KR100203997B1 - 땜납석출용 조성물 및 이조성물을 사용한 장착법 - Google Patents

땜납석출용 조성물 및 이조성물을 사용한 장착법 Download PDF

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Publication number
KR100203997B1
KR100203997B1 KR1019950703219A KR19950703219A KR100203997B1 KR 100203997 B1 KR100203997 B1 KR 100203997B1 KR 1019950703219 A KR1019950703219 A KR 1019950703219A KR 19950703219 A KR19950703219 A KR 19950703219A KR 100203997 B1 KR100203997 B1 KR 100203997B1
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KR
South Korea
Prior art keywords
solder
composition
precipitation
alloy powder
organic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019950703219A
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English (en)
Korean (ko)
Other versions
KR960700860A (ko
Inventor
후쿠나가타카오
하가사카주히토
시로이시히로카즈
쿠마모토세이시
후지와라타카히로
카타야마노리코
Original Assignee
하세가와 요시히로
하리마카세이 카부시키가이샤
후루가와 쥰노스께
후루카와 덴기 코교 카부시키가이샤
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Publication of KR960700860A publication Critical patent/KR960700860A/ko
Application granted granted Critical
Publication of KR100203997B1 publication Critical patent/KR100203997B1/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1019950703219A 1993-12-06 1994-12-06 땜납석출용 조성물 및 이조성물을 사용한 장착법 Expired - Lifetime KR100203997B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP34002493 1993-12-06
JP93-340024 1993-12-06
PCT/JP1994/002047 WO1995015834A1 (en) 1993-12-06 1994-12-06 Solder depositing composition and method of packaging using the same

Publications (2)

Publication Number Publication Date
KR960700860A KR960700860A (ko) 1996-02-24
KR100203997B1 true KR100203997B1 (ko) 1999-06-15

Family

ID=18333020

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950703219A Expired - Lifetime KR100203997B1 (ko) 1993-12-06 1994-12-06 땜납석출용 조성물 및 이조성물을 사용한 장착법

Country Status (5)

Country Link
US (1) US5601228A (enExample)
EP (1) EP0683008A4 (enExample)
KR (1) KR100203997B1 (enExample)
TW (1) TW259737B (enExample)
WO (1) WO1995015834A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6752309B1 (en) * 1999-07-22 2004-06-22 Oatey Co. Water soluble fluxes and methods of using the same
JP4684439B2 (ja) * 2001-03-06 2011-05-18 富士通株式会社 伝導性粒子、伝導性組成物および、電子機器の製造方法
JP4142312B2 (ja) * 2002-02-28 2008-09-03 ハリマ化成株式会社 析出型はんだ組成物及びはんだ析出方法
WO2004034427A2 (en) 2002-10-08 2004-04-22 Honeywell International Inc. Semiconductor packages, lead-containing solders and anodes and methods of removing alpha-emitters from materials
EP1795293A4 (en) * 2004-09-30 2011-02-23 Tamura Seisakusho Kk BRAZING COMPOSITION AND BRAZING LAYER FORMATION METHOD USING THE SAME
US7802452B2 (en) 2005-12-21 2010-09-28 Johns Manville Processes for making inorganic fibers
US7581948B2 (en) * 2005-12-21 2009-09-01 Johns Manville Burner apparatus and methods for making inorganic fibers

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0747233B2 (ja) * 1987-09-14 1995-05-24 古河電気工業株式会社 半田析出用組成物および半田析出方法
JPH0256197A (ja) * 1987-10-27 1990-02-26 Sanyo Electric Co Ltd 車載用ビデオカメラ付スピーカ装置
US4896817A (en) * 1988-10-17 1990-01-30 International Business Machines Corp. Flux composition and method of decreasing tin content in lead/tin solder joints
JPH0671134B2 (ja) * 1989-05-26 1994-09-07 古河電気工業株式会社 電子部品表面実装方法
US5118029A (en) * 1989-11-30 1992-06-02 The Furukawa Electric Co., Ltd. Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board
JP2530043B2 (ja) * 1990-03-30 1996-09-04 株式会社テック ラベルプリンタ
US5296649A (en) * 1991-03-26 1994-03-22 The Furukawa Electric Co., Ltd. Solder-coated printed circuit board and method of manufacturing the same
JP2987227B2 (ja) * 1991-03-27 1999-12-06 ハリマ化成株式会社 低融点ハンダ析出用組成物及び低融点ハンダプリコート回路基板の製造方法
KR940023325A (ko) * 1993-03-11 1994-10-22 토모마쯔 켕고 땜납층을 프리코팅해서 사용되는 회로기판 및 땜납층이 프리코팅된 회로기판

Also Published As

Publication number Publication date
KR960700860A (ko) 1996-02-24
US5601228A (en) 1997-02-11
TW259737B (enExample) 1995-10-11
EP0683008A1 (en) 1995-11-22
EP0683008A4 (en) 1997-10-08
WO1995015834A1 (en) 1995-06-15

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