KR100255251B1 - 유기기판 상에 전자부품을 접속하기 위해 사용된 무연땜납 및 그것을 사용해서 제조한 전자제품 - Google Patents

유기기판 상에 전자부품을 접속하기 위해 사용된 무연땜납 및 그것을 사용해서 제조한 전자제품 Download PDF

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Publication number
KR100255251B1
KR100255251B1 KR1019950034598A KR19950034598A KR100255251B1 KR 100255251 B1 KR100255251 B1 KR 100255251B1 KR 1019950034598 A KR1019950034598 A KR 1019950034598A KR 19950034598 A KR19950034598 A KR 19950034598A KR 100255251 B1 KR100255251 B1 KR 100255251B1
Authority
KR
South Korea
Prior art keywords
solder
temperature
lead
free solder
content
Prior art date
Application number
KR1019950034598A
Other languages
English (en)
Korean (ko)
Other versions
KR960016660A (ko
Inventor
데쯔야 나가쯔까
다사오 소가
하나에 시모까와
겐이찌 야마모또
마사히데 하라다
유지 오찌아이
쯔네아끼 가메이
Original Assignee
가나이 쓰도무
가부시키가이샤 히다치 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가나이 쓰도무, 가부시키가이샤 히다치 세이사꾸쇼 filed Critical 가나이 쓰도무
Publication of KR960016660A publication Critical patent/KR960016660A/ko
Application granted granted Critical
Publication of KR100255251B1 publication Critical patent/KR100255251B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/903—Metal to nonmetal

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1019950034598A 1994-10-11 1995-10-10 유기기판 상에 전자부품을 접속하기 위해 사용된 무연땜납 및 그것을 사용해서 제조한 전자제품 KR100255251B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP94-245048 1994-10-11
JP24504894 1994-10-11
JP20305495A JP3232963B2 (ja) 1994-10-11 1995-08-09 有機基板接続用鉛レスはんだ及びそれを用いた実装品
JP95-203054 1995-08-09

Publications (2)

Publication Number Publication Date
KR960016660A KR960016660A (ko) 1996-05-22
KR100255251B1 true KR100255251B1 (ko) 2000-05-01

Family

ID=26513720

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950034598A KR100255251B1 (ko) 1994-10-11 1995-10-10 유기기판 상에 전자부품을 접속하기 위해 사용된 무연땜납 및 그것을 사용해서 제조한 전자제품

Country Status (5)

Country Link
US (1) US5942185A (zh)
JP (1) JP3232963B2 (zh)
KR (1) KR100255251B1 (zh)
CN (1) CN1067929C (zh)
TW (1) TW360578B (zh)

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KR20190000346A (ko) * 2015-10-25 2019-01-02 아토비무 가부시키가이샤 초음파 납땜방법 및 초음파 납땜장치

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JP3688429B2 (ja) * 1997-04-25 2005-08-31 株式会社東芝 電子部品実装用基板および電子部品実装基板
JP3311282B2 (ja) * 1997-10-13 2002-08-05 株式会社東芝 金属部材の接合方法及び接合体
JP3622462B2 (ja) 1997-12-16 2005-02-23 株式会社日立製作所 半導体装置
US20020009610A1 (en) * 1997-12-16 2002-01-24 Hanae Shimokawa Technical field
US6204490B1 (en) 1998-06-04 2001-03-20 Hitachi, Ltd. Method and apparatus of manufacturing an electronic circuit board
CN1187138C (zh) * 1999-01-11 2005-02-02 松下电器产业株式会社 焊接有部件的电路制品的废物再利用方法
US6294766B1 (en) * 1999-07-31 2001-09-25 Microsemi Corporation Battery cell bypass with pre-loaded compression action
JP2001183687A (ja) * 1999-12-22 2001-07-06 Hitachi Ltd 液晶表示装置
WO2001065167A1 (en) * 2000-03-02 2001-09-07 Pearl Technology Holdings, Llc Inflatable structure for supporting an article of manufacture
US6503338B1 (en) * 2000-04-28 2003-01-07 Senju Metal Industry Co., Ltd. Lead-free solder alloys
US6429388B1 (en) 2000-05-03 2002-08-06 International Business Machines Corporation High density column grid array connections and method thereof
KR100398716B1 (ko) * 2000-06-12 2003-09-19 가부시키가이샤 히타치세이사쿠쇼 반도체 모듈 및 반도체 장치를 접속한 회로 기판
JPWO2002005609A1 (ja) * 2000-07-12 2004-03-18 ローム株式会社 導体間の接続構造及び接続方法
US6680128B2 (en) * 2001-09-27 2004-01-20 Agilent Technologies, Inc. Method of making lead-free solder and solder paste with improved wetting and shelf life
JP2003338682A (ja) * 2002-01-11 2003-11-28 Nec Infrontia Corp はんだ付け方法及びはんだ接合体
JP4042418B2 (ja) * 2002-01-30 2008-02-06 昭和電工株式会社 ハンダ付けフラックス
SG107581A1 (en) 2002-03-26 2004-12-29 Inst Of High Performance Compu Lead free tin based solder composition
JP3878978B2 (ja) * 2002-10-24 2007-02-07 コーア株式会社 鉛非含有はんだ、および鉛非含有の継手
JP2005026188A (ja) * 2003-07-03 2005-01-27 Koa Corp 電流ヒューズ及び電流ヒューズの製造方法
US20060226199A1 (en) * 2005-03-30 2006-10-12 Visteon Global Technologies, Inc. Selective soldering of flat flexible cable with lead-free solder to a substrate
CN100413634C (zh) * 2005-12-12 2008-08-27 黄德欢 一种低熔点无铅焊锡
CN100453246C (zh) * 2006-07-13 2009-01-21 昆山成利焊锡制造有限公司 无铅软钎焊料
JP2011194410A (ja) * 2010-03-17 2011-10-06 Sumitomo Metal Mining Co Ltd コーティングされたＰｂフリーＢｉ系はんだ合金およびその製造方法
JP2011058003A (ja) * 2010-11-24 2011-03-24 Mitsubishi Chemicals Corp 半導体封止用エポキシ樹脂組成物、樹脂封止型半導体装置及び半導体装置の実装方法
KR101545798B1 (ko) 2011-03-02 2015-08-19 샌트랄 글래스 컴퍼니 리미티드 차량 유리용 무연 땜납 합금
JP5947238B2 (ja) 2013-03-25 2016-07-06 株式会社日立製作所 ペースト、アルミニウム電線体、アルミニウム電線体の製造方法、モータ及びモータの製造方法
CN106975860A (zh) * 2017-03-22 2017-07-25 合肥仁德电子科技有限公司 一种电路板用锡膏及其制备方法

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JPS515479B2 (zh) * 1971-09-27 1976-02-20
JPS5711793A (en) * 1980-06-26 1982-01-21 Dainichi Nippon Cables Ltd Solder for aluminium
JPS59189096A (ja) * 1983-04-08 1984-10-26 Senjiyu Kinzoku Kogyo Kk 半田合金
JPS6235876A (ja) * 1985-08-09 1987-02-16 Tomoegawa Paper Co Ltd 光定着型感熱記録媒体
JPH01313198A (ja) * 1988-06-10 1989-12-18 Mitsubishi Steel Mfg Co Ltd 低融点低銀ろう材
JP3183878B2 (ja) * 1989-10-13 2001-07-09 大豊工業株式会社 はんだ付方法
JP3346848B2 (ja) * 1993-08-11 2002-11-18 株式会社日本スペリア社 無鉛はんだ合金
JP4066294B2 (ja) * 1999-11-19 2008-03-26 ボッシュ株式会社 マスタシリンダ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190000346A (ko) * 2015-10-25 2019-01-02 아토비무 가부시키가이샤 초음파 납땜방법 및 초음파 납땜장치
KR102002796B1 (ko) * 2015-10-25 2019-07-23 아토비무 가부시키가이샤 초음파 납땜방법 및 초음파 납땜장치

Also Published As

Publication number Publication date
KR960016660A (ko) 1996-05-22
JP3232963B2 (ja) 2001-11-26
CN1067929C (zh) 2001-07-04
TW360578B (en) 1999-06-11
CN1132673A (zh) 1996-10-09
JPH08164495A (ja) 1996-06-25
US5942185A (en) 1999-08-24

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