KR100314624B1 - device for adjust etching thickness of PCB - Google Patents
device for adjust etching thickness of PCB Download PDFInfo
- Publication number
- KR100314624B1 KR100314624B1 KR1019990007258A KR19990007258A KR100314624B1 KR 100314624 B1 KR100314624 B1 KR 100314624B1 KR 1019990007258 A KR1019990007258 A KR 1019990007258A KR 19990007258 A KR19990007258 A KR 19990007258A KR 100314624 B1 KR100314624 B1 KR 100314624B1
- Authority
- KR
- South Korea
- Prior art keywords
- etching
- pcb
- sides
- bath
- chamber
- Prior art date
Links
- 238000005530 etching Methods 0.000 title claims abstract description 148
- 239000007788 liquid Substances 0.000 claims abstract description 32
- ARXHIJMGSIYYRZ-UHFFFAOYSA-N 1,2,4-trichloro-3-(3,4-dichlorophenyl)benzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=C(Cl)C=CC(Cl)=C1Cl ARXHIJMGSIYYRZ-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000007747 plating Methods 0.000 claims abstract description 22
- 238000002347 injection Methods 0.000 claims abstract description 20
- 239000007924 injection Substances 0.000 claims abstract description 20
- 239000000243 solution Substances 0.000 claims description 18
- 230000000903 blocking effect Effects 0.000 claims description 6
- 238000011084 recovery Methods 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000011889 copper foil Substances 0.000 abstract description 6
- WVHNUGRFECMVLQ-UHFFFAOYSA-N 1,3-dichloro-2-(2,4-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=C(Cl)C=CC=C1Cl WVHNUGRFECMVLQ-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 230000004069 differentiation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0353—Making conductive layer thin, e.g. by etching
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Abstract
본 발명은 PCB의 양면에 에칭되는 동박 도금두께를 각각 다르게 형성시킬수 있는 양면 에칭두께 조정장치에 관한 것으로 이는 특히, 에칭조(120)의 일측에는 공급리일(100)을 통해 공급되는 PCB(110) 양면에 에칭액이 도포되는 에칭챔버(170)가 설치되고, 상기 에칭챔버(170)의 양측에는 전원과 연설되어 PCB(110)를 이송하는 도전롤러(130)(130')가 설치되며, 상기 에칭챔버(170)의 상,하측에 에칭조(120)와 공급관(180)을 통해 연설되는 에칭액 분사노즐(140)(140')이 각각 설치되고, 상기 상,하측 에칭액 분사노즐(140)(140')은 에칭액 분사압력이 각각 다르게 형성되도록 하는 것이다.The present invention relates to a double-sided etching thickness adjusting apparatus that can form a different copper foil plating thickness to be etched on both sides of the PCB, in particular, one side of the etching bath 120, the PCB 110 is supplied through the supply rail (100) Etching chambers 170 are applied to both surfaces of the etching chamber, and both sides of the etching chamber 170 are provided with conductive rollers 130 and 130 ′ that are transferred to the power supply and are transferred to the PCB 110. Etching liquid injection nozzles 140 and 140 'are provided at the upper and lower sides of the chamber 170 through the etching bath 120 and the supply pipe 180, respectively, and the upper and lower etching liquid injection nozzles 140 and 140 are respectively provided. ') Is to make the etching liquid injection pressure differently.
이에따라서, 에칭액 분사노즐의 에칭액 분사압력을 조정하여 이송되는 PCB의 양면에 차등화된 에칭 도금층을 손쉽고, 용이하게 형성시킬 수 있는 것이다.Accordingly, it is possible to easily and easily form the differential etching plating layers on both sides of the PCB to be transported by adjusting the etching liquid injection pressure of the etching liquid injection nozzle.
Description
본 발명은 인쇄회로기판(이하 'PCB' 라함)의 양면에 각각 특성이 다른 에칭작업시 상기 에칭두께를 각각 다르게 형성시킬수 있는 PCB의 양면 에칭두께 조정장치에 관한 것으로 이는 특히, PCB 공급리일을 통해 공급되는 PCB 양면에 에칭액이 도포되는 에칭챔버의 상,하측에 에칭조와 공급관을 통해 연설되는 에칭액 분사노즐이 설치되며, 상기 상,하측 에칭액 분사노즐의 에칭액 분사압력이 각각 다르게 형성되어 PCB의 양면 에칭두께를 다르게 수행토록 함으로 인하여, 단일 에칭 챔버의 내부에서 에칭조와 연설된 에칭액 분사노즐의 에칭액 분사압력을 조정하여 이송되는 PCB의 양면에 차등화된 에칭 도금층을 손쉽고, 용이하게 형성시킬수 있도록 함은 물론, 이에따라 PCB의 양면 에칭 도금 차별화에 의한 특성을 향상시킬수 있도록한 PCB의 양면 에칭두께 조정장치에 관한 것이다.The present invention relates to a double-sided etching thickness adjusting device of the PCB that can form the etching thickness differently during the etching operation having different characteristics on both sides of the printed circuit board (hereinafter referred to as 'PCB'), in particular through the PCB supply rail Etching liquid injection nozzles provided through the etching bath and the supply pipe are installed on the upper and lower sides of the etching chamber to which the etching liquid is applied on both sides of the PCB to be supplied. By varying the thickness, it is possible to easily and easily form the differential etching plating layers on both sides of the PCB to be transferred by adjusting the etching liquid injection pressure of the etching tank and the etching liquid injection nozzle inside the single etching chamber. Accordingly, the thickness of the double-sided etching thickness of the PCB can be improved to improve the characteristics by differentiating the double-sided etching plating of the PCB It relates to an apparatus.
일반적으로 알려져있는 종래의 PCB 표면에 에칭처리를 수행하는 방법에 있어서는, 공급리일(50)에 권취되어 필름상으로 이송되는 시이트상의 PCB(51)가 에칭조(52) 내부를 이송토록 그 양측에 도전 롤러(53)(53')가 각각 설치되며, 상기 에칭조(52) 내부에는 이송되는 PCB(51)의 상측으로 에칭액 분사노즐(54)이 다수개 설치되어 PCB(51)의 표면에 에칭액(55)이 도포토록 하며, 상기 에칭처리된 PCB(51)는 회수리일(56)에 감겨지게 되는 구성으로 이루어진다.In a conventionally known method of performing an etching treatment on a surface of a PCB, a sheet-like PCB 51 wound around the supply rail 50 and conveyed onto a film is transported on both sides thereof so that the inside of the etching tank 52 is transported. Each of the conductive rollers 53 and 53 ′ is provided, and a plurality of etching solution spray nozzles 54 are installed above the PCB 51 to be transferred to the inside of the etching tank 52, so that the etching solution is formed on the surface of the PCB 51. The 55 is doped and the etched PCB 51 is wound around the recovery rail 56.
상기와같은 종래의 PCB는, 공급리일(50)에 감겨서 이송되는 시이트상의 PCB(51)가 도전 롤러(53)(53')를 통해 그 표면에 전류가 인가되면서 에칭조(52)내부로 공급되며, 이때 상기 에칭조(52)의 내부에는 에칭액 분사노즐(54)이 다수개 순차로 설치되어 이송되는 PCB(51)의 표면으로 에칭액(55)을 분사토록 함으로써, 상기 PCB(51)의 표면에 동박에칭 작업을 수행하게 되고, 상기와같이 동박 에칭작업이 완료된 PCB(51)는 회수리일(56)에 감겨지게 되는 것이다.In the conventional PCB as described above, the sheet-shaped PCB 51 wound around the supply rail 50 is transferred into the etching bath 52 while a current is applied to the surface of the sheet 51 through the conductive rollers 53 and 53 '. In this case, the etching solution 52 is provided inside the etching bath 52 so that the etching solution 55 is sprayed onto the surface of the PCB 51 in which a plurality of etching solution injection nozzles 54 are sequentially installed and transported. The copper foil etching operation is performed on the surface, and the PCB 51 having the copper foil etching operation completed as described above is wound around the recovery rail 56.
그러나, 상기와같은 PCB의 에칭처리 방법에 있어서는, PCB(51)의 양면에 서로 다른 두께를 갖는 에칭 도금층의 형성이 불가능하게 될 뿐만 아니라, 필요에따라 PCB(51) 상에 차별화된 에칭 도금층의 형성시, PCB(51) 일측면은 에칭이 않되도록 레지스터를 도포하여 에칭조를 통과후, 재차 PCB 이면의 레지스터를 박리시키고에칭 도금면에 레지스터를 도포하여 에칭조를 통과시켜 차별화된 이형 에칭작업을 수행하게 관계로, 그 공정이 복잡하게 되며, 작업성 및 생산성이 크게 저하되는등 많은 문제점이 있는 것이다.However, in the etching processing method of the PCB as described above, not only the formation of the etching plating layers having different thicknesses on both sides of the PCB 51 becomes possible, but also the differentiation of the etching plating layers on the PCB 51 as necessary. At the time of formation, one side of PCB 51 is coated with a resistor so as not to be etched, and then passes through an etching bath, and then the resistor on the back surface of the PCB is peeled off again, and a resistor is applied to the etching plating surface to pass through the etching bath to differentiate the etching process As a result, the process becomes complicated, and workability and productivity are greatly reduced.
본 발명은 상기한 바와같은 종래의 여러 문제점들을 개선하기 위하여 안출된 것으로서 그 목적은, 단일 에칭 챔버의 내부에서 에칭조와 연설된 에칭액 분사노즐의 에칭액 분사압력을 조정하여 이송되는 PCB의 양면에 차등화된 에칭 도금층을 손쉽고, 용이하게 형성시킬수 있도록 함은 물론, 상기 PCB의 양면 에칭 도금 차별화에 의한 특성을 향상시킬 수 있도록 하고, 이에따라 에칭작업시의 작업성 및 생산성을 가일층 향상킬 수 있는 PCB의 양면 에칭두께 조정장치를 제공하는데 있다.SUMMARY OF THE INVENTION The present invention has been made to solve various problems of the related art as described above, and an object thereof is to provide differential pressure on both sides of a PCB to be transported by adjusting an etching solution spraying pressure of an etching bath and an etching solution spraying nozzle inside a single etching chamber. Easily and easily form the etching plating layer, as well as to improve the characteristics by the differentiation of the two-sided etching plating of the PCB, thereby improving the workability and productivity during the etching operation, thereby double-sided etching of the PCB It is to provide a thickness adjusting device.
도 1은 일반적인 PCB의 에칭 도금층 형성을 위한 에칭장치의 개략 정면 구성도.1 is a schematic front configuration diagram of an etching apparatus for forming an etching plating layer of a general PCB.
도 2는 본 발명에 따른 기판 양면 도금두께 조정장치를 설명하기 위한 PCB 에칭 도금장치의 개략 구성도.2 is a schematic configuration diagram of a PCB etching plating apparatus for explaining a substrate double-side plating thickness adjusting apparatus according to the present invention.
도 3은 본 발명인 PCB의 양면 에칭도금 차별화를 위한 에칭챔버의 정면 요부 구조도.Figure 3 is a front view of the main structure of the etching chamber for differentiating the etching plating of the present invention PCB.
도 4는 본 발명의 에칭챔버 양측으로 설치되는 에칭액 차단막을 나타낸 에칭챔버의 측면 요부 구조도.Figure 4 is a side structure of the main portion of the etching chamber showing the etching liquid blocking film provided on both sides of the etching chamber of the present invention.
* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
100...공급리일 110...PCB100.Supply lead 110 ... PCB
120...에칭조 130,130'...도전롤러120 ... Etching tank 130,130 '... Challenge roller
140,140'...에칭액 분사노즐 150...에칭액140,140 '... Etching liquid injection nozzle 150 ... Etching liquid
160...회수리일 170...에칭챔버160 ... Recovery date 170 ... Etching chamber
180...공급관 190...홀180 ... Supply pipe 190 ... Hole
200...에칭액 차단막Etching liquid barrier
상기 목적을 달성하기 위한 기술적인 구성으로서 본 발명은, 에칭조의 일측에는 공급리일을 통해 공급되는 PCB 양면에 에칭액이 도포토록 설치되는 에칭챔버와,As a technical configuration for achieving the above object, the present invention, the etching chamber is installed on both sides of the PCB to be supplied through the supply rail to the etching bath is doped with an etching solution;
상기 에칭챔버의 양측으로 설치되어 PCB를 이송하며 전원을 공급토록 전원과 연설되는 도전롤러와,A conductive roller installed at both sides of the etching chamber to convey PCB and supply power to the substrate;
상기 에칭챔버의 상,하측에 에칭조와 공급관을 통해 연설되어 이송 PCB의 양면에 에칭 도금을 수행하는 에칭액 분사노즐을 포함하여 구성됨을 특징으로 하는 PCB의 양면 에칭두께 조정장치를 마련함에 의한다.By etching through the etching bath and the supply pipe on the upper and lower sides of the etching chamber comprises an etching liquid injection nozzle for performing etching plating on both sides of the transfer PCB by providing an apparatus for adjusting both sides etching thickness of the PCB.
이하, 첨부된 도면에 의거하여 본 발명의 실시예를 상세하게 설명하면 다음과 같다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명에 따른 기판 양면 도금두께 조정장치를 설명하기 위한 PCB 에칭 도금장치의 개략 구성도이고, 도 3은 본 발명인 PCB의 양면 에칭도금 차별화를 위한 에칭챔버의 요부 구조도로서, 공급리일(100)에 권취되어 필름상으로 이송되는 시이트상의 PCB(110)가 에칭조(120) 내부를 이송토록 설치되며, 상기에칭조(120) 내부에는 이송되는 PCB(110)의 상측으로 에칭액 분사노즐(140)이 다수개 설치되어 PCB(110)의 표면에 에칭액(150)이 도포토록 하며, 상기 에칭조(120) 일측에는 에칭처리된 PCB(110)가 감겨지는 회수리일(160)이 설치된다.2 is a schematic configuration diagram of a PCB etching plating apparatus for explaining a substrate double-side plating thickness adjusting apparatus according to the present invention, Figure 3 is a structural diagram of the main portion of the etching chamber for differentiating the etching plating of the PCB of the present invention, the supply rail ( The sheet-shaped PCB 110 wound around the film 100 and transported to the film is installed to transport the inside of the etching bath 120, and the etching liquid injection nozzle is installed on the inside of the etching bath 120. A plurality of 140 are installed to allow the etching solution 150 to conduct on the surface of the PCB 110, and a recovery rail 160 is formed on one side of the etching bath 120 to wind the etched PCB 110. .
또한, 상기 에칭조(120)의 일측에는 공급리일(100)을 통해 공급되는 PCB(110) 양면에 에칭액이 도포되는 에칭챔버(170)가 설치되고, 상기 에칭챔버(170)의 양측에는 전원과 연설되어 PCB(110)를 이송하는 도전롤러(130)(130')가 설치되며, 상기 에칭챔버(170)의 상,하측에 에칭조(120)와 공급관(180)을 통해 연설되는 에칭액 분사노즐(140)(140')이 각각 설치되고, 상기 상,하측 에칭액 분사노즐(140)(140')은 에칭액 분사압력이 각각 다르게 형성되도록 한다.In addition, an etching chamber 170 in which etching liquid is applied to both sides of the PCB 110 supplied through the supply rail 100 is installed at one side of the etching bath 120, and both sides of the etching chamber 170 are provided with a power source. The conductive rollers 130 and 130 'are installed to transfer the PCB 110, and the etching liquid spray nozzles are provided through the etching bath 120 and the supply pipe 180 on the upper and lower sides of the etching chamber 170. 140 and 140 'are respectively provided, and the upper and lower etching liquid injection nozzles 140 and 140' are formed to have different etching liquid injection pressures.
또한, 상기 에칭챔버(170)의 내부 양측에는 홀(190)이 다수개 형성되는 에칭액 차단막(200)이 이송되는 PCB(110) 양단에 근접되어 설치되는 구성으로 이루어진다.In addition, both sides of the etching chamber 170 may be configured to be installed close to both ends of the PCB 110 to which the etching solution blocking film 200 having a plurality of holes 190 is formed.
이와같은 구성으로 이루어진 본 발명의 작용 및 효과를 설명하면 다음과 같다.Referring to the operation and effect of the present invention made of such a configuration as follows.
도2 내지 도 4에 도시한 바와 같이, PCB 공급리일(100)을 통해 롤(Roll) 상태로 이송되는 필름 시이트상의 PCB(110)가 에칭챔버(170)의 내부를 이송시, 상기 에칭챔버(170)의 양측에는 전원과 연결된 도전 롤러(130)(130')가 각각 설치되어 이송되는 PCB(110)의 양면에 전류를 인가시키면서 에칭챔버(170) 내부에서 양면 에칭작업을 수행하게 된다.2 to 4, when the PCB 110 on the film sheet transferred to the roll state through the PCB supply rail 100 transfers the inside of the etching chamber 170, the etching chamber ( On both sides of the 170, the conductive rollers 130 and 130 ′ connected to the power supply are respectively installed to perform double-sided etching in the etching chamber 170 while applying current to both sides of the PCB 110.
상기와같이 에칭챔버(170) 내부를 통과하는 PCB(110)는 도 3에서와 같이, PCB(110) 양면에 에칭작업을 통한 차별화된 동박 도금작업을 수행할 경우에는, 상기 에칭챔버(170)의 상,하측으로 설치되는 에칭액 분사노즐(140)(140')의 에칭액(150) 분사압력을 서로 다르게 조정하여 이송되는 PCB(110)의 양면에 동박두께가 서로 다른 에칭작업을 수행할 수 있도록 한다.As described above, the PCB 110 passing through the inside of the etching chamber 170, as shown in Figure 3, when performing a differentiated copper foil plating operation through the etching operation on both sides of the PCB 110, the etching chamber 170 The etching pressure of the etching liquid injection nozzles 140 and 140 'installed at the upper and lower sides of the etching liquid 150 is adjusted differently so that copper foil thicknesses on both surfaces of the PCB 110 can be etched differently. do.
이때, 상기 에칭챔버(170)의 상,하측에 설치되는 에칭액 분사노즐 (140)(140')은, 에칭조(120)와 공급관(180)을 통해 연설되어 에칭액(150)이 원할하게 공급토록 되고, 상기 상,하측 에칭액 분사노즐(140)(140')을 통한 에칭액의 분사시, 상기 에칭액(150)이 PCB(110)의 이면으로 흐르지 않도록 에칭챔버(170)의 내부 양측에는 도 4에서와 같은 에칭액 차단막(200)이 위치되어, 이송되는 PCB(110) 양단에 근접되어 설치토록 됨으로써, 상기 PCB(110)의 양면에는 에칭에 의한 동박두께가 서로 차별화될 수 있도록 한다.At this time, the etching liquid injection nozzles 140 and 140 'installed on the upper and lower sides of the etching chamber 170 are extended through the etching tank 120 and the supply pipe 180 to smoothly supply the etching liquid 150. When the etching liquid is injected through the upper and lower etching liquid injection nozzles 140 and 140 ′, the etching liquid 150 does not flow to the rear surface of the PCB 110 so that the inside of both sides of the etching chamber 170 are shown in FIG. 4. As the etching solution blocking film 200 is positioned and installed close to both ends of the PCB 110 to be transferred, copper foil thicknesses due to etching may be differentiated from both sides of the PCB 110.
또한, 상기 에칭챔버(170)의 내부 양측에 설치되어 상하로 분사되는 에칭액을 차단시키는 에칭액 차단막(200)에는 다수의 홀(190)이 형성토록 되어, 에칭액이 에칭조(120)로 원할하게 유입될 수 있는 것이다.In addition, a plurality of holes 190 are formed in the etching liquid blocking film 200 which is installed at both sides of the etching chamber 170 to block the etching liquid injected up and down, so that the etching liquid smoothly flows into the etching tank 120. It can be.
이상과같이 본 발명에 따른 PCB의 양면 에칭두께 조정장치에 의하면, 단일 에칭 챔버의 내부에서 에칭조와 연설된 에칭액 분사노즐의 에칭액 분사압력을 조정하여 이송되는 PCB의 양면에 차등화된 에칭 도금층을 손쉽고, 용이하게 형성시킬수 있게 됨은 물론, 상기 PCB의 양면 에칭 도금 차별화에 의한 특성을 향상시킬 수 있게 되고, 이에따라 에칭작업시의 작업성 및 생산성을 가일층 향상킬 수 있는 우수한 효과가 있다.According to the two-sided etching thickness adjusting apparatus of the PCB according to the present invention as described above, it is easy to adjust the etching liquid injection pressure of the etching solution spray nozzles and the etching solution sprayed inside the single etching chamber to easily differentiate the etching plating layer on both sides of the PCB to be transferred, It can be easily formed, of course, it is possible to improve the characteristics by the two-sided etching plating differentiation of the PCB, accordingly there is an excellent effect that can further improve the workability and productivity during the etching operation.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990007258A KR100314624B1 (en) | 1999-03-05 | 1999-03-05 | device for adjust etching thickness of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019990007258A KR100314624B1 (en) | 1999-03-05 | 1999-03-05 | device for adjust etching thickness of PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20000059563A KR20000059563A (en) | 2000-10-05 |
| KR100314624B1 true KR100314624B1 (en) | 2001-11-15 |
Family
ID=19575632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019990007258A KR100314624B1 (en) | 1999-03-05 | 1999-03-05 | device for adjust etching thickness of PCB |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100314624B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110191589A (en) * | 2019-05-27 | 2019-08-30 | 深圳市三德冠精密电路科技有限公司 | A kind of two-sided engraving method applied to flexible circuit board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100677938B1 (en) * | 2004-12-30 | 2007-02-05 | 엘지마이크론 주식회사 | Manufacturing mehtod of double-sides wiring board and double-sides wiring board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0575236A (en) * | 1991-09-13 | 1993-03-26 | Matsushita Electric Works Ltd | Etching device of metal clad laminated board |
-
1999
- 1999-03-05 KR KR1019990007258A patent/KR100314624B1/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0575236A (en) * | 1991-09-13 | 1993-03-26 | Matsushita Electric Works Ltd | Etching device of metal clad laminated board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110191589A (en) * | 2019-05-27 | 2019-08-30 | 深圳市三德冠精密电路科技有限公司 | A kind of two-sided engraving method applied to flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20000059563A (en) | 2000-10-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3518676B2 (en) | Surface treatment equipment for printed wiring board materials | |
| CN101374386A (en) | Method for preparing printed circuit board | |
| CN106605294A (en) | Semiconductor device and method for manufacturing semiconductor device | |
| CN103188879A (en) | Preparation method of inner layer of thick copper thin circuit board of printed circuit board | |
| TWI280990B (en) | Etching device for electroplating substrate | |
| KR100314624B1 (en) | device for adjust etching thickness of PCB | |
| US20040040148A1 (en) | Manufacture of flexible printed circuit boards | |
| KR20130110445A (en) | Apparatus for coating substrate and method for coating substrate | |
| KR20100044351A (en) | A wiring method of circuit for an ultra water repellent fpcb | |
| WO2014013962A1 (en) | Continuous pattern plating transfer system and method for manufacturing continuous pattern plating transfer material | |
| US20110284162A1 (en) | Apparatus for wet processing substrate | |
| KR100286738B1 (en) | double-faced spread device of sensitizer | |
| JP2005220370A (en) | Double-sided etching method and double-sided etching system | |
| KR100270067B1 (en) | Method and device for coating different double-faced of pcb | |
| JP2006245446A (en) | Resist peeling and removing device | |
| JP3434834B2 (en) | Printed wiring board etching apparatus and printed wiring board manufacturing method using the same | |
| CN212355893U (en) | Tension transmission device of roll type wet processing production equipment | |
| US6344106B1 (en) | Apparatus, and corresponding method, for chemically etching substrates | |
| TWM605576U (en) | Tension transfer device of roll-form wet process production facility | |
| KR20160087615A (en) | Equipment for manufacturing flexible circuit board | |
| JP3082359B2 (en) | Printed wiring board etching apparatus and printed wiring board etching method using the same | |
| JP2007109987A (en) | Substrate etching apparatus | |
| JP2001036217A (en) | Manufacture of wiring board and etching device | |
| JP2778262B2 (en) | Printed wiring board etching apparatus and printed wiring board manufacturing method using the same | |
| JP2903789B2 (en) | Printed wiring board etching method and etching apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| LAPS | Lapse due to unpaid annual fee |