1)

559927 A B c D No. 091111312 patent application Chinese patent application scope replaces August of this year) ~ 6. Application for patent scope ^ 1. 2 .: A kind of substrate processing method 'It is formed on a single side to connect the interior of the recess to the Maintenance of the first and second openings on the outside: upper = an elastic member formed as a closed loop to surround the recessed portion, on one side of the maintenance plate, through the elastic member, and the main part of the substrate to be processed In the state where the surfaces are relatively arranged, the substrate to be processed is pushed and maintained on the holding plate, so that the processing range surrounded by the elastic member is defined on the main surface of the substrate to be processed. When the liquid or processing gas passes through the recessed portion, the second opening is used to discharge the processing liquid or processing cylinder that circulates through the recessed portion to the outside, so that the substrate to be processed is processed with the processing liquid or processing gas. A substrate processing method includes a first elastic plate having a recess formed on a single side surface and first and second openings communicating with the inside and the outside of the recess to form a closed loop. The member surrounds the recessed portion, a second elastic member having a recessed portion formed on one side surface and third and fourth openings communicating with the inside and the outside of the recessed portion is formed as a closed loop. The first and second holding plates are oppositely arranged around the recessed portion, and the pressing and maintaining are performed in a state of holding the substrate to be processed through the first and second elastic members therebetween, so that the two The first and second processing ranges are respectively drawn on the main side of the side. Through the first opening, the processing liquid or the processing gas is supplied to the recess of the first holding plate. Through the second opening, the place where the recess is circulated is passed. This paper size applies to China National Standard (CNS) A4 (210X297 mm) 559927 A8 B8 The physical fluid or processing gas is discharged to the outside of the ^ ® 7 ^ Bu Shao, in order to apply the processing liquid or processing gas to the processing gas surrounding the substrate to be processed, and provide a virtual ^ through the aforementioned third opening. Λα For processing the hard or processing gas to the concave of the second maintenance plate, through the opening of the former secret philosopher 4 to discharge the processing of the concave portion> night or processing gas to the outside. ^ Chu + Shao, hunting for the aforementioned 3. The target 2 of the substrate to be processed is treated with a processing liquid or a processing gas. The substrate processing method 'its system' is to arrange a closed loop-shaped first elastic member on one side surface of the i-th maintenance plate, and also arrange a closed loop-shaped second elastic member on its surface side, and A closed looped third elastic member 'is disposed on the early side, and a closed looped fourth elastic member is also disposed on the front side. The h and the second maintenance are arranged in a batch, and the first and the second are passed between the two. And the third elastic member presses and maintains the substrate to be processed, and the covering member covers the overlap of the first and second maintenance plates including the substrate to be processed and described above, and will correspond to the side wall The closed loop engaging portion passes through the aforementioned second and fourth elastic members and pushes on the sides of the aforementioned first and second retaining plates so as to include a space between the covering member and the aforementioned first and second retaining plates. Flow path of the surface of the substrate to be processed and its edges ^ On the engaging portion on one side of the covering member, a processing liquid or processing is provided through a first opening formed at a position between the second and fourth elastic members. Gas to the aforementioned flow path, transmitted through the aforementioned The second opening -2 formed on the other side of the cover member at the position between the second and fourth elastic members-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 559927 AB CD 6. Apply for a patent scope hole to discharge the processing liquid or processing gas flowing through the flow path to the outside, so as to apply the processing liquid or processing gas to the surface edge and the edge portion of the substrate to be processed. 4 · A substrate processing method, in which a closed looped first elastic member is disposed on one side of the first maintenance plate, and a closed looped second elastic member is also disposed on the surface side, and the second maintenance A plurality of partitions are arranged on one side of the plate, and a closed elastic third elastic member is also arranged on the side of the plate. The first and second retaining plates are oppositely arranged, and the first elasticity is transmitted between the two. The component and the plurality of partitions are pressed and maintained in a state of holding the substrate to be processed, and the member is covered with the overlap of the first and second maintenance plates including the substrate to be processed and pressed to maintain the substrate to be processed. The corresponding closed loop engaging portions pass through the aforementioned second and third elastic members, and press on the sides of the aforementioned first and second retaining plates, so as to be between the covering member and the aforementioned first and second retaining plates. A first flow path is formed including the surface of the substrate to be processed and its edges, and a second flow path is formed along the H surface of the partition side of the substrate to be processed, and is transmitted through the engaging portion on the side of the cover member. Formed on the second and third elastic members The first opening in the position ′ provides a processing liquid or a processing gas to the aforementioned flow path, and is formed between the second and third elastic members γα " between the aforementioned second and third elastic members through the card portion on the other side of the covering member. 2 openings' to discharge the processing liquid or processing gas flowing through the flow path to the outside — to describe the side of the substrate to be processed, its edges and its eight partitions, -3-, patent application park 5 = 二A treatment liquid or a treatment gas is applied to the treatment. • According to the order of the patent, the base plate of the fourth item passes through the aforementioned second maintenance plate ... The slightly more centrally arranged flow tube, which covers the cover member, forms the door between the second and third elastic members. : Card: = processing of the υ road or processing gas is discharged to the outside, 6.: Main of the side of the substrate, the side edge and the direction of the separator: :: The processing liquid or the processing gas is applied to the processing. The essential meaning 2ίΓ and the processing device 'are provided with a recessed portion formed on one side surface, and a plate and an opening to communicate the inside of the recessed portion to the outside! The first elastic member, k1, and a second recess formed on one side are maintained in a closed loop to surround the recess on the aforementioned first maintenance plate, and third and fourth openings are formed to communicate the interior of the recess to An external second retaining plate, a second elastic member provided in a closed loop to surround the second recessed portion of the second retaining plate, an opening portion supporting the first retaining plate to surround the first recessed portion, and The supporting means of the first elastic member upwards, "holding" as described in the second holding plate, the opening portion of the second recessed portion and the second elastic member surrounding it are downward, and the second holding plate is opposed to The maintaining and guiding means for guiding the first holding plate in the vertical direction, and the driving means for guiding the second holding plate in the vertical direction using the holding and guiding means, place the substrate to be processed around the first application. The patent scope maintains the state of the ith elastic means of the first concave portion of the plate, drives the second holding plate to the first holding plate, and passes the substrate to be processed through the first and second elastic members to the first Maintenance Board and 2nd Maintenance Press and hold between them ', so that the first processing range surrounded by 罘 1 elastic member is determined on the lower side of the substrate to be processed, and the area surrounded by the second elastic member is determined on the upper side of the substrate to be processed. Second processing range; The substrate to be processed is held between the first and second holding plates, and the processing liquid or processing gas is supplied through the first opening through the first opening and discharged through the second opening. The first processing means for processing the first processing range of the substrate to be processed and the substrate to be processed are held between the first and second holding plates, and the processing liquid is supplied through the third opening. Or the second processing means for processing the gas into the second recessed portion and exhausting it through the fourth opening to process the second processing range of the substrate to be processed. 7. The substrate processing apparatus according to item 6 of the scope of patent application, wherein the aforementioned support means is capable of freely supporting an overlapped body in a state where the substrate to be processed is pressed and maintained between the i-th and the second maintenance plates, and is further provided with Control means for controlling the operation angle of the superimposed body. 8. A substrate processing apparatus comprising: a holding plate having a recess formed on one side thereof, an opening formed to communicate the inside to the outside of the recess, and an elasticity provided in a closed loop to surround the recess of the maintenance plate The first support means for supporting the maintaining plate to make the elastic member upward, the nozzles arranged in the recessed portion, and the plurality of nozzles facing the opening of the recessed portion of the maintaining plate, -5-Chinese paper standard (CNS) A4 Specifications (210 X 297 mm) 9. 々. The scope of the patent application has a smaller outer diameter than the inner diameter of the recessed hole in the maintenance plate, and is connected to the nozzle through the opening. The front nozzle is supported by the front nozzle. The support means for maintaining the space between the recesses of the plate passes through the elastic member 'the surface of the maintenance plate and the main surface of the substrate to be processed ^ pressing and maintaining the lower surface', so that the elastic member is determined on the surface of the substrate to be processed. The means for confirming the surrounding processing range, through the aforementioned flow tube and the aforementioned nozzle, provide before processing;: inside the recess of the holding plate, and through the bottom of the recess: "^ 出 '㈣ processing range of the substrate to be processed Give treatment measures. ::: Processing device 'includes: a first recess is formed on one side, = a first opening is provided to communicate with the inside of the recess to the outside, and the ^ th maintenance device is a closed loop to surround the first maintenance The aforementioned first elastic member of the concave portion, the flail: a second concave portion is formed on the concave portion, and third and fourth openings are formed to communicate the β concave < the second maintaining plate from the inside to the outside, = The "kζ segment" is a second elastic member for closing the loop to surround the recessed part of the second holding plate, and the aforementioned second part is a gift! The holding plate has the first supporting hand whose first elastic member faces upward, and is disposed in the first recessed portion. The plurality of ejection ports face the i-th holding plate 559927 A8 B8 C8 The first nozzle of the opening of the first recess has an outer diameter smaller than the inner diameter of the concave portion provided in the i-th retaining plate and is connected to the i-th nozzle through the first opening. The first flow tube supports the second support means that separates the first order from the recessed portion of the retaining plate 1 and supports the second retaining plate so that the second elastic member moves downward to the second elastic member. In the two recesses, the second nozzle of the p tone mountain plural tune is exited, and the second nozzle facing the opening of the second recess of the second maintenance plate has an outer diameter smaller than the second hole in the second recess of the second maintenance plate Inner diameter 'and a second flow tube connected to the second nozzle through its second opening, and supporting the second nozzle through the second flow tube so that the second: nozzle and the second recess of the second holding plate The fourth support means separated by a distance, passes the substrate to be processed through the i-th and second elastic members, and is restrained from the first! And pressing and maintaining between the second maintaining plate, so as to draw a first processing range surrounded by the aforementioned first elastic member on the first main surface of the substrate to be processed; and on the second main surface of the substrate to be processed Means for drawing a second processing range surrounded by the second elastic member, through the first flow tube and the first nozzle, to provide a processing liquid or a processing gas into the first recess of the first holding plate And through the first opening provided at the bottom of the recess to discharge the processing means for processing the first processing range of the substrate to be processed, through the second flow tube and the second nozzle, to provide a processing liquid or a processing gas To the second recessed portion of the second maintaining plate, and is provided through the recessed portion 559927 The second opening of the patent application f Shao is discharged, so as to treat the second processing of the substrate to be processed. The substrate processing device according to item 8 or item 9 of Shenqiao's patent scope, wherein the aforementioned flow tube and the aforementioned nozzle are used to supply the processing gas generated by the microwave discharge cell, and the substrate to be processed is subjected to cleaning treatment. U. A substrate processing apparatus comprising: a first holding plate, a closed ring-shaped first elastic member provided on the surface of the first holding plate, a second holding plate disposed opposite to the first holding plate, The second elastic member sighed with a closed loop on the surface of the second retaining plate is configured to push the substrate to be processed between the first and second retaining plates through the first and second elastic members. A covering member covered by an overlapping body, a third elastic member having a closed loop arranged between a closed loop engaging portion of the covering member and a surface edge of the third maintaining plate, and a closed loop provided by the covering member A closed loop-shaped fourth elastic member between the engaging portion of the second retaining plate and the surface of the second maintaining plate; and the first elastic member passing through the engaging portion of the covering member passes through the first elastic member at a position between the third and fourth elastic members.丨 Open a hole to supply a processing liquid or a processing gas to the above-mentioned overlapping body, and allow it to flow along the flow path along the surface of the substrate to be processed, and then pass through the covering member at a position between the third and fourth elastic members. Engaging section 2Open the hole and drain it. 12 · A substrate processing apparatus including a first holding plate, a closed annular first elastic member provided on a surface of the first holding plate, a second holding plate disposed opposite to the first holding plate, and ^^ 9927 A8 B8 Wide __ C8 ---- A plurality of partitions provided on the surface of the aforementioned second holding plate will push the substrate to be processed through the seventh and second elastic members described above and hold them on the first and second maintaining A covering member covered by an overlapping body constituted by the states between the plates, a third annular elastic member having a closed loop arranged between the closed loop engaging portion of the covering member and the surface side of the Lth maintaining plate, The closed-loop fourth elastic member disposed between the closed-loop engaging portion of the cover member and the surface of the second holding plate passes through the fourth elastic member at a position between the third and fourth elastic members. The first opening of the cover member engaging portion is used to supply the processing liquid or the processing gas to the overlapped body, and to allow it to flow along the flow path along the surface of the substrate to be processed, and pass through the first maintenance plate and the cover member, respectively. Central flow tube Discharge. -9-This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm)