KR100228565B1 - 반도체 장치의 제조방법 - Google Patents

반도체 장치의 제조방법 Download PDF

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Publication number
KR100228565B1
KR100228565B1 KR1019950052831A KR19950052831A KR100228565B1 KR 100228565 B1 KR100228565 B1 KR 100228565B1 KR 1019950052831 A KR1019950052831 A KR 1019950052831A KR 19950052831 A KR19950052831 A KR 19950052831A KR 100228565 B1 KR100228565 B1 KR 100228565B1
Authority
KR
South Korea
Prior art keywords
layer
interlayer insulating
insulating film
opening
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019950052831A
Other languages
English (en)
Korean (ko)
Inventor
아끼라 마쯔모또
Original Assignee
가네꼬 히사시
닛본덴끼 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가네꼬 히사시, 닛본덴끼 가부시키가이샤 filed Critical 가네꼬 히사시
Application granted granted Critical
Publication of KR100228565B1 publication Critical patent/KR100228565B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/054—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers by selectively removing parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H10W20/083—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts the openings being via holes penetrating underlying conductors

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1019950052831A 1994-12-20 1995-12-20 반도체 장치의 제조방법 Expired - Fee Related KR100228565B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-316188 1994-12-20
JP6316188A JP2758841B2 (ja) 1994-12-20 1994-12-20 半導体装置の製造方法

Publications (1)

Publication Number Publication Date
KR100228565B1 true KR100228565B1 (ko) 1999-11-01

Family

ID=18074282

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950052831A Expired - Fee Related KR100228565B1 (ko) 1994-12-20 1995-12-20 반도체 장치의 제조방법

Country Status (5)

Country Link
US (1) US5893749A (enExample)
JP (1) JP2758841B2 (enExample)
KR (1) KR100228565B1 (enExample)
CN (1) CN1071490C (enExample)
TW (1) TW307021B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10172969A (ja) * 1996-12-06 1998-06-26 Nec Corp 半導体装置の製造方法
TW398065B (en) * 1997-07-16 2000-07-11 United Microelectronics Corp The manufacturing method of the integrated circuit metal wiring
TW362261B (en) * 1997-12-13 1999-06-21 United Microelectronics Corp Manufacturing method of contact plugs
US6319822B1 (en) * 1998-10-01 2001-11-20 Taiwan Semiconductor Manufacturing Company Process for forming an integrated contact or via
US6146991A (en) * 1999-09-03 2000-11-14 Taiwan Semiconductor Manufacturing Company Barrier metal composite layer featuring a thin plasma vapor deposited titanium nitride capping layer
CN100369329C (zh) * 2003-03-31 2008-02-13 住友电气工业株式会社 各向异性导电膜及其制造方法
US6989105B2 (en) * 2003-06-27 2006-01-24 International Business Machines Corporation Detection of hardmask removal using a selective etch
US7091085B2 (en) * 2003-11-14 2006-08-15 Micron Technology, Inc. Reduced cell-to-cell shorting for memory arrays
CN100395451C (zh) * 2006-07-27 2008-06-18 安东石油技术（集团）有限公司 抽油泵柱塞的制造方法
CN112992826B (zh) * 2021-02-01 2025-10-03 日月光半导体制造股份有限公司 半导体结构及其制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4960732A (en) * 1987-02-19 1990-10-02 Advanced Micro Devices, Inc. Contact plug and interconnect employing a barrier lining and a backfilled conductor material
US4822753A (en) * 1988-05-09 1989-04-18 Motorola, Inc. Method for making a w/tin contact
US5167760A (en) * 1989-11-14 1992-12-01 Intel Corporation Etchback process for tungsten contact/via filling
US5225372A (en) * 1990-12-24 1993-07-06 Motorola, Inc. Method of making a semiconductor device having an improved metallization structure
JPH04293233A (ja) * 1991-03-22 1992-10-16 Sony Corp メタルプラグの形成方法
JP3116432B2 (ja) * 1991-06-28 2000-12-11 ソニー株式会社 半導体装置の製造方法
JPH0530426A (ja) * 1991-07-25 1993-02-05 Matsushita Electric Ind Co Ltd 文字表示装置
JP2655213B2 (ja) * 1991-10-14 1997-09-17 三菱電機株式会社 半導体装置の配線接続構造およびその製造方法
JPH05166944A (ja) * 1991-12-19 1993-07-02 Sony Corp 半導体装置の配線形成方法

Also Published As

Publication number Publication date
CN1135094A (zh) 1996-11-06
TW307021B (enExample) 1997-06-01
CN1071490C (zh) 2001-09-19
JPH08172058A (ja) 1996-07-02
US5893749A (en) 1999-04-13
JP2758841B2 (ja) 1998-05-28

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