US20050026441A1 - Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasive - Google Patents
Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasive Download PDFInfo
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- US20050026441A1 US20050026441A1 US10/929,376 US92937604A US2005026441A1 US 20050026441 A1 US20050026441 A1 US 20050026441A1 US 92937604 A US92937604 A US 92937604A US 2005026441 A1 US2005026441 A1 US 2005026441A1
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- Prior art keywords
- polishing
- abrasive
- particles
- semiconductor device
- cerium oxide
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000002245 particle Substances 0.000 claims abstract description 153
- 229910000420 cerium oxide Inorganic materials 0.000 claims abstract description 84
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims abstract description 84
- 239000011248 coating agent Substances 0.000 claims abstract description 20
- 238000000576 coating method Methods 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 15
- 238000005498 polishing Methods 0.000 claims description 91
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 66
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 51
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 14
- 239000010409 thin film Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims 3
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims 3
- 239000010408 film Substances 0.000 description 53
- 238000007517 polishing process Methods 0.000 description 21
- 239000004094 surface-active agent Substances 0.000 description 15
- 239000003082 abrasive agent Substances 0.000 description 8
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 5
- 230000003247 decreasing effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 229910001651 emery Inorganic materials 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000005201 scrubbing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
Definitions
- the present invention relates to semiconductor device planarization technology in the field of semiconductor device manufacturing.
- an abrasive composed of cerium oxide (CeO 2 ) particles has been used for polishing an insulating film, particularly in CMP (Chemical Mechanical Polishing) for forming STI (Shallow Trench Isolation).
- CMP Chemical Mechanical Polishing
- STI Shallow Trench Isolation
- a surfactant is added to disperse the cerium oxide particles. The degree of dispersion is adjusted by the type and amount of surfactant.
- dispersion can become cohesion, depending upon the amount of surfactant added.
- the amount of surfactant is sometimes intentionally increased in order to enhance the effect of planarization. But, this induces cohesion of the cerium oxide particles. This causes scratches on the insulating film surface. Further, a high amount of surfactant will lower the polishing rate, and decrease the throughput in a polishing process.
- an abrasive for a semiconductor device comprising cerium oxide particles, and materials for coating the surface of the cerium oxide particles.
- a method of manufacturing a semiconductor device comprising a process of polishing the surface of a thin film formed on a semiconductor substrate by using abrasive particles consisting of cerium oxide particles coated with coating materials.
- FIG. 1 is a schematic view illustrating an abrasive particle included in an abrasive for a semiconductor device according to a first embodiment of the prevent invention
- FIG. 2 is a schematic diagram showing a first step of a method of polishing a semiconductor device according to the first embodiment of the invention
- FIG. 3 is a schematic diagram showing a second step of the method of polishing a semiconductor device according to the first embodiment of the invention
- FIG. 4 is a schematic view illustrating an abrasive particle included in an abrasive for a semiconductor device according to a second embodiment of the prevent invention
- FIG. 5 is a schematic diagram showing a first step of a method of polishing a semiconductor device according to the second embodiment of the invention.
- FIG. 6 is schematic diagram showing a second step of the method of polishing a semiconductor device according to the second embodiment of the invention.
- FIG. 7 is a graph showing the polishing rates when polishing a non-patterned film by using a conventional abrasive and the abrasives of the first and second embodiments of the present invention.
- FIG. 8 is a graph showing the polishing rates when polishing a patterned film by using a conventional abrasive and the abrasive of the first and second embodiments of the present invention.
- FIG. 9 shows sectional views of the patterned film before and after the planarization.
- FIG. 10 is a graph showing the number of scratches occurred on the patterned film surface when a conventional abrasive and the abrasives of the first and second embodiments of the present invention are used.
- abrasive for a semiconductor device according to a first embodiment of the present invention, and a method of polishing a semiconductor device using the abrasive.
- This method uses an abrasive consisting of cerium oxide (CeO 2 ) particles coated with silicon oxide (SiO 2 ).
- the silicon oxide may be in the form of particles or a film.
- FIG. 1 illustrates abrasive particles contained in the abrasive used by the method of polishing a semiconductor device according to a first embodiment of the invention.
- a cerium oxide (CeO 2 ) particle 11 is coated by silicon oxide (SiO 2 ) particles 12 .
- Repulsion of silicon oxide 12 disperses the abrasive particles. Thus, it is unnecessary to add a surfactant to the abrasive, after coating the cerium oxide (CeO 2 ) particles 11 in silicon oxides (SiO 2 ) 12 . Add KOH or ammonia in stead to adjust pH of the abrasive. An additive may be used in order to enhance the polishing effect.
- FIG. 2 and FIG. 3 schematically show the method of polishing a semiconductor device according to the first embodiment.
- the abrasive particle collides with a projection of the insulating film 14 , as shown in FIG. 2 .
- the silicon oxide particles 12 coating the cerium oxide particles 11 separate from the cerium oxide particles 11 .
- the surface of the insulating film 14 is polished mainly by the cerium oxide particle 11 . That is, the surface of the cerium oxide particle 11 is exposed, scrubbing the projection of the insulating film 14 , thereby polishing the insulating film 14 .
- polishing is achieved mainly by a cerium oxide particle 11 , and extreme reduction of the polishing rate does not occur on the polishing surface. Further, as the abrasive contains no surfactant, cohesion of the abrasive particles remaining in a concave on the polishing surface does not occur. Therefore, the abrasive particle diameter is not increased by cohesion, and the number of scratches can be reduced.
- the polishing of the projection on the insulating film 14 advances, the number of silicon oxide particles 12 separated from the cerium oxide particles 1 is gradually decreased. And, when the projection of the insulating film 14 is completely polished and the film surface becomes plane, no more silicon oxide particles 12 separate from the cerium oxide particle 11 , as shown in FIG. 3 . In this case, the surface of the insulating film 14 is polished by the silicon oxide particles 12 coating the surface of the cerium oxide particle 11 , and the polishing rate is determined by the silicon oxide particles 12 .
- the cerium oxide particle 11 whose surface is exposed by separation of the silicon oxide particle 12 can be driven out of the polishing process. This makes it possible to use only the abrasive particles consisting of the cerium oxide particles 11 coated by silicon oxide particles 12 , for polishing the surface of the insulating film 14 , after planarization of the surface thereof.
- the polishing is made by the cerium oxide particle 11 having the fast polishing rate until the polishing surface becomes plane, and the silicon oxide particles 12 are used after the surface becomes plane.
- This will highly reduce the polishing rate after the planarization, and actuate the self-stop function in polishing the uneven surface.
- the polishing will continue still after the polished becomes plane. This method is also suitable when the polished film thickness needs to be adjusted.
- cerium oxide particles are used for polishing until an uneven portion on the surface to be polished becomes plane, and silicone oxide particles are used after the planarization process.
- This method enables polishing without lowering the polishing rate in the planarization process, and realizes polishing with a lowered polishing rate in the polishing process after the planarization.
- the abrasive consists of cerium oxide (CeO 2 ) particles coated with aluminum oxide (Al 2 O 3 ).
- the aluminum oxide may be in a particle or film form.
- a semiconductor device is polished using an abrasive containing the abrasive particles.
- FIG. 4 illustrates abrasive particles contained in the abrasive used by the method of polishing a semiconductor device according to a second embodiment of the invention.
- a cerium oxide (CeO 2 ) particle 11 is coated by aluminum oxide (Al 2 O 3 ) particles 15 .
- Repulsion of silicon oxides 12 disperses the abrasive particles. Thus, it is unnecessary to add a surfactant to the abrasive containing abrasive particles, after coating the cerium oxide (CeO 2 ) particle 11 with aluminum oxide (Al 2 O 3 ) 12 . Add appropriate acid in stead to adjust pH of the abrasive. An additive may be added in order to enhance the polishing effect.
- FIG. 5 and FIG. 6 schematically show the method of polishing a semiconductor device according to the second embodiment.
- the abrasive particles collide with a projection on the insulating film 14 , as shown in FIG. 5 .
- the aluminum oxide particles 15 coating the cerium oxide particles 11 separate from the cerium oxide particles 11 .
- the surface of the insulating film 14 is polished mainly by the cerium oxide particles 11 . That is, the surface of the cerium oxide particle 11 is exposed, scrubbing the projection of the insulating film 14 , thereby polishing the insulating film 14 .
- polishing is achieved mainly by cerium oxide particles 11 , and extreme reduction of the polishing rate does not occur on the polishing surface. Further, as the abrasive contains no surfactant, cohesion of the abrasive particles remaining in a concave on the polishing surface does not occur. Therefore, the abrasive particle diameter is not increased by cohesion, and the number of scratches can be reduced.
- the polishing of the projection on the insulating film 14 advances, the number of aluminum oxide particles 15 separated from the cerium oxide particle 11 is gradually decreased. And, when the projection of the insulating film 14 is completely polished and the film surface becomes plane, no more aluminum oxide particles 15 separate from the cerium oxide particles 11 , as shown in FIG. 6 . The surface of the insulating film 14 is thus polished by the aluminum oxide particle 15 coating the surface of the cerium oxide particle 11 , and the polishing rate is determined by the aluminum oxide particles 15 .
- the cerium oxide particle 11 whose surface is exposed by separation of the aluminum oxide particles 15 can be driven out of the polishing process. This makes it possible to use only the abrasive particles consisting of cerium oxide particles 11 coated by aluminum oxide particles 15 , for polishing the surface of the insulating film 14 , after planarization of the surface thereof.
- the polishing is made by the cerium oxide particle 11 having the fast polishing rate until the polishing surface becomes plane, and the aluminum oxide particle 15 is used after the surface becomes plane.
- This will highly reduce the polishing rate after the planarization, and actuate the self-stop function in polishing the uneven surface.
- the abrasive particles consisting of cerium oxide particles 11 coated by aluminum oxide particles 15 the abrasive containing these abrasive particles becomes acid.
- the silicon oxide film (SiO 2 ) film is substantially not polished by the aluminum oxide particle 15 . Therefore, this method is suitable when only planarization is required.
- cerium oxide particles are used for polishing until an uneven portion on the surface to be polished becomes plane, and aluminum oxide particles are used after the planarization process.
- This method enables polishing without lowering the polishing rate in the planarization process, and realizes polishing with a lowered polishing rate in the polishing process after the planarization.
- Table 1 shows the properties of the abrasives containing conventional abrasive particles, and abrasive particles of the embodiments, and the polishing rates and the number of scratches occurred when these abrasives are used for polishing.
- TABLE 1 Non-patterned silicon oxide film Patterned silicon oxide film Particles Polishing Rate before Rate after Scratch* density rate planarization planarization [quantity/ Slurry pH [%] [nm/min] [nm/min] [nm/min] 8′′ ⁇ wf] Silicon oxide 11.0 5 132 411 142 1 particles Al 2 O 3 particles 2.5 0.5 1 52 3 65 CeO 2 particles 8.1 0.5 610 769 586 84 CeO 2 particles 10.5 0.5 198 541 157 2 coated with SiO 2 particles CeO 2 particles 2.7 0.5 6 576 13 25 coated with Al 2 O 3 particles *Relative value assuming 1 for silicon oxide particles
- Abrasive A indicates an abrasive containing silicon oxide particles
- abrasive B indicates an abrasive containing aluminum oxide (Al 2 O 3 ) particles
- abrasive C indicates an abrasive containing cerium oxide (CeO 2 ) particles
- abrasive D indicates an abrasive containing the abrasive particles consisting of cerium oxide (CeO 2 ) particles coated by silicon oxide (SiO 2 ) particles
- abrasive E indicates an abrasive containing the abrasive particle consisting of cerium oxide (CeO 2 ) particles coated by aluminum oxide (Al 2 O 3 ) particles.
- FIG. 7 shows the polishing rates when a silicon oxide film is polished by using the abrasives A-E.
- the silicon oxide film i.e., the film to be polished is a film having no uneven portions.
- the pressure (DF) applied to the polished surface of the silicon oxide film is 400[hPa]
- the speed of the carrier holding the wafer is 100[rpm]
- the speed of the turntable is 100[rpm].
- the polishing rate is 610 [nm/min] in the polishing with the abrasive C containing cerium oxide particles, 198 [nm/min] with the abrasive D containing the abrasive particles composed of cerium oxide particles coated by silicon oxide particles, and 6 [nm/min] with the abrasive E containing the abrasive particles composed of cerium oxide particles coated by aluminum oxide particles. Therefore, the polishing rate can be sufficiently lowered by using the abrasive D or E when polishing a silicon oxide film having a plane surface, compared to using the abrasive C.
- FIG. 8 shows the polishing rates when polishing a patterned silicon oxide film by using the abrasives A-E.
- the silicon oxide film is a TEOS (Tetraethylorthosilicate) film formed by low pressure CVD.
- the TEOS film 16 has unevenness on the surface to be polished, as shown in FIG. 9 .
- the density of the projections to the whole surface is approximately 40%, and the height of the projections is about 500 nm.
- the polishing rate with the abrasive C containing cerium oxide particles is equivalent to the polishing rate of abrasive D, containing the abrasive consisting of cerium oxide particles coated with silicon oxide particles, or the rate of abrasive E containing the abrasive consisting of cerium oxide particles coated with aluminum oxide particles.
- the polishing rate with the abrasive D is extremely lowered, and becomes equivalent to the rate with the abrasive A containing silicon oxide film particles.
- the polishing rate with the abrasive E is extremely lowered, and becomes equivalent to the rate with the abrasive B containing aluminum oxide particles.
- the polishing rate with the abrasive D is highly reduced, and becomes equal to the rate of abrasive A containing silicon oxide film particles.
- the polishing rate of abrasive E is highly reduced, and becomes equal to the rate of abrasive B containing aluminum oxide particles.
- the amount of scratching on the silicon oxide film (TEOS film) was as follows.
- FIG. 10 shows the number of scratches that occurred when abrasives A-E were used for polishing the silicon oxide film.
- the silicon oxide film is a TEOS film having unevenness on the surface to be polished, as described above.
- the number of scratches is indicated by a relative value, assuming the number of scratches that occurs when polishing with abrasive A containing silicon oxide particles to be 1.
- the number of scratches when polishing with abrasive D containing the abrasive composed of cerium oxide particles coated with silicon oxide particles is equivalent to the that of abrasive A containing silicon oxide particles.
- the number of scratches when polishing with the abrasive E containing the abrasive particles composed of cerium oxide particles coated by aluminum oxide particles is lower than that of abrasive B containing aluminum oxide particles. This is because, cerium, i.e., the base material of abrasive E, is soft.
- polishing is possible without lowering the polishing rate, in the process of polishing an uneven surface. Further, the polishing rate can be lowered in a process after planarization. In addition, there is no need to add a surfactant to the abrasive, and the number of scratches to occur on the polished surface can be reduced.
- CMP is used for a thin film, using an abrasives consisting of a base material of cerium oxide particles, coated with SiO 2 or Al 2 O 3 particles.
- the coating particles separate from the base material, eliminating the necessity to add a surfactant, and the throughput of the polishing process is not decreased. Moreover, cohesion of particles does not occur, and no scratches occur. The planarization effect can thus be much increased by using appropriate coating particles.
- each embodiment includes the invention of various steps, and these various steps can also be extruded by combining a plurality of elements disclosed in each embodiment.
- an abrasive for a semiconductor device which decreases the number of scratches and prevents lowering of the polishing rate, and a method of manufacturing a semiconductor device using the abrasive.
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Abstract
An abrasive for a semiconductor device comprises cerium oxide particles and coating materials. The cerium oxide particles are made principally of cerium oxide (CeO2). The coating materials cover the surface of the cerium oxide particles.
Description
- This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2002-242041, filed Aug. 22, 2002, the entire contents of which are incorporated herein by reference.
- 1. Field of the Invention
- The present invention relates to semiconductor device planarization technology in the field of semiconductor device manufacturing.
- 2. Description of the Related Art
- In semiconductor device manufacturing, an abrasive composed of cerium oxide (CeO2) particles has been used for polishing an insulating film, particularly in CMP (Chemical Mechanical Polishing) for forming STI (Shallow Trench Isolation). In this case, a surfactant is added to disperse the cerium oxide particles. The degree of dispersion is adjusted by the type and amount of surfactant.
- However, dispersion can become cohesion, depending upon the amount of surfactant added. The amount of surfactant is sometimes intentionally increased in order to enhance the effect of planarization. But, this induces cohesion of the cerium oxide particles. This causes scratches on the insulating film surface. Further, a high amount of surfactant will lower the polishing rate, and decrease the throughput in a polishing process.
- According to one aspect of the present invention, there is provided an abrasive for a semiconductor device comprising cerium oxide particles, and materials for coating the surface of the cerium oxide particles.
- According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device comprising a process of polishing the surface of a thin film formed on a semiconductor substrate by using abrasive particles consisting of cerium oxide particles coated with coating materials.
-
FIG. 1 is a schematic view illustrating an abrasive particle included in an abrasive for a semiconductor device according to a first embodiment of the prevent invention; -
FIG. 2 is a schematic diagram showing a first step of a method of polishing a semiconductor device according to the first embodiment of the invention; -
FIG. 3 is a schematic diagram showing a second step of the method of polishing a semiconductor device according to the first embodiment of the invention; -
FIG. 4 is a schematic view illustrating an abrasive particle included in an abrasive for a semiconductor device according to a second embodiment of the prevent invention; -
FIG. 5 is a schematic diagram showing a first step of a method of polishing a semiconductor device according to the second embodiment of the invention; -
FIG. 6 is schematic diagram showing a second step of the method of polishing a semiconductor device according to the second embodiment of the invention; -
FIG. 7 is a graph showing the polishing rates when polishing a non-patterned film by using a conventional abrasive and the abrasives of the first and second embodiments of the present invention; -
FIG. 8 is a graph showing the polishing rates when polishing a patterned film by using a conventional abrasive and the abrasive of the first and second embodiments of the present invention; -
FIG. 9 shows sectional views of the patterned film before and after the planarization; and -
FIG. 10 is a graph showing the number of scratches occurred on the patterned film surface when a conventional abrasive and the abrasives of the first and second embodiments of the present invention are used. - Embodiments of the present invention will now be explained with reference to the accompanying drawings. In all drawings, the same reference numerals are given to the same parts or elements.
- Embodiment 1
- Description will be given on an abrasive for a semiconductor device according to a first embodiment of the present invention, and a method of polishing a semiconductor device using the abrasive. This method uses an abrasive consisting of cerium oxide (CeO2) particles coated with silicon oxide (SiO2). The silicon oxide may be in the form of particles or a film.
-
FIG. 1 illustrates abrasive particles contained in the abrasive used by the method of polishing a semiconductor device according to a first embodiment of the invention. As illustrated, a cerium oxide (CeO2)particle 11 is coated by silicon oxide (SiO2)particles 12. - Repulsion of
silicon oxide 12 disperses the abrasive particles. Thus, it is unnecessary to add a surfactant to the abrasive, after coating the cerium oxide (CeO2)particles 11 in silicon oxides (SiO2) 12. Add KOH or ammonia in stead to adjust pH of the abrasive. An additive may be used in order to enhance the polishing effect. -
FIG. 2 andFIG. 3 schematically show the method of polishing a semiconductor device according to the first embodiment. - Description will now be give on a method of polishing an
insulating film 14 formed on asemiconductor substrate 13 to make the surface of theinsulating film 14 plane, by using the abrasive particles consisting ofcerium oxide particles 11 coated bysilicon oxide particles 12, as shown inFIG. 1 . - When the polishing starts, the abrasive particle collides with a projection of the
insulating film 14, as shown inFIG. 2 . By this collision, thesilicon oxide particles 12 coating thecerium oxide particles 11 separate from thecerium oxide particles 11. As a result, the surface of theinsulating film 14 is polished mainly by thecerium oxide particle 11. That is, the surface of thecerium oxide particle 11 is exposed, scrubbing the projection of theinsulating film 14, thereby polishing theinsulating film 14. - In the above-mentioned polishing process, polishing is achieved mainly by a
cerium oxide particle 11, and extreme reduction of the polishing rate does not occur on the polishing surface. Further, as the abrasive contains no surfactant, cohesion of the abrasive particles remaining in a concave on the polishing surface does not occur. Therefore, the abrasive particle diameter is not increased by cohesion, and the number of scratches can be reduced. - As the polishing of the projection on the
insulating film 14 advances, the number ofsilicon oxide particles 12 separated from the cerium oxide particles 1 is gradually decreased. And, when the projection of theinsulating film 14 is completely polished and the film surface becomes plane, no moresilicon oxide particles 12 separate from thecerium oxide particle 11, as shown inFIG. 3 . In this case, the surface of theinsulating film 14 is polished by thesilicon oxide particles 12 coating the surface of thecerium oxide particle 11, and the polishing rate is determined by thesilicon oxide particles 12. - If the abrasive is continuously supplied, and the conditioning of the emery cloth surface is made simultaneously with the polishing, if necessary, the
cerium oxide particle 11 whose surface is exposed by separation of thesilicon oxide particle 12 can be driven out of the polishing process. This makes it possible to use only the abrasive particles consisting of thecerium oxide particles 11 coated bysilicon oxide particles 12, for polishing the surface of theinsulating film 14, after planarization of the surface thereof. - Namely, the polishing is made by the
cerium oxide particle 11 having the fast polishing rate until the polishing surface becomes plane, and thesilicon oxide particles 12 are used after the surface becomes plane. This will highly reduce the polishing rate after the planarization, and actuate the self-stop function in polishing the uneven surface. Moreover, when using the abrasive particles consisting of thecerium oxide particles 11 coated bysilicon oxide particles 12, the polishing will continue still after the polished becomes plane. This method is also suitable when the polished film thickness needs to be adjusted. - As described above, according to the first embodiment of the invention, cerium oxide particles are used for polishing until an uneven portion on the surface to be polished becomes plane, and silicone oxide particles are used after the planarization process. This method enables polishing without lowering the polishing rate in the planarization process, and realizes polishing with a lowered polishing rate in the polishing process after the planarization. In addition, there is no need to add a surfactant to the abrasive, and generation of scratches on the polished surface can be prevented.
- Embodiment 2
- Description will now be given on an abrasive for a semiconductor device according to a second embodiment of the present invention, and a method of polishing a semiconductor device using the abrasive. The abrasive consists of cerium oxide (CeO2) particles coated with aluminum oxide (Al2O3). The aluminum oxide may be in a particle or film form. In the polishing method, a semiconductor device is polished using an abrasive containing the abrasive particles.
-
FIG. 4 illustrates abrasive particles contained in the abrasive used by the method of polishing a semiconductor device according to a second embodiment of the invention. As illustrated, a cerium oxide (CeO2)particle 11 is coated by aluminum oxide (Al2O3)particles 15. - Repulsion of
silicon oxides 12 disperses the abrasive particles. Thus, it is unnecessary to add a surfactant to the abrasive containing abrasive particles, after coating the cerium oxide (CeO2)particle 11 with aluminum oxide (Al2O3) 12. Add appropriate acid in stead to adjust pH of the abrasive. An additive may be added in order to enhance the polishing effect. -
FIG. 5 andFIG. 6 schematically show the method of polishing a semiconductor device according to the second embodiment. - Description will now be give on a method of polishing an insulating
film 14 formed on asemiconductor substrate 13 to make the surface of the insulatingfilm 14 plane, by using the abrasive consisting ofcerium oxide particles 11 coated with aluminum oxide (Al2O3)particles 15, as shown inFIG. 4 . - When the polishing starts, the abrasive particles collide with a projection on the insulating
film 14, as shown inFIG. 5 . By this collision, thealuminum oxide particles 15 coating thecerium oxide particles 11 separate from thecerium oxide particles 11. As a result, the surface of the insulatingfilm 14 is polished mainly by thecerium oxide particles 11. That is, the surface of thecerium oxide particle 11 is exposed, scrubbing the projection of the insulatingfilm 14, thereby polishing the insulatingfilm 14. - In the above-mentioned polishing process, polishing is achieved mainly by
cerium oxide particles 11, and extreme reduction of the polishing rate does not occur on the polishing surface. Further, as the abrasive contains no surfactant, cohesion of the abrasive particles remaining in a concave on the polishing surface does not occur. Therefore, the abrasive particle diameter is not increased by cohesion, and the number of scratches can be reduced. - As the polishing of the projection on the insulating
film 14 advances, the number ofaluminum oxide particles 15 separated from thecerium oxide particle 11 is gradually decreased. And, when the projection of the insulatingfilm 14 is completely polished and the film surface becomes plane, no morealuminum oxide particles 15 separate from thecerium oxide particles 11, as shown inFIG. 6 . The surface of the insulatingfilm 14 is thus polished by thealuminum oxide particle 15 coating the surface of thecerium oxide particle 11, and the polishing rate is determined by thealuminum oxide particles 15. - If the abrasive is continuously supplied, and the conditioning of the emery cloth surface is made simultaneously with the polishing, if necessary, the
cerium oxide particle 11 whose surface is exposed by separation of thealuminum oxide particles 15 can be driven out of the polishing process. This makes it possible to use only the abrasive particles consisting ofcerium oxide particles 11 coated byaluminum oxide particles 15, for polishing the surface of the insulatingfilm 14, after planarization of the surface thereof. - Namely, the polishing is made by the
cerium oxide particle 11 having the fast polishing rate until the polishing surface becomes plane, and thealuminum oxide particle 15 is used after the surface becomes plane. This will highly reduce the polishing rate after the planarization, and actuate the self-stop function in polishing the uneven surface. Moreover, when using the abrasive particles consisting ofcerium oxide particles 11 coated byaluminum oxide particles 15, the abrasive containing these abrasive particles becomes acid. Thus, the silicon oxide film (SiO2) film is substantially not polished by thealuminum oxide particle 15. Therefore, this method is suitable when only planarization is required. - As described above, according to the second embodiment of the invention, cerium oxide particles are used for polishing until an uneven portion on the surface to be polished becomes plane, and aluminum oxide particles are used after the planarization process. This method enables polishing without lowering the polishing rate in the planarization process, and realizes polishing with a lowered polishing rate in the polishing process after the planarization. In addition, there is no need to add a surfactant to the abrasive, and generation of scratches on the polished surface can be prevented.
- Description will now be given on the results of the polishing made by using a conventional abrasive containing silicone oxide (silica) particles or aluminum oxide (Al2O3) particles, and the abrasive made of cerium oxide (CeO2) coated with silicon oxide (SiO2) particles of the first embodiment, and the abrasive made of cerium oxide (CeO2) and coated by aluminum oxide (Al2O3) particles of the second embodiment.
- Table 1 shows the properties of the abrasives containing conventional abrasive particles, and abrasive particles of the embodiments, and the polishing rates and the number of scratches occurred when these abrasives are used for polishing.
TABLE 1 Non-patterned silicon oxide film Patterned silicon oxide film Particles Polishing Rate before Rate after Scratch* density rate planarization planarization [quantity/ Slurry pH [%] [nm/min] [nm/min] [nm/min] 8″ φ wf] Silicon oxide 11.0 5 132 411 142 1 particles Al2O3 particles 2.5 0.5 1 52 3 65 CeO2 particles 8.1 0.5 610 769 586 84 CeO2 particles 10.5 0.5 198 541 157 2 coated with SiO2 particles CeO2 particles 2.7 0.5 6 576 13 25 coated with Al2O3 particles
*Relative value assuming 1 for silicon oxide particles
- Abrasive A indicates an abrasive containing silicon oxide particles, abrasive B indicates an abrasive containing aluminum oxide (Al2O3) particles, abrasive C indicates an abrasive containing cerium oxide (CeO2) particles, abrasive D indicates an abrasive containing the abrasive particles consisting of cerium oxide (CeO2) particles coated by silicon oxide (SiO2) particles, and abrasive E indicates an abrasive containing the abrasive particle consisting of cerium oxide (CeO2) particles coated by aluminum oxide (Al2O3) particles.
-
FIG. 7 shows the polishing rates when a silicon oxide film is polished by using the abrasives A-E. Where, the silicon oxide film, i.e., the film to be polished is a film having no uneven portions. As polishing conditions, the pressure (DF) applied to the polished surface of the silicon oxide film is 400[hPa], the speed of the carrier holding the wafer is 100[rpm], and the speed of the turntable is 100[rpm]. These polishing conditions are the same in the subsequent polishing processes. - The polishing rate is 610 [nm/min] in the polishing with the abrasive C containing cerium oxide particles, 198 [nm/min] with the abrasive D containing the abrasive particles composed of cerium oxide particles coated by silicon oxide particles, and 6 [nm/min] with the abrasive E containing the abrasive particles composed of cerium oxide particles coated by aluminum oxide particles. Therefore, the polishing rate can be sufficiently lowered by using the abrasive D or E when polishing a silicon oxide film having a plane surface, compared to using the abrasive C.
- Next, the polishing of a silicon oxide film having an uneven surface will be explained.
-
FIG. 8 shows the polishing rates when polishing a patterned silicon oxide film by using the abrasives A-E. The silicon oxide film is a TEOS (Tetraethylorthosilicate) film formed by low pressure CVD. TheTEOS film 16 has unevenness on the surface to be polished, as shown inFIG. 9 . The density of the projections to the whole surface is approximately 40%, and the height of the projections is about 500 nm. - Before the surface is polished to be planar, the polishing rate with the abrasive C containing cerium oxide particles is equivalent to the polishing rate of abrasive D, containing the abrasive consisting of cerium oxide particles coated with silicon oxide particles, or the rate of abrasive E containing the abrasive consisting of cerium oxide particles coated with aluminum oxide particles. However, after the polished surface becomes plane, the polishing rate with the abrasive D is extremely lowered, and becomes equivalent to the rate with the abrasive A containing silicon oxide film particles. Similarly, the polishing rate with the abrasive E is extremely lowered, and becomes equivalent to the rate with the abrasive B containing aluminum oxide particles.
- However, after the polished surface becomes plane, the polishing rate with the abrasive D is highly reduced, and becomes equal to the rate of abrasive A containing silicon oxide film particles. Similarly, the polishing rate of abrasive E is highly reduced, and becomes equal to the rate of abrasive B containing aluminum oxide particles.
- The amount of scratching on the silicon oxide film (TEOS film) was as follows.
-
FIG. 10 shows the number of scratches that occurred when abrasives A-E were used for polishing the silicon oxide film. The silicon oxide film is a TEOS film having unevenness on the surface to be polished, as described above. The number of scratches is indicated by a relative value, assuming the number of scratches that occurs when polishing with abrasive A containing silicon oxide particles to be 1. - The number of scratches when polishing with abrasive D containing the abrasive composed of cerium oxide particles coated with silicon oxide particles, is equivalent to the that of abrasive A containing silicon oxide particles. The number of scratches when polishing with the abrasive E containing the abrasive particles composed of cerium oxide particles coated by aluminum oxide particles is lower than that of abrasive B containing aluminum oxide particles. This is because, cerium, i.e., the base material of abrasive E, is soft.
- Based on the above results, it is apparent that polishing is possible without lowering the polishing rate, in the process of polishing an uneven surface. Further, the polishing rate can be lowered in a process after planarization. In addition, there is no need to add a surfactant to the abrasive, and the number of scratches to occur on the polished surface can be reduced.
- In the prior art, when polishing an uneven surface of a thin film with cerium oxide particles, a surfactant causes cohesion of the cerium oxide particles, and this causes scratches. Further, as a large amount of surfactant is added, the polishing rate is lowered and the throughput is decreased.
- In the embodiments of the present invention, CMP is used for a thin film, using an abrasives consisting of a base material of cerium oxide particles, coated with SiO2 or Al2O3 particles. The coating particles separate from the base material, eliminating the necessity to add a surfactant, and the throughput of the polishing process is not decreased. Moreover, cohesion of particles does not occur, and no scratches occur. The planarization effect can thus be much increased by using appropriate coating particles.
- The embodiments can be implemented either individually or in combination. Each embodiment includes the invention of various steps, and these various steps can also be extruded by combining a plurality of elements disclosed in each embodiment.
- As described above, according to the embodiments of the present invention, it is possible to provide an abrasive for a semiconductor device which decreases the number of scratches and prevents lowering of the polishing rate, and a method of manufacturing a semiconductor device using the abrasive.
- Additional advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described herein. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.
Claims (11)
1.-8. (Canceled)
9. A method of manufacturing a semiconductor device, comprising polishing the surface of a thin film formed on a semiconductor substrate by using abrasive particles including cerium oxide particles made principally of cerium oxide and coated with coating materials.
10. The method of manufacturing a semiconductor device according to claim 9 , wherein said polishing uses said cerium oxide particles contained in said abrasive particles for polishing said thin film surface when there is an uneven portion on said surface, and uses said coating material contained in said abrasive particles for polishing said surface when there are no uneven portions on said surface.
11. The method of manufacturing a semiconductor device according to claim 9 , wherein said process of polishing uses said cerium oxide particles separated from said coating material for polishing an uneven portion when there is an uneven portion on said polishing surface, and uses said coating material contained in said cerium oxide for polishing said surface when there are no uneven portions on said surface.
12. The method of manufacturing a semiconductor device according to claim 9 , wherein said coating materials are in the form of particles.
13. The method of manufacturing a semiconductor device according to claim 9 , wherein said coating materials are in the form of a thin film.
14. The method of manufacturing a semiconductor device according to claim 9 , wherein said coating materials are composed principally of silicon oxide (SiO2).
15. The method of manufacturing a semiconductor device according to claim 9 , wherein said coating materials are composed principally of aluminum oxide (Al2O3).
16. The method of manufacturing a semiconductor device according to claim 9 , wherein said cerium oxide is made principally of CeO2.
17. The method of manufacturing a semiconductor device according to claim 14 , wherein said cerium oxide is made principally of CeO2.
18. The method of manufacturing a semiconductor device according to claim 15 , wherein said cerium oxide is made principally of CeO2.
Priority Applications (1)
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US10/929,376 US20050026441A1 (en) | 2002-08-22 | 2004-08-31 | Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasive |
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JP2002242041A JP2004079968A (en) | 2002-08-22 | 2002-08-22 | Polishing agent for semiconductor device and manufacturing method thereof using the same |
JP2002-242041 | 2002-08-22 | ||
US10/269,996 US6878631B2 (en) | 2002-08-22 | 2002-10-15 | Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasive |
US10/929,376 US20050026441A1 (en) | 2002-08-22 | 2004-08-31 | Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasive |
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US10/269,996 Division US6878631B2 (en) | 2002-08-22 | 2002-10-15 | Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasive |
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US10/269,996 Expired - Fee Related US6878631B2 (en) | 2002-08-22 | 2002-10-15 | Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasive |
US10/929,376 Abandoned US20050026441A1 (en) | 2002-08-22 | 2004-08-31 | Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasive |
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US (2) | US6878631B2 (en) |
JP (1) | JP2004079968A (en) |
KR (1) | KR100560012B1 (en) |
CN (1) | CN1485393A (en) |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9868886B2 (en) | 2011-12-28 | 2018-01-16 | Konica Minolta, Inc. | Abrasive agent for substrates and substrate manufacturing method |
US11180677B2 (en) | 2016-04-20 | 2021-11-23 | Shin-Etsu Chemical Co., Ltd. | Polishing agent for synthetic quartz glass substrate and method for polishing synthetic quartz glass substrate |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102007008232A1 (en) * | 2007-02-20 | 2008-08-21 | Evonik Degussa Gmbh | Dispersion containing ceria and colloidal silica |
DE102007062572A1 (en) * | 2007-12-22 | 2009-06-25 | Evonik Degussa Gmbh | Cerium oxide and colloidal silica containing dispersion |
JP7038022B2 (en) * | 2018-08-06 | 2022-03-17 | 日揮触媒化成株式会社 | Abrasive grain dispersion for polishing containing ceria-based fine particle dispersion, its manufacturing method, and ceria-based fine particle dispersion. |
JP7038031B2 (en) * | 2018-09-28 | 2022-03-17 | 日揮触媒化成株式会社 | Abrasive grain dispersion for polishing containing ceria-based composite fine particle dispersion, its manufacturing method, and ceria-based composite fine particle dispersion. |
WO2021072293A1 (en) | 2019-10-11 | 2021-04-15 | Saint-Gobain Abrasives, Inc. | Abrasive particle including coating, abrasive article including the abrasive particles, and method of forming |
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US4971602A (en) * | 1989-09-26 | 1990-11-20 | Crawford Robert B | Method for grinding gear teeth |
US6730245B2 (en) * | 1997-02-24 | 2004-05-04 | Superior Micropowders | Chemical-mechanical planarization slurries and powders and methods for using same |
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JPS5684782A (en) * | 1979-12-14 | 1981-07-10 | Fuji Electric Co Ltd | Cleaning abrasive material for electrophotographic photosensitive material |
DE4217720C1 (en) * | 1992-05-29 | 1993-11-04 | Starck H C Gmbh Co Kg | SINTERED VERBUNDSCHLEIFKOERPER, PROCESS FOR THEIR PRODUCTION AND THEIR USE |
JPH09321003A (en) | 1995-05-22 | 1997-12-12 | Sumitomo Chem Co Ltd | Abrasive, its manufacturing method and insulating film flattening method on semiconductor substrate using the abrasive |
JPH10135163A (en) | 1996-09-03 | 1998-05-22 | Sumitomo Chem Co Ltd | Compd. for polishing metal film on semiconductor substrate and method of palnarizing the metal film on semiconductor substrate |
-
2002
- 2002-08-22 JP JP2002242041A patent/JP2004079968A/en not_active Abandoned
- 2002-10-15 US US10/269,996 patent/US6878631B2/en not_active Expired - Fee Related
-
2003
- 2003-08-11 TW TW092121990A patent/TW200418965A/en unknown
- 2003-08-21 KR KR1020030057798A patent/KR100560012B1/en not_active IP Right Cessation
- 2003-08-22 CN CNA03155119XA patent/CN1485393A/en active Pending
-
2004
- 2004-08-31 US US10/929,376 patent/US20050026441A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4971602A (en) * | 1989-09-26 | 1990-11-20 | Crawford Robert B | Method for grinding gear teeth |
US6730245B2 (en) * | 1997-02-24 | 2004-05-04 | Superior Micropowders | Chemical-mechanical planarization slurries and powders and methods for using same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9868886B2 (en) | 2011-12-28 | 2018-01-16 | Konica Minolta, Inc. | Abrasive agent for substrates and substrate manufacturing method |
US11180677B2 (en) | 2016-04-20 | 2021-11-23 | Shin-Etsu Chemical Co., Ltd. | Polishing agent for synthetic quartz glass substrate and method for polishing synthetic quartz glass substrate |
Also Published As
Publication number | Publication date |
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CN1485393A (en) | 2004-03-31 |
TW200418965A (en) | 2004-10-01 |
KR20040018172A (en) | 2004-03-02 |
JP2004079968A (en) | 2004-03-11 |
US20040036149A1 (en) | 2004-02-26 |
KR100560012B1 (en) | 2006-03-15 |
US6878631B2 (en) | 2005-04-12 |
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