KR100313308B1 - 나선형자기선형전동공구 - Google Patents

나선형자기선형전동공구 Download PDF

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Publication number
KR100313308B1
KR100313308B1 KR1019960700222A KR19960700222A KR100313308B1 KR 100313308 B1 KR100313308 B1 KR 100313308B1 KR 1019960700222 A KR1019960700222 A KR 1019960700222A KR 19960700222 A KR19960700222 A KR 19960700222A KR 100313308 B1 KR100313308 B1 KR 100313308B1
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KR
South Korea
Prior art keywords
magnetic
drive
wafer
support
along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019960700222A
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English (en)
Korean (ko)
Other versions
KR960704344A (ko
Inventor
데리기 마리오
데빈스카이 세니아
Original Assignee
도쿄 엘렉트론 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 도쿄 엘렉트론 가부시키가이샤 filed Critical 도쿄 엘렉트론 가부시키가이샤
Publication of KR960704344A publication Critical patent/KR960704344A/ko
Application granted granted Critical
Publication of KR100313308B1 publication Critical patent/KR100313308B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Transmission Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1019960700222A 1993-07-15 1994-06-13 나선형자기선형전동공구 Expired - Fee Related KR100313308B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/092,004 US5377816A (en) 1993-07-15 1993-07-15 Spiral magnetic linear translating mechanism
US092004 1993-07-15

Publications (2)

Publication Number Publication Date
KR960704344A KR960704344A (ko) 1996-08-31
KR100313308B1 true KR100313308B1 (ko) 2003-10-04

Family

ID=22230743

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960700222A Expired - Fee Related KR100313308B1 (ko) 1993-07-15 1994-06-13 나선형자기선형전동공구

Country Status (9)

Country Link
US (1) US5377816A (enExample)
EP (1) EP0708979A1 (enExample)
JP (1) JP3273791B2 (enExample)
KR (1) KR100313308B1 (enExample)
AU (1) AU7314194A (enExample)
CA (1) CA2164971A1 (enExample)
SG (1) SG47561A1 (enExample)
TW (1) TW241386B (enExample)
WO (1) WO1995002891A1 (enExample)

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JP2683317B2 (ja) * 1993-11-19 1997-11-26 マルヤス機械株式会社 コンベア
JP3732250B2 (ja) * 1995-03-30 2006-01-05 キヤノンアネルバ株式会社 インライン式成膜装置
US5958134A (en) * 1995-06-07 1999-09-28 Tokyo Electron Limited Process equipment with simultaneous or sequential deposition and etching capabilities
US5795448A (en) * 1995-12-08 1998-08-18 Sony Corporation Magnetic device for rotating a substrate
US5881649A (en) * 1996-08-13 1999-03-16 Anelva Corporation Magnetic transfer system, power transmission mechanism of the magnetic transfer system, and rotational driving member used for the system
JP3894461B2 (ja) * 1997-01-17 2007-03-22 キヤノンアネルバ株式会社 非接触式磁気搬送装置の位置決め制御装置および位置決め制御方法
US6129704A (en) * 1997-06-12 2000-10-10 Schneider (Usa) Inc. Perfusion balloon catheter having a magnetically driven impeller
US6235634B1 (en) 1997-10-08 2001-05-22 Applied Komatsu Technology, Inc. Modular substrate processing system
DE19753656C1 (de) * 1997-12-03 1998-12-03 Fraunhofer Ges Forschung Einrichtung zur Vakuumbeschichtung von Gleitlagern
US6206176B1 (en) * 1998-05-20 2001-03-27 Applied Komatsu Technology, Inc. Substrate transfer shuttle having a magnetic drive
US6517303B1 (en) 1998-05-20 2003-02-11 Applied Komatsu Technology, Inc. Substrate transfer shuttle
US6213704B1 (en) 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Method and apparatus for substrate transfer and processing
US6215897B1 (en) 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Automated substrate processing system
TW552306B (en) 1999-03-26 2003-09-11 Anelva Corp Method of removing accumulated films from the surfaces of substrate holders in film deposition apparatus, and film deposition apparatus
US6298685B1 (en) 1999-11-03 2001-10-09 Applied Materials, Inc. Consecutive deposition system
US6682288B2 (en) * 2000-07-27 2004-01-27 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6821912B2 (en) 2000-07-27 2004-11-23 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
JP2002068476A (ja) 2000-08-29 2002-03-08 Anelva Corp 磁気搬送装置
US6935828B2 (en) 2002-07-17 2005-08-30 Transfer Engineering And Manufacturing, Inc. Wafer load lock and magnetically coupled linear delivery system
DE10247051A1 (de) * 2002-10-09 2004-04-22 Polymer Latex Gmbh & Co Kg Latex und Verfahren zu seiner Herstellung
US7100954B2 (en) * 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
DE102006037109B4 (de) * 2006-08-07 2010-11-11 Kba-Metronic Aktiengesellschaft Verfahren und Vorrichtung zur Bedruckung von Einzelobjekten
TWI316502B (en) * 2006-08-11 2009-11-01 Ind Tech Res Inst Substrate transportation device
US7770714B2 (en) * 2007-08-27 2010-08-10 Canon Anelva Corporation Transfer apparatus
WO2009085840A2 (en) * 2007-12-28 2009-07-09 Lam Research Corporation Wafer carrier drive apparatus and method for operating the same
JP2011047515A (ja) * 2009-07-28 2011-03-10 Canon Anelva Corp 駆動装置及び真空処理装置
US9837294B2 (en) * 2011-09-16 2017-12-05 Persimmon Technologies Corporation Wafer transport system
SG10201701595QA (en) * 2012-02-28 2017-03-30 Applied Materials Inc Substrate carrier plate
WO2013189549A1 (de) * 2012-06-22 2013-12-27 Norbert Ruez Gmbh & Co.Kg Vorrichtung zum abscheiden magnetisierbarer verunreinigungen aus strömenden fluiden
JP5997952B2 (ja) * 2012-07-06 2016-09-28 大陽日酸株式会社 気相成長装置
JP6368499B2 (ja) 2014-02-12 2018-08-01 あおい精機株式会社 搬送装置
JP6266488B2 (ja) * 2014-10-30 2018-01-24 アズビル株式会社 温度管理装置、搬送装置、及び搬送台
US9688473B2 (en) 2015-03-02 2017-06-27 Lorin Reed Conveying systems and methods of use
JP6616954B2 (ja) * 2015-03-31 2019-12-04 あおい精機株式会社 搬送装置
CN105151803B (zh) * 2015-09-24 2018-03-27 Abb瑞士股份有限公司 输送装置及其传输系统
NZ765295A (en) * 2017-11-22 2023-02-24 Lorin REED Improved produce conveying and sizing equipment
FR3083532B1 (fr) * 2018-07-03 2021-10-22 Prodel Tech Dispositif de transfert perfectionne
DE102024100185A1 (de) * 2024-01-04 2025-07-10 Krones Aktiengesellschaft Transporteinrichtung

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Also Published As

Publication number Publication date
EP0708979A1 (en) 1996-05-01
TW241386B (enExample) 1995-02-21
WO1995002891A1 (en) 1995-01-26
SG47561A1 (en) 1998-04-17
AU7314194A (en) 1995-02-13
KR960704344A (ko) 1996-08-31
US5377816A (en) 1995-01-03
CA2164971A1 (en) 1995-01-26
JPH09500235A (ja) 1997-01-07
JP3273791B2 (ja) 2002-04-15

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