KR100263810B1 - 반도체 웨이퍼의 프로빙방법 - Google Patents

반도체 웨이퍼의 프로빙방법 Download PDF

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Publication number
KR100263810B1
KR100263810B1 KR1019940037325A KR19940037325A KR100263810B1 KR 100263810 B1 KR100263810 B1 KR 100263810B1 KR 1019940037325 A KR1019940037325 A KR 1019940037325A KR 19940037325 A KR19940037325 A KR 19940037325A KR 100263810 B1 KR100263810 B1 KR 100263810B1
Authority
KR
South Korea
Prior art keywords
index
semiconductor wafer
chips
card
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019940037325A
Other languages
English (en)
Korean (ko)
Other versions
KR950021329A (ko
Inventor
준이치로 시바타
Original Assignee
히가시 데쓰로
동경 엘렉트론주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히가시 데쓰로, 동경 엘렉트론주식회사 filed Critical 히가시 데쓰로
Publication of KR950021329A publication Critical patent/KR950021329A/ko
Application granted granted Critical
Publication of KR100263810B1 publication Critical patent/KR100263810B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1019940037325A 1993-12-27 1994-12-27 반도체 웨이퍼의 프로빙방법 Expired - Fee Related KR100263810B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP35334093 1993-12-27
JP93-353340 1993-12-27

Publications (2)

Publication Number Publication Date
KR950021329A KR950021329A (ko) 1995-07-26
KR100263810B1 true KR100263810B1 (ko) 2000-09-01

Family

ID=18430189

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940037325A Expired - Fee Related KR100263810B1 (ko) 1993-12-27 1994-12-27 반도체 웨이퍼의 프로빙방법

Country Status (3)

Country Link
US (1) US5585737A (cg-RX-API-DMAC7.html)
KR (1) KR100263810B1 (cg-RX-API-DMAC7.html)
TW (1) TW283258B (cg-RX-API-DMAC7.html)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5829128A (en) 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
JP3364390B2 (ja) * 1995-12-30 2003-01-08 東京エレクトロン株式会社 検査装置
KR100192216B1 (ko) * 1996-02-29 1999-06-15 황인길 웨이퍼 맵 변환방법
JP3361434B2 (ja) 1996-09-20 2003-01-07 東京エレクトロン株式会社 最適プロ−ビングモ−ド設定方法
TW442880B (en) * 2000-02-02 2001-06-23 Promos Technologies Inc Method for automatically classifying the wafer with failure mode
US6440757B1 (en) 2001-08-29 2002-08-27 Taiwan Semiconductor Manufacturing Co., Ltd Microelectronic fabrication die electrical probe apparatus electrical test method providing enhanced microelectronic fabrication die electrical test accuracy and efficiency
US6714828B2 (en) * 2001-09-17 2004-03-30 Formfactor, Inc. Method and system for designing a probe card
US6639418B2 (en) 2001-11-21 2003-10-28 Taiwan Semiconductor Manufacturing Co., Ltd. Microelectronic fabrication die electrical probe apparatus electrical test method providing enhanced microelectronic fabrication die electrical test accuracy and efficiency
US6787375B2 (en) 2002-05-13 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd Microelectronic fabrication die electrical test method providing enhanced microelectronic fabrication die electrical test efficiency
JP4356915B2 (ja) * 2002-07-22 2009-11-04 東京エレクトロン株式会社 プローブ装置及びプローブカードのチャンネル情報作成プログラム並びにプローブカードのチャンネル情報作成装置
US7649366B2 (en) 2006-09-01 2010-01-19 Formfactor, Inc. Method and apparatus for switching tester resources
US7852094B2 (en) * 2006-12-06 2010-12-14 Formfactor, Inc. Sharing resources in a system for testing semiconductor devices
KR100850274B1 (ko) * 2007-01-04 2008-08-04 삼성전자주식회사 반도체 칩 테스트를 위한 프로브 카드 및 이를 이용한반도체 칩 테스트 방법
US10325361B2 (en) * 2016-06-01 2019-06-18 Kla-Tencor Corporation System, method and computer program product for automatically generating a wafer image to design coordinate mapping
CN120370140B (zh) * 2025-05-28 2025-11-14 东莞市台易电子科技有限公司 晶圆探针台检测路径规划方法、装置、设备和探针台

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5661136A (en) * 1979-10-25 1981-05-26 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor test equipment
US4985676A (en) * 1989-02-17 1991-01-15 Tokyo Electron Limited Method and apparatus of performing probing test for electrically and sequentially testing semiconductor device patterns
US5336992A (en) * 1992-06-03 1994-08-09 Trw Inc. On-wafer integrated circuit electrical testing

Also Published As

Publication number Publication date
TW283258B (cg-RX-API-DMAC7.html) 1996-08-11
KR950021329A (ko) 1995-07-26
US5585737A (en) 1996-12-17

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