KR100560012B1 - 반도체 장치의 연마제 및 연마제를 이용한 반도체 장치의제조방법 - Google Patents

반도체 장치의 연마제 및 연마제를 이용한 반도체 장치의제조방법 Download PDF

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Publication number
KR100560012B1
KR100560012B1 KR1020030057798A KR20030057798A KR100560012B1 KR 100560012 B1 KR100560012 B1 KR 100560012B1 KR 1020030057798 A KR1020030057798 A KR 1020030057798A KR 20030057798 A KR20030057798 A KR 20030057798A KR 100560012 B1 KR100560012 B1 KR 100560012B1
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KR
South Korea
Prior art keywords
abrasive
polishing
cerium oxide
semiconductor device
particles
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020030057798A
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English (en)
Korean (ko)
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KR20040018172A (ko
Inventor
다까야스준
Original Assignee
가부시끼가이샤 도시바
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Publication of KR20040018172A publication Critical patent/KR20040018172A/ko
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Publication of KR100560012B1 publication Critical patent/KR100560012B1/ko
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Composite Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020030057798A 2002-08-22 2003-08-21 반도체 장치의 연마제 및 연마제를 이용한 반도체 장치의제조방법 Expired - Fee Related KR100560012B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002242041A JP2004079968A (ja) 2002-08-22 2002-08-22 半導体装置の研磨剤及び研磨剤を用いた半導体装置の製造方法
JPJP-P-2002-00242041 2002-08-22

Publications (2)

Publication Number Publication Date
KR20040018172A KR20040018172A (ko) 2004-03-02
KR100560012B1 true KR100560012B1 (ko) 2006-03-15

Family

ID=31884572

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030057798A Expired - Fee Related KR100560012B1 (ko) 2002-08-22 2003-08-21 반도체 장치의 연마제 및 연마제를 이용한 반도체 장치의제조방법

Country Status (5)

Country Link
US (2) US6878631B2 (https=)
JP (1) JP2004079968A (https=)
KR (1) KR100560012B1 (https=)
CN (1) CN1485393A (https=)
TW (1) TW200418965A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11685849B2 (en) 2019-10-11 2023-06-27 Saint-Gobain Abrasives, Inc. Abrasive particle including coating, abrasive article including the abrasive particles, and method of forming

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007008232A1 (de) * 2007-02-20 2008-08-21 Evonik Degussa Gmbh Dispersion enthaltend Ceroxid und kolloidales Siliciumdioxid
DE102007062572A1 (de) * 2007-12-22 2009-06-25 Evonik Degussa Gmbh Ceroxid und kolloidales Siliciumdioxid enthaltende Dispersion
US9868886B2 (en) 2011-12-28 2018-01-16 Konica Minolta, Inc. Abrasive agent for substrates and substrate manufacturing method
JP6560155B2 (ja) 2016-04-20 2019-08-14 信越化学工業株式会社 合成石英ガラス基板用研磨剤及び合成石英ガラス基板の研磨方法
JP7038022B2 (ja) * 2018-08-06 2022-03-17 日揮触媒化成株式会社 セリア系微粒子分散液、その製造方法およびセリア系微粒子分散液を含む研磨用砥粒分散液
JP7038031B2 (ja) * 2018-09-28 2022-03-17 日揮触媒化成株式会社 セリア系複合微粒子分散液、その製造方法及びセリア系複合微粒子分散液を含む研磨用砥粒分散液

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5684782A (en) * 1979-12-14 1981-07-10 Fuji Electric Co Ltd Cleaning abrasive material for electrophotographic photosensitive material
US4971602A (en) * 1989-09-26 1990-11-20 Crawford Robert B Method for grinding gear teeth
DE4217720C1 (de) * 1992-05-29 1993-11-04 Starck H C Gmbh Co Kg Gesinterte verbundschleifkoerper, verfahren zu ihrer herstellung sowie deren verwendung
JPH09321003A (ja) 1995-05-22 1997-12-12 Sumitomo Chem Co Ltd 研磨材およびその製造方法、ならびにそれを使用した半導体基板上の絶縁膜の平坦化方法
JPH10135163A (ja) 1996-09-03 1998-05-22 Sumitomo Chem Co Ltd 半導体基板上の金属膜研磨用組成物及びこれを使用した半導体基板上の金属膜の平坦化方法
US6602439B1 (en) * 1997-02-24 2003-08-05 Superior Micropowders, Llc Chemical-mechanical planarization slurries and powders and methods for using same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11685849B2 (en) 2019-10-11 2023-06-27 Saint-Gobain Abrasives, Inc. Abrasive particle including coating, abrasive article including the abrasive particles, and method of forming

Also Published As

Publication number Publication date
JP2004079968A (ja) 2004-03-11
US20040036149A1 (en) 2004-02-26
US20050026441A1 (en) 2005-02-03
TW200418965A (en) 2004-10-01
KR20040018172A (ko) 2004-03-02
US6878631B2 (en) 2005-04-12
CN1485393A (zh) 2004-03-31

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