KR100389184B1 - 정전유도트랜지스터 - Google Patents
정전유도트랜지스터 Download PDFInfo
- Publication number
- KR100389184B1 KR100389184B1 KR1019960017381A KR19960017381A KR100389184B1 KR 100389184 B1 KR100389184 B1 KR 100389184B1 KR 1019960017381 A KR1019960017381 A KR 1019960017381A KR 19960017381 A KR19960017381 A KR 19960017381A KR 100389184 B1 KR100389184 B1 KR 100389184B1
- Authority
- KR
- South Korea
- Prior art keywords
- region
- gate
- guard ring
- disposed
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/012—Manufacture or treatment of static induction transistors [SIT], e.g. permeable base transistors [PBT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/202—FETs having static field-induced regions, e.g. static-induction transistors [SIT] or permeable base transistors [PBT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
- H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/252—Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
Landscapes
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP95-145179 | 1995-05-22 | ||
| JP95-145178 | 1995-05-22 | ||
| JP14517895A JP2692037B2 (ja) | 1995-05-22 | 1995-05-22 | 静電誘導トランジスタ及びその製造方法 |
| JP14517995A JP2700870B2 (ja) | 1995-05-22 | 1995-05-22 | 静電誘導トランジスタ及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR100389184B1 true KR100389184B1 (ko) | 2004-04-09 |
Family
ID=26476376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960017381A Expired - Fee Related KR100389184B1 (ko) | 1995-05-22 | 1996-05-22 | 정전유도트랜지스터 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5663582A (enExample) |
| KR (1) | KR100389184B1 (enExample) |
| CN (1) | CN1087504C (enExample) |
| TW (1) | TW295701B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5903020A (en) * | 1997-06-18 | 1999-05-11 | Northrop Grumman Corporation | Silicon carbide static induction transistor structure |
| JP4017763B2 (ja) * | 1998-09-30 | 2007-12-05 | 株式会社ルネサステクノロジ | 静電誘導トランジスタ |
| US6750477B2 (en) * | 1998-09-30 | 2004-06-15 | Hitachi, Ltd. | Static induction transistor |
| US6750104B2 (en) * | 2001-12-31 | 2004-06-15 | General Semiconductor, Inc. | High voltage power MOSFET having a voltage sustaining region that includes doped columns formed by trench etching using an etchant gas that is also a doping source |
| US6855970B2 (en) * | 2002-03-25 | 2005-02-15 | Kabushiki Kaisha Toshiba | High-breakdown-voltage semiconductor device |
| JP4222092B2 (ja) * | 2003-05-07 | 2009-02-12 | 富士電機デバイステクノロジー株式会社 | 半導体ウェハ、半導体装置および半導体装置の製造方法 |
| JP4757449B2 (ja) * | 2004-01-29 | 2011-08-24 | 三菱電機株式会社 | 半導体装置 |
| JP5381420B2 (ja) * | 2008-07-22 | 2014-01-08 | 富士電機株式会社 | 半導体装置 |
| US7825487B2 (en) * | 2008-09-30 | 2010-11-02 | Northrop Grumman Systems Corporation | Guard ring structures and method of fabricating thereof |
| WO2011025973A1 (en) * | 2009-08-28 | 2011-03-03 | Microsemi Corporation | Silicon carbide dual-mesa static induction transistor |
| US8519410B1 (en) | 2010-12-20 | 2013-08-27 | Microsemi Corporation | Silicon carbide vertical-sidewall dual-mesa static induction transistor |
| US10224407B2 (en) | 2017-02-28 | 2019-03-05 | Sandisk Technologies Llc | High voltage field effect transistor with laterally extended gate dielectric and method of making thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4364072A (en) * | 1978-03-17 | 1982-12-14 | Zaidan Hojin Handotai Kenkyu Shinkokai | Static induction type semiconductor device with multiple doped layers for potential modification |
| JP2509127B2 (ja) * | 1992-03-04 | 1996-06-19 | 財団法人半導体研究振興会 | 静電誘導デバイス |
| US5426314A (en) * | 1992-07-29 | 1995-06-20 | Zaidan Hojin Handotai Kenkyu Shinkokai | Insulated gate control static induction thyristor |
-
1996
- 1996-05-21 TW TW085105977A patent/TW295701B/zh not_active IP Right Cessation
- 1996-05-21 US US08/651,851 patent/US5663582A/en not_active Expired - Lifetime
- 1996-05-22 CN CN96110070A patent/CN1087504C/zh not_active Expired - Fee Related
- 1996-05-22 KR KR1019960017381A patent/KR100389184B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW295701B (enExample) | 1997-01-11 |
| US5663582A (en) | 1997-09-02 |
| CN1087504C (zh) | 2002-07-10 |
| CN1144402A (zh) | 1997-03-05 |
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