KR100316535B1 - 웨이퍼 정전 리프팅 장치 - Google Patents
웨이퍼 정전 리프팅 장치 Download PDFInfo
- Publication number
- KR100316535B1 KR100316535B1 KR1019990068219A KR19990068219A KR100316535B1 KR 100316535 B1 KR100316535 B1 KR 100316535B1 KR 1019990068219 A KR1019990068219 A KR 1019990068219A KR 19990068219 A KR19990068219 A KR 19990068219A KR 100316535 B1 KR100316535 B1 KR 100316535B1
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- electrostatic chuck
- electrostatic
- lower blade
- lifter
- Prior art date
Links
- 230000003068 static effect Effects 0.000 title 1
- 150000002500 ions Chemical class 0.000 claims abstract description 16
- 230000006378 damage Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (3)
- 정전척 장비의 일측 버퍼에 설치되고, 타측 챔버에 구비된 정전척에 웨이퍼를 이송시키는 이송용 로버트에 고전압이 인가됨과 아울러 음극으로 이용되는 상부 블레이드와, 웨이퍼 반송용으로 이용됨과 아울러, 웨이퍼에 음,양이온을 대전시키는 대전용으로 이용되는 하부 블레이드를 결합하고, 상기 하부 블레이드에 이온을 발생시키는 이온 발생기를 연결하여 구성된 것을 특징으로 하는 웨이퍼 정전 리프팅장치.
- 제 1 항에 있어서, 상기 상부 블레이드와 정전척 사이에 웨이퍼가 부상됨을 감지하기 위한 위치감지센서가 구비되어 구성된 것을 특징으로 하는 웨이퍼 정전 리프팅장치.
- 제 2 항에 있어서, 상기 위치감지센서는 상기 웨이퍼의 주위 상,하부에 위치하도록 발광소자와, 수광소자를 각각 2개씩 설치하여 구성된 것을 특징으로 하는 웨이퍼 정전 리프팅장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990068219A KR100316535B1 (ko) | 1999-12-31 | 1999-12-31 | 웨이퍼 정전 리프팅 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990068219A KR100316535B1 (ko) | 1999-12-31 | 1999-12-31 | 웨이퍼 정전 리프팅 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010060100A KR20010060100A (ko) | 2001-07-06 |
KR100316535B1 true KR100316535B1 (ko) | 2001-12-12 |
Family
ID=19635305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019990068219A KR100316535B1 (ko) | 1999-12-31 | 1999-12-31 | 웨이퍼 정전 리프팅 장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100316535B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190031664A (ko) | 2017-09-18 | 2019-03-27 | 주식회사 이에스티 | 발광 부재를 이용한 대상체 정렬 정전척 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01227453A (ja) * | 1988-03-08 | 1989-09-11 | Fujitsu Ltd | ウエーハ搬送具 |
KR960027794U (ko) * | 1995-01-11 | 1996-08-17 | 엘지반도체주식회사 | 웨이퍼 이송장치 |
JPH10163306A (ja) * | 1996-12-04 | 1998-06-19 | Sony Corp | 半導体装置の製造方法及び製造装置 |
KR19980036868U (ko) * | 1996-12-16 | 1998-09-15 | 구자홍 | 반도체 제조장비용 이송로봇의 웨이퍼(Wefer) 고정장치 |
JPH11135599A (ja) * | 1997-10-29 | 1999-05-21 | Yaskawa Electric Corp | 静電浮上搬送装置 |
JPH11330217A (ja) * | 1998-05-12 | 1999-11-30 | Ulvac Corp | 静電チャックプレート表面からの基板離脱方法 |
-
1999
- 1999-12-31 KR KR1019990068219A patent/KR100316535B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01227453A (ja) * | 1988-03-08 | 1989-09-11 | Fujitsu Ltd | ウエーハ搬送具 |
KR960027794U (ko) * | 1995-01-11 | 1996-08-17 | 엘지반도체주식회사 | 웨이퍼 이송장치 |
JPH10163306A (ja) * | 1996-12-04 | 1998-06-19 | Sony Corp | 半導体装置の製造方法及び製造装置 |
KR19980036868U (ko) * | 1996-12-16 | 1998-09-15 | 구자홍 | 반도체 제조장비용 이송로봇의 웨이퍼(Wefer) 고정장치 |
JPH11135599A (ja) * | 1997-10-29 | 1999-05-21 | Yaskawa Electric Corp | 静電浮上搬送装置 |
JPH11330217A (ja) * | 1998-05-12 | 1999-11-30 | Ulvac Corp | 静電チャックプレート表面からの基板離脱方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190031664A (ko) | 2017-09-18 | 2019-03-27 | 주식회사 이에스티 | 발광 부재를 이용한 대상체 정렬 정전척 |
Also Published As
Publication number | Publication date |
---|---|
KR20010060100A (ko) | 2001-07-06 |
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