KR100392901B1 - 비대칭약간도프된드레인(lcd)mos소자의제조방법 - Google Patents

비대칭약간도프된드레인(lcd)mos소자의제조방법 Download PDF

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Publication number
KR100392901B1
KR100392901B1 KR1019970703986A KR19970703986A KR100392901B1 KR 100392901 B1 KR100392901 B1 KR 100392901B1 KR 1019970703986 A KR1019970703986 A KR 1019970703986A KR 19970703986 A KR19970703986 A KR 19970703986A KR 100392901 B1 KR100392901 B1 KR 100392901B1
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South Korea
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source
gate structure
region
transistor
mask layer
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English (en)
Korean (ko)
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KR980700683A (ko
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조대영
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아드밴스트 마이크로 디이바이시스 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0221—Manufacture or treatment of FETs having insulated gates [IGFET] having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended-drain MOSFETs [EDMOS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/017—Manufacturing their source or drain regions, e.g. silicided source or drain regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
KR1019970703986A 1994-12-15 1995-11-22 비대칭약간도프된드레인(lcd)mos소자의제조방법 Expired - Fee Related KR100392901B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/356,766 1994-12-15
US08/356,766 US5580804A (en) 1994-12-15 1994-12-15 Method for fabricating true LDD devices in a MOS technology

Publications (2)

Publication Number Publication Date
KR980700683A KR980700683A (ko) 1998-03-30
KR100392901B1 true KR100392901B1 (ko) 2003-11-20

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Application Number Title Priority Date Filing Date
KR1019970703986A Expired - Fee Related KR100392901B1 (ko) 1994-12-15 1995-11-22 비대칭약간도프된드레인(lcd)mos소자의제조방법

Country Status (6)

Country Link
US (1) US5580804A (enExample)
EP (1) EP0797841A1 (enExample)
JP (1) JP4314346B2 (enExample)
KR (1) KR100392901B1 (enExample)
TW (1) TW279262B (enExample)
WO (1) WO1996019010A1 (enExample)

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KR100212455B1 (ko) * 1996-11-04 1999-08-02 정선종 이중 게이트 구조의 반도체 소자 제조 방법
US5900666A (en) * 1996-12-03 1999-05-04 Advanced Micro Devices, Inc. Ultra-short transistor fabrication scheme for enhanced reliability
US5926714A (en) * 1996-12-03 1999-07-20 Advanced Micro Devices, Inc. Detached drain MOSFET
US6020232A (en) * 1996-12-03 2000-02-01 Advanced Micro Devices, Inc. Process of fabricating transistors having source and drain regions laterally displaced from the transistors gate
US5898202A (en) * 1996-12-03 1999-04-27 Advanced Micro Devices, Inc. Selective spacer formation for optimized silicon area reduction
US5834355A (en) * 1996-12-31 1998-11-10 Intel Corporation Method for implanting halo structures using removable spacer
US5905210A (en) * 1997-01-09 1999-05-18 Automotive Systems Laboratory, Inc. Villari effect seat weight sensor
US6039345A (en) * 1998-01-16 2000-03-21 Automotive Systems Laboratory, Inc. System and method for sensing vehicle door edge movement
JP4527814B2 (ja) * 1997-06-11 2010-08-18 富士通セミコンダクター株式会社 半導体装置の製造方法
US5925914A (en) * 1997-10-06 1999-07-20 Advanced Micro Devices Asymmetric S/D structure to improve transistor performance by reducing Miller capacitance
US6372590B1 (en) 1997-10-15 2002-04-16 Advanced Micro Devices, Inc. Method for making transistor having reduced series resistance
US5918128A (en) * 1998-06-08 1999-06-29 Advanced Micro Devices, Inc. Reduced channel length for a high performance CMOS transistor
US6124610A (en) 1998-06-26 2000-09-26 Advanced Micro Devices, Inc. Isotropically etching sidewall spacers to be used for both an NMOS source/drain implant and a PMOS LDD implant
US6153455A (en) 1998-10-13 2000-11-28 Advanced Micro Devices Method of fabricating ultra shallow junction CMOS transistors with nitride disposable spacer
US6362054B1 (en) 2000-03-13 2002-03-26 Agere Systems Guardian Corp. Method for fabricating MOS device with halo implanted region
WO2001071804A2 (en) * 2000-03-22 2001-09-27 The Board Of Trustees Of The University Of Illinois Lateral asymmetric lightly doped drain mosfet
US6448121B1 (en) * 2000-05-31 2002-09-10 Texas Instruments Incorporated High threshold PMOS transistor in a surface-channel process
US7217977B2 (en) * 2004-04-19 2007-05-15 Hrl Laboratories, Llc Covert transformation of transistor properties as a circuit protection method
US6465307B1 (en) * 2001-11-30 2002-10-15 Texas Instruments Incorporated Method for manufacturing an asymmetric I/O transistor
DE10224956A1 (de) * 2002-06-05 2004-01-08 Infineon Technologies Ag Verfahren zur Einstellung der Einsatzspannung eines Feldeffekttansistors, Feldeffekttransistor sowie integrierte Schaltung
US7049667B2 (en) 2002-09-27 2006-05-23 Hrl Laboratories, Llc Conductive channel pseudo block process and circuit to inhibit reverse engineering
AU2003293540A1 (en) * 2002-12-13 2004-07-09 Raytheon Company Integrated circuit modification using well implants
US6746924B1 (en) 2003-02-27 2004-06-08 International Business Machines Corporation Method of forming asymmetric extension mosfet using a drain side spacer
US6916716B1 (en) * 2003-10-24 2005-07-12 Advanced Micro Devices, Inc. Asymmetric halo implants
US7176095B1 (en) 2004-03-01 2007-02-13 Advanced Micro Devices, Inc. Bi-modal halo implantation
US7064396B2 (en) * 2004-03-01 2006-06-20 Freescale Semiconductor, Inc. Integrated circuit with multiple spacer insulating region widths
US7242063B1 (en) 2004-06-29 2007-07-10 Hrl Laboratories, Llc Symmetric non-intrusive and covert technique to render a transistor permanently non-operable
US7144782B1 (en) * 2004-07-02 2006-12-05 Advanced Micro Devices, Inc. Simplified masking for asymmetric halo
US8168487B2 (en) 2006-09-28 2012-05-01 Hrl Laboratories, Llc Programmable connection and isolation of active regions in an integrated circuit using ambiguous features to confuse a reverse engineer
US20090090980A1 (en) * 2007-10-08 2009-04-09 Mingchu King Asymmetric-ldd mos device
US7974119B2 (en) 2008-07-10 2011-07-05 Seagate Technology Llc Transmission gate-based spin-transfer torque memory unit
US9030867B2 (en) 2008-10-20 2015-05-12 Seagate Technology Llc Bipolar CMOS select device for resistive sense memory
US7936580B2 (en) 2008-10-20 2011-05-03 Seagate Technology Llc MRAM diode array and access method
US7936583B2 (en) 2008-10-30 2011-05-03 Seagate Technology Llc Variable resistive memory punchthrough access method
US7825478B2 (en) * 2008-11-07 2010-11-02 Seagate Technology Llc Polarity dependent switch for resistive sense memory
US8178864B2 (en) 2008-11-18 2012-05-15 Seagate Technology Llc Asymmetric barrier diode
US8203869B2 (en) 2008-12-02 2012-06-19 Seagate Technology Llc Bit line charge accumulation sensing for resistive changing memory
US8159856B2 (en) 2009-07-07 2012-04-17 Seagate Technology Llc Bipolar select device for resistive sense memory
US8158964B2 (en) 2009-07-13 2012-04-17 Seagate Technology Llc Schottky diode switch and memory units containing the same
US9000525B2 (en) * 2010-05-19 2015-04-07 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and method for alignment marks
US8648426B2 (en) 2010-12-17 2014-02-11 Seagate Technology Llc Tunneling transistors

Citations (1)

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US5349225A (en) * 1993-04-12 1994-09-20 Texas Instruments Incorporated Field effect transistor with a lightly doped drain

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US4318216A (en) * 1978-11-13 1982-03-09 Rca Corporation Extended drain self-aligned silicon gate MOSFET
JPS60182171A (ja) * 1984-02-29 1985-09-17 Oki Electric Ind Co Ltd 半導体装置の製造方法
JPH01186676A (ja) * 1988-01-14 1989-07-26 Pioneer Electron Corp 電界効果トランジスタ
US4965213A (en) * 1988-02-01 1990-10-23 Texas Instruments Incorporated Silicon-on-insulator transistor with body node to source node connection
JP2549689B2 (ja) * 1988-02-19 1996-10-30 三菱電機株式会社 Ｍｏｓトランジスタ及びその製造方法
US5144390A (en) * 1988-09-02 1992-09-01 Texas Instruments Incorporated Silicon-on insulator transistor with internal body node to source node connection
DE69224453T2 (de) * 1991-10-01 1998-09-24 Nippon Electric Co Verfahren zur Herstellung von einem LDD-MOSFET
JPH05129325A (ja) * 1991-10-31 1993-05-25 Sanyo Electric Co Ltd 半導体デバイス
JP3221766B2 (ja) * 1993-04-23 2001-10-22 三菱電機株式会社 電界効果トランジスタの製造方法
US5432366A (en) * 1993-05-28 1995-07-11 Board Of Regents Of The University Of Texas System P-I-N MOSFET for ULSI applications
US5409853A (en) * 1994-05-20 1995-04-25 International Business Machines Corporation Process of making silicided contacts for semiconductor devices

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5349225A (en) * 1993-04-12 1994-09-20 Texas Instruments Incorporated Field effect transistor with a lightly doped drain

Also Published As

Publication number Publication date
JPH10510951A (ja) 1998-10-20
WO1996019010A1 (en) 1996-06-20
US5580804A (en) 1996-12-03
EP0797841A1 (en) 1997-10-01
KR980700683A (ko) 1998-03-30
TW279262B (enExample) 1996-06-21
JP4314346B2 (ja) 2009-08-12

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