KR100242219B1 - 금속층 기판 위에 광 영상성 박피복물을 제조하는 방법 및 장치 - Google Patents

금속층 기판 위에 광 영상성 박피복물을 제조하는 방법 및 장치 Download PDF

Info

Publication number
KR100242219B1
KR100242219B1 KR1019920006173A KR920006173A KR100242219B1 KR 100242219 B1 KR100242219 B1 KR 100242219B1 KR 1019920006173 A KR1019920006173 A KR 1019920006173A KR 920006173 A KR920006173 A KR 920006173A KR 100242219 B1 KR100242219 B1 KR 100242219B1
Authority
KR
South Korea
Prior art keywords
substrate
coating
curtain
plate
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019920006173A
Other languages
English (en)
Korean (ko)
Other versions
KR920020263A (ko
Inventor
카프-슈보에러 디트하르트
씨.시머즈 데이비드
엘.이손후드 제임스
이.밀러 도날드
Original Assignee
에프. 아. 프라저
시바 스페셜티 케미칼스 홀딩 인크.
에른스트 알테르 (에. 알테르)
한스 페터 비틀린 (하. 페. 비틀린)
피. 랍 보프
브이. 스펜글러
페. 아에글러
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에프. 아. 프라저, 시바 스페셜티 케미칼스 홀딩 인크., 에른스트 알테르 (에. 알테르), 한스 페터 비틀린 (하. 페. 비틀린), 피. 랍 보프, 브이. 스펜글러, 페. 아에글러 filed Critical 에프. 아. 프라저
Publication of KR920020263A publication Critical patent/KR920020263A/ko
Application granted granted Critical
Publication of KR100242219B1 publication Critical patent/KR100242219B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/002—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles
    • B05C5/004—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles the work consisting of separate rectangular flat articles, e.g. flat sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/005—Curtain coaters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Coating Apparatus (AREA)
KR1019920006173A 1991-04-15 1992-04-14 금속층 기판 위에 광 영상성 박피복물을 제조하는 방법 및 장치 Expired - Fee Related KR100242219B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US68536891A 1991-04-15 1991-04-15
US7/685368 1991-04-15
US07/685368 1991-04-15

Publications (2)

Publication Number Publication Date
KR920020263A KR920020263A (ko) 1992-11-20
KR100242219B1 true KR100242219B1 (ko) 2000-03-02

Family

ID=24751902

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920006173A Expired - Fee Related KR100242219B1 (ko) 1991-04-15 1992-04-14 금속층 기판 위에 광 영상성 박피복물을 제조하는 방법 및 장치

Country Status (7)

Country Link
EP (1) EP0509962A1 (enExample)
JP (1) JP3326531B2 (enExample)
KR (1) KR100242219B1 (enExample)
CA (1) CA2065897C (enExample)
FR (1) FR2676127A1 (enExample)
GB (1) GB2256159A (enExample)
TW (1) TW232119B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101176707B1 (ko) 2008-03-04 2012-08-23 도쿄엘렉트론가부시키가이샤 약액의 도포 고화 장치, 약액의 도포 고화 방법 및 기억 매체

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19821237C1 (de) * 1998-05-12 2000-03-02 Fraunhofer Ges Forschung Verfahren und Vorrichtung zur Trocknung von Photoresistschichten
JP2000345105A (ja) * 1999-06-07 2000-12-12 Nippon Steel Corp カーテン安定性に優れるカーテンコーター用塗料及びカーテンコーターによる塗装製品の製造方法
JP2000345108A (ja) * 1999-06-07 2000-12-12 Nippon Steel Corp カーテン安定性に優れるカーテンコーター用塗料及びカーテンコーターによる塗装製品の製造方法
DE102004057293A1 (de) * 2004-11-26 2006-06-01 Basf Drucksysteme Gmbh Verfahren zur Herstellung von Flexodruckformen sowie dazu geeignetes Flexodruckelement
CN106000764B (zh) * 2016-06-30 2018-09-21 东莞市金隆机械设备有限公司 一种淋幕式涂装设备
CN111890659B (zh) * 2020-08-06 2021-12-03 海盐县安巨机械制造有限公司 一种墙板生产用冷却设备
CN114200777B (zh) * 2021-12-21 2023-06-13 中国科学院光电技术研究所 一种方形基片夹持装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0002040B1 (de) * 1977-11-21 1981-12-30 Ciba-Geigy Ag Verfahren zur Herstellung von Lötstoppmasken auf gedruckten Schaltungen mit Druckkontaktierungsbohrungen
JPS5948925A (ja) * 1982-09-14 1984-03-21 Dainippon Screen Mfg Co Ltd 加熱乾燥した薬液塗布用基板の冷却方法及び装置
US4559896A (en) * 1983-09-15 1985-12-24 Ciba Geigy Corporation Coating apparatus
US4879968A (en) * 1987-03-03 1989-11-14 Ciba-Geigy Corporation Separating device for trimming the width of a poured curtain of coating material
US4938994A (en) * 1987-11-23 1990-07-03 Epicor Technology, Inc. Method and apparatus for patch coating printed circuit boards
JPH01276632A (ja) * 1988-04-27 1989-11-07 Matsushita Electron Corp レジストパターン形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101176707B1 (ko) 2008-03-04 2012-08-23 도쿄엘렉트론가부시키가이샤 약액의 도포 고화 장치, 약액의 도포 고화 방법 및 기억 매체

Also Published As

Publication number Publication date
TW232119B (enExample) 1994-10-11
JPH05197156A (ja) 1993-08-06
JP3326531B2 (ja) 2002-09-24
FR2676127A1 (fr) 1992-11-06
GB9207852D0 (en) 1992-05-27
EP0509962A1 (en) 1992-10-21
CA2065897A1 (en) 1992-10-16
GB2256159A (en) 1992-12-02
CA2065897C (en) 2002-10-01
KR920020263A (ko) 1992-11-20

Similar Documents

Publication Publication Date Title
US4436806A (en) Method and apparatus for making printed circuit boards
US3526504A (en) Photocrosslinkable elements and processes
JPH0157516B2 (enExample)
KR100242219B1 (ko) 금속층 기판 위에 광 영상성 박피복물을 제조하는 방법 및 장치
EP0141868A1 (en) High resolution phototransparency image forming with photopolymers
US4544626A (en) Photoprinting process and apparatus for exposing photopolymers
EP0539714B1 (en) Amphoteric compositions
US5236746A (en) Curtain coating process for producing thin photoimageable coatings
US5112440A (en) Method for making metallic patterns
JPS592049A (ja) シ−ト基材の整合および露光方法
CA1158091A (en) Method and apparatus for making printed circuit boards using a photo tool and non-coherent collimated light
JPH05165215A (ja) 光学的潜像形成可能なはんだマスク及び感光組成物
CN208188581U (zh) 抗蚀剂层的薄膜化装置
JP2549967B2 (ja) コーティング方法及び装置
EP0469973A1 (en) Method for forming relief patterns
US4560639A (en) Reusable phototransparency image forming tools for direct contact printing
JP2000156556A (ja) スルーホール部を有する基板へのレジスト層形成方法及びプリント配線基板の製造方法
JPH0836266A (ja) 厚膜レジストパターンの製造法及びその製造法により製造された厚膜レジストパターン
KR20000058361A (ko) 레이저와 레이저마스크에 의한 회로기판의 회로 형성방법
KR200492371Y1 (ko) 레지스트층의 박막화 장치
Shemilt Photosensitive Resist Printing
JPS60236284A (ja) 印刷配線板の製造方法
JPH0738236A (ja) プリント配線板の製造方法
JPS59200490A (ja) 配線基板の製造方法
JPS58191490A (ja) レジストパタ−ン形成方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20021021

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20031110

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20031110

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000