TW283258B - - Google Patents

Info

Publication number
TW283258B
TW283258B TW083112180A TW83112180A TW283258B TW 283258 B TW283258 B TW 283258B TW 083112180 A TW083112180 A TW 083112180A TW 83112180 A TW83112180 A TW 83112180A TW 283258 B TW283258 B TW 283258B
Authority
TW
Taiwan
Application number
TW083112180A
Original Assignee
Tokyo Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Co Ltd filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW283258B publication Critical patent/TW283258B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW083112180A 1993-12-27 1994-12-24 TW283258B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35334093 1993-12-27

Publications (1)

Publication Number Publication Date
TW283258B true TW283258B (zh) 1996-08-11

Family

ID=18430189

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083112180A TW283258B (zh) 1993-12-27 1994-12-24

Country Status (3)

Country Link
US (1) US5585737A (zh)
KR (1) KR100263810B1 (zh)
TW (1) TW283258B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5829128A (en) 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
JP3364390B2 (ja) * 1995-12-30 2003-01-08 東京エレクトロン株式会社 検査装置
KR100192216B1 (ko) * 1996-02-29 1999-06-15 황인길 웨이퍼 맵 변환방법
JP3361434B2 (ja) 1996-09-20 2003-01-07 東京エレクトロン株式会社 最適プロ−ビングモ−ド設定方法
TW442880B (en) * 2000-02-02 2001-06-23 Promos Technologies Inc Method for automatically classifying the wafer with failure mode
US6440757B1 (en) 2001-08-29 2002-08-27 Taiwan Semiconductor Manufacturing Co., Ltd Microelectronic fabrication die electrical probe apparatus electrical test method providing enhanced microelectronic fabrication die electrical test accuracy and efficiency
US6714828B2 (en) * 2001-09-17 2004-03-30 Formfactor, Inc. Method and system for designing a probe card
US6639418B2 (en) 2001-11-21 2003-10-28 Taiwan Semiconductor Manufacturing Co., Ltd. Microelectronic fabrication die electrical probe apparatus electrical test method providing enhanced microelectronic fabrication die electrical test accuracy and efficiency
US6787375B2 (en) 2002-05-13 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd Microelectronic fabrication die electrical test method providing enhanced microelectronic fabrication die electrical test efficiency
JP4356915B2 (ja) * 2002-07-22 2009-11-04 東京エレクトロン株式会社 プローブ装置及びプローブカードのチャンネル情報作成プログラム並びにプローブカードのチャンネル情報作成装置
US7649366B2 (en) 2006-09-01 2010-01-19 Formfactor, Inc. Method and apparatus for switching tester resources
US7852094B2 (en) * 2006-12-06 2010-12-14 Formfactor, Inc. Sharing resources in a system for testing semiconductor devices
KR100850274B1 (ko) * 2007-01-04 2008-08-04 삼성전자주식회사 반도체 칩 테스트를 위한 프로브 카드 및 이를 이용한반도체 칩 테스트 방법
US10325361B2 (en) * 2016-06-01 2019-06-18 Kla-Tencor Corporation System, method and computer program product for automatically generating a wafer image to design coordinate mapping

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5661136A (en) * 1979-10-25 1981-05-26 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor test equipment
US4985676A (en) * 1989-02-17 1991-01-15 Tokyo Electron Limited Method and apparatus of performing probing test for electrically and sequentially testing semiconductor device patterns
US5336992A (en) * 1992-06-03 1994-08-09 Trw Inc. On-wafer integrated circuit electrical testing

Also Published As

Publication number Publication date
KR100263810B1 (ko) 2000-09-01
US5585737A (en) 1996-12-17
KR950021329A (ko) 1995-07-26

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent