KR100279184B1 - 글라스 컷팅 디스크 - Google Patents

글라스 컷팅 디스크 Download PDF

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Publication number
KR100279184B1
KR100279184B1 KR1019960006634A KR19960006634A KR100279184B1 KR 100279184 B1 KR100279184 B1 KR 100279184B1 KR 1019960006634 A KR1019960006634 A KR 1019960006634A KR 19960006634 A KR19960006634 A KR 19960006634A KR 100279184 B1 KR100279184 B1 KR 100279184B1
Authority
KR
South Korea
Prior art keywords
cutting disc
glass
peripheral
glass cutting
disc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019960006634A
Other languages
English (en)
Korean (ko)
Other versions
KR970025885A (ko
Inventor
하루오 와카야마
야스히로 치요
Original Assignee
가코 쓰네히로
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17714054&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100279184(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 가코 쓰네히로, 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 가코 쓰네히로
Publication of KR970025885A publication Critical patent/KR970025885A/ko
Application granted granted Critical
Publication of KR100279184B1 publication Critical patent/KR100279184B1/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B23/00—Portable grinding machines, e.g. hand-guided; Accessories therefor
    • B24B23/08—Portable grinding machines designed for fastening on workpieces or other parts of particular section, e.g. for grinding commutators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/02—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of milling cutters
    • B24B3/08—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of milling cutters of profile milling cutters, e.g. of disc type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
    • B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/12—Hand tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0333—Scoring
    • Y10T83/0385—Rotary scoring blade
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9372—Rotatable type
    • Y10T83/9403—Disc type

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1019960006634A 1995-11-06 1996-03-13 글라스 컷팅 디스크 Ceased KR100279184B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-287175 1995-11-06
JP28717595 1995-11-06

Publications (2)

Publication Number Publication Date
KR970025885A KR970025885A (ko) 1997-06-24
KR100279184B1 true KR100279184B1 (ko) 2001-01-15

Family

ID=17714054

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960006634A Ceased KR100279184B1 (ko) 1995-11-06 1996-03-13 글라스 컷팅 디스크

Country Status (6)

Country Link
US (1) US5836229A (https=)
EP (5) EP1666426B1 (https=)
KR (1) KR100279184B1 (https=)
CN (1) CN1125787C (https=)
DE (3) DE69613655T2 (https=)
TW (1) TW308581B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7308846B2 (en) 2003-04-29 2007-12-18 Lg.Philips Lcd Co., Ltd. Apparatus for cutting liquid crystal display panel
KR100812718B1 (ko) * 2004-03-15 2008-03-12 미쓰보시 다이야몬도 고교 가부시키가이샤 기판 절단 시스템, 기판 제조장치, 기판 스크라이브 방법및 기판 절단방법
KR100822322B1 (ko) * 2003-01-29 2008-04-16 미쓰보시 다이야몬도 고교 가부시키가이샤 기판절단장치 및 기판절단방법

Families Citing this family (61)

* Cited by examiner, † Cited by third party
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JP3304828B2 (ja) * 1997-06-10 2002-07-22 株式会社村田製作所 電子部品の製造方法
US6402004B1 (en) * 1998-09-16 2002-06-11 Hoya Corporation Cutting method for plate glass mother material
JP2989602B1 (ja) * 1999-01-28 1999-12-13 三星ダイヤモンド工業株式会社 ガラスカッタホィ―ル
JP4132569B2 (ja) * 2000-05-01 2008-08-13 富士フイルム株式会社 スリッタ刃
JP3370314B2 (ja) 2000-08-04 2003-01-27 三星ダイヤモンド工業株式会社 脆性基板用カッターホイール
US6796212B2 (en) * 2000-08-11 2004-09-28 Mitsuboshi Diamond Industrial Co., Ltd. Scribing method for brittle materials, a cutter wheel used therefor and an apparatus provided therewith
CN100361914C (zh) * 2001-03-16 2008-01-16 三星宝石工业株式会社 割划方法、刀轮、使用该刀轮的割划设备和制造该刀轮的设备
CN100430327C (zh) * 2001-04-02 2008-11-05 三星钻石工业股份有限公司 切刀滚轮及使用该切刀滚轮的刻痕装置、刻痕方法及贴合基板的分断方法、以及制造切刀滚轮的切刀滚轮制造方法和制造装置
USD478104S1 (en) 2001-11-30 2003-08-05 Chang Bong Jung Cutting wheel
USD465503S1 (en) 2001-11-30 2002-11-12 Chang Bong Jung Cutting wheel
USD465502S1 (en) 2001-11-30 2002-11-12 Chang Bong Jung Cutting wheel
USD465231S1 (en) 2001-11-30 2002-11-05 Chang Bong Jung Cutting wheel
US7051911B2 (en) * 2001-12-21 2006-05-30 Eastman Kodak Company Apparatus and method for cutting sheet materials
CN1649799A (zh) * 2002-01-16 2005-08-03 三星钻石工业股份有限公司 脆性材料基板的划刻器、脆性材料基板的处理机械、脆性材料基板的抛光装置以及脆性材料基板的划刻和断开系统
EP1491309B1 (en) * 2002-04-01 2010-02-24 Mitsuboshi Diamond Industrial Co., Ltd. Parting method for fragile material substrate and parting device using the method
US20040123717A1 (en) * 2002-04-02 2004-07-01 Kazuya Maekawa Cutter wheel, device and method using the cutter wheel, method of dividing laminated substrate, and method and device for manufacturing cutter wheel
US20040161279A1 (en) * 2002-09-16 2004-08-19 Tzu-Feng Tseng Apparatus for forming a folding-line
TWI286232B (en) * 2002-10-29 2007-09-01 Mitsuboshi Diamond Ind Co Ltd Method and device for scribing fragile material substrate
CN101596723B (zh) * 2002-11-22 2012-05-30 三星钻石工业股份有限公司 基板分断方法
JP2005001941A (ja) * 2003-06-12 2005-01-06 Thk Co Ltd ダイヤモンドホイール及びスクライブ装置
KR20120068976A (ko) * 2004-02-02 2012-06-27 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료 기판의 스크라이브 방법 및 절단방법
WO2006009113A1 (ja) * 2004-07-16 2006-01-26 Mitsuboshi Diamond Industrial Co., Ltd. カッターホイールとその製造方法、手動スクライブ工具およびスクライブ装置
TWI380868B (zh) * 2005-02-02 2013-01-01 Mitsuboshi Diamond Ind Co Ltdl Fine processing method of sintered diamond using laser, cutter wheel for brittle material substrate, and method of manufacturing the same
TWI393682B (zh) * 2005-07-06 2013-04-21 Mitsuboshi Diamond Ind Co Ltd A scribing method for brittle materials and a method of manufacturing the same, using the scribing method of the scribing wheel and the scribing device, and the scribing tool
US20070056171A1 (en) * 2005-09-12 2007-03-15 Jonathan Taryoto CVD diamond cutter wheel
JP4219945B2 (ja) * 2006-08-10 2009-02-04 トーヨー産業株式会社 ガラス切断用カッターホイル
WO2008087612A1 (en) * 2007-01-19 2008-07-24 Dutch Diamond Technologies B.V. Cutting disk for forming a scribed line
US7837138B2 (en) * 2007-05-03 2010-11-23 Riley Power, Inc. Swing hammer for particulate size reduction system
DE202007013307U1 (de) 2007-09-22 2008-04-24 Bohle Ag Schneidrädchen
DE202007013306U1 (de) * 2007-09-22 2008-04-24 Bohle Ag Schneidrädchen
DE102007045383A1 (de) * 2007-09-22 2008-07-17 Bohle Ag Verfahren zur Herstellung von Schneidrädchen
JP5237370B2 (ja) * 2008-06-05 2013-07-17 三星ダイヤモンド工業株式会社 スクライビングホイール及び脆性材料基板のスクライブ方法
DE102008042855B4 (de) 2008-10-15 2011-08-25 MDI Schott Advanced Processing GmbH, 55120 Verfahren zum Brechen von geschlossenen Freiformkonturen aus sprödbrüchigem Material
WO2010112496A1 (de) 2009-03-30 2010-10-07 Bohle Ag Beschichtetes schneidrad und verfahren zu dessen herstellung
DE102009017316B4 (de) * 2009-04-16 2012-08-02 Bohle Ag Strukturiertes Schneidrad, Verfahren zu dessen Herstellung und Schneidvorrichtung
KR101174876B1 (ko) * 2010-01-19 2012-08-17 삼성디스플레이 주식회사 유리기판용 절단 휠
TWD143880S1 (zh) * 2010-04-28 2011-11-21 三星鑽石工業股份有限公司 圖案化工具
JP4923132B2 (ja) * 2010-05-17 2012-04-25 三星ダイヤモンド工業株式会社 ホイールホルダおよびその製造方法およびホイールホルダを用いたカッターホイール保持機構
DE102010017625A1 (de) 2010-06-28 2011-12-29 Bohle Ag Schneidwerkzeug, insbesondere Schneidrädchen und Verfahren zu dessen Herstellung
JP2012027272A (ja) * 2010-07-23 2012-02-09 Asahi Glass Co Ltd 表示パネルの製造方法、および表示パネル
JP5174112B2 (ja) * 2010-09-28 2013-04-03 三星ダイヤモンド工業株式会社 スクライビングホイール
JP5365602B2 (ja) * 2010-10-08 2013-12-11 三星ダイヤモンド工業株式会社 スクライビングホイール及びその製造方法
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TWI462885B (zh) * 2010-12-13 2014-12-01 Mitsuboshi Diamond Ind Co Ltd Method of breaking the substrate
JP5966564B2 (ja) * 2011-06-08 2016-08-10 三星ダイヤモンド工業株式会社 スクライビングホイール及びスクライブ方法
JP5479424B2 (ja) * 2011-09-30 2014-04-23 三星ダイヤモンド工業株式会社 脆性材料用スクライビングホイール、これを用いた脆性材料基板のスクライブ装置及びスクライブ工具
EP2823944B1 (en) * 2012-03-08 2016-12-21 Mitsuboshi Diamond Industrial Co., Ltd. Scribing wheel and method for manufacturing same
TW201604154A (zh) * 2012-03-28 2016-02-01 Mitsuboshi Diamond Ind Co Ltd 劃線輪、劃線裝置、劃線方法、顯示用面板之製造方法及顯示用面板
CN102749748B (zh) * 2012-07-11 2015-02-11 深圳市华星光电技术有限公司 液晶基板切割装置及其刀头监控方法
CN104507884A (zh) * 2012-07-27 2015-04-08 二和钻石工业股份有限公司 具有精密结构凹槽的划线轮
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JP6056575B2 (ja) * 2013-03-18 2017-01-11 三星ダイヤモンド工業株式会社 スクライブ方法及びスクライブ装置
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JP6488644B2 (ja) * 2014-10-30 2019-03-27 三星ダイヤモンド工業株式会社 厚板ガラスのスクライブ方法、および、厚板ガラススクライブ用のスクライビングホイール
CN106542727B (zh) * 2016-10-10 2019-03-05 华南理工大学 一种微磨削尖端精准诱导的曲面镜面脆裂成型方法
JP6897950B2 (ja) * 2016-12-28 2021-07-07 三星ダイヤモンド工業株式会社 カッターホイール
JP6880447B2 (ja) * 2017-03-28 2021-06-02 トヨタ自動車株式会社 切断装置および回転刃
US20190337175A1 (en) * 2018-05-01 2019-11-07 Pei-Keng Liu Cutting device
US11565371B2 (en) * 2018-12-31 2023-01-31 Micron Technology, Inc. Systems and methods for forming semiconductor cutting/trimming blades
CN112405878B (zh) * 2020-09-30 2022-09-09 青岛铭青机电有限公司 一种陶瓷片产品自动掰板装置
CN117220194B (zh) * 2023-09-21 2025-03-14 山东送变电工程有限公司 一种输电线路施工作业免登塔划印装置

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Cited By (3)

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Publication number Priority date Publication date Assignee Title
KR100822322B1 (ko) * 2003-01-29 2008-04-16 미쓰보시 다이야몬도 고교 가부시키가이샤 기판절단장치 및 기판절단방법
US7308846B2 (en) 2003-04-29 2007-12-18 Lg.Philips Lcd Co., Ltd. Apparatus for cutting liquid crystal display panel
KR100812718B1 (ko) * 2004-03-15 2008-03-12 미쓰보시 다이야몬도 고교 가부시키가이샤 기판 절단 시스템, 기판 제조장치, 기판 스크라이브 방법및 기판 절단방법

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CN1150129A (zh) 1997-05-21
EP2135848B1 (en) 2012-05-16
HK1139920A1 (en) 2010-09-30
EP2133316A3 (en) 2010-02-10
HK1038552A1 (en) 2002-03-22
EP2135848A2 (en) 2009-12-23
EP0773194B1 (en) 2001-07-04
EP0773194A1 (en) 1997-05-14
CN1125787C (zh) 2003-10-29
EP1092686B1 (en) 2006-01-11
DE69613655T2 (de) 2002-05-29
EP1092686A2 (en) 2001-04-18
EP1666426B1 (en) 2011-02-09
KR970025885A (ko) 1997-06-24
US5836229A (en) 1998-11-17
DE69635721T2 (de) 2006-08-31
DE69638332D1 (de) 2011-03-24
DE69635721D1 (de) 2006-04-06
EP2135848A3 (en) 2010-02-17
TW308581B (https=) 1997-06-21
EP1666426A1 (en) 2006-06-07
EP2133316A2 (en) 2009-12-16
DE69613655D1 (de) 2001-08-09
EP1092686A3 (en) 2001-05-16

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