KR100197321B1 - 스텐실 인쇄용 시이트의 제조방법 - Google Patents
스텐실 인쇄용 시이트의 제조방법 Download PDFInfo
- Publication number
- KR100197321B1 KR100197321B1 KR1019940022675A KR19940022675A KR100197321B1 KR 100197321 B1 KR100197321 B1 KR 100197321B1 KR 1019940022675 A KR1019940022675 A KR 1019940022675A KR 19940022675 A KR19940022675 A KR 19940022675A KR 100197321 B1 KR100197321 B1 KR 100197321B1
- Authority
- KR
- South Korea
- Prior art keywords
- resin film
- solvent
- stencil printing
- printing sheet
- soluble resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/14—Forme preparation for stencil-printing or silk-screen printing
- B41C1/147—Forme preparation for stencil-printing or silk-screen printing by imagewise deposition of a liquid, e.g. from an ink jet; Chemical perforation by the hardening or solubilizing of the ink impervious coating or sheet
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Printing Plates And Materials Therefor (AREA)
- Laminated Bodies (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP93-224724 | 1993-09-09 | ||
| JP22472493A JP3466237B2 (ja) | 1993-09-09 | 1993-09-09 | 溶剤穿孔性孔版印刷用原紙の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR950008125A KR950008125A (ko) | 1995-04-17 |
| KR100197321B1 true KR100197321B1 (ko) | 1999-06-15 |
Family
ID=16818257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019940022675A Expired - Fee Related KR100197321B1 (ko) | 1993-09-09 | 1994-09-09 | 스텐실 인쇄용 시이트의 제조방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5709146A (cg-RX-API-DMAC7.html) |
| EP (2) | EP0642930B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP3466237B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR100197321B1 (cg-RX-API-DMAC7.html) |
| AU (1) | AU683283B2 (cg-RX-API-DMAC7.html) |
| DE (2) | DE69422063T2 (cg-RX-API-DMAC7.html) |
| TW (1) | TW254892B (cg-RX-API-DMAC7.html) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07108780A (ja) * | 1993-10-14 | 1995-04-25 | Riso Kagaku Corp | 孔版印刷用原紙およびその穿孔方法 |
| JPH07237367A (ja) * | 1994-02-28 | 1995-09-12 | Riso Kagaku Corp | 孔版印刷用原紙および製版方法 |
| JPH0872215A (ja) * | 1994-09-09 | 1996-03-19 | Riso Kagaku Corp | 製版印刷装置 |
| GB2306689B (en) * | 1995-10-30 | 2000-02-09 | Ricoh Kk | Heat-sensitive stencil and method of fabricating same |
| GB2327129B (en) * | 1997-07-10 | 2000-11-08 | Ricoh Kk | Heat-sensitive stencil,process of fabricating same and method of producing printing master using same |
| JP3632056B2 (ja) * | 1997-07-10 | 2005-03-23 | 株式会社リコー | 感熱孔版印刷用マスタ及びその製版方法 |
| JPH11235885A (ja) * | 1997-12-04 | 1999-08-31 | Ricoh Co Ltd | 感熱孔版印刷用マスター及びその製造方法 |
| US5992315A (en) * | 1998-02-25 | 1999-11-30 | Ncr Corporation | Thermal stencil master sheet with epoxy/coreactant adhesive and method for producing the same |
| US6889605B1 (en) | 1999-10-08 | 2005-05-10 | Ricoh Company, Ltd. | Heat-sensitive stencil, process of fabricating same and printer using same |
| US6696644B1 (en) * | 2002-08-08 | 2004-02-24 | Texas Instruments Incorporated | Polymer-embedded solder bumps for reliable plastic package attachment |
| JP4410714B2 (ja) | 2004-08-13 | 2010-02-03 | 富士フイルム株式会社 | 平版印刷版用支持体の製造方法 |
| EP1712368B1 (en) | 2005-04-13 | 2008-05-14 | FUJIFILM Corporation | Method of manufacturing a support for a lithographic printing plate |
| US8557758B2 (en) | 2005-06-07 | 2013-10-15 | S.C. Johnson & Son, Inc. | Devices for applying a colorant to a surface |
| US8061269B2 (en) | 2008-05-14 | 2011-11-22 | S.C. Johnson & Son, Inc. | Multilayer stencils for applying a design to a surface |
| EP2343402B1 (en) | 2008-09-30 | 2017-08-02 | FUJIFILM Corporation | Electrolytic treatment method and electrolytic treatment device |
| CN102460749A (zh) | 2009-06-26 | 2012-05-16 | 富士胶片株式会社 | 光反射基板及其制造方法 |
| WO2011078010A1 (ja) | 2009-12-25 | 2011-06-30 | 富士フイルム株式会社 | 絶縁基板、絶縁基板の製造方法、配線の形成方法、配線基板および発光素子 |
| CN109203638A (zh) * | 2018-08-06 | 2019-01-15 | 田菱精密制版(深圳)有限公司 | 一种显著提高丝印网版膜面平整性的涂布工艺方法 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US628315A (en) * | 1899-02-13 | 1899-07-04 | Albert Haberstroh | Art of making stencils. |
| GB255361A (en) * | 1925-01-21 | 1926-07-21 | David Gestetner | Improvements in and relating to duplicating |
| GB898871A (en) * | 1959-07-20 | 1962-06-14 | Koch Processes Ltd | Improvements in or relating to printing |
| DK122797B (da) * | 1967-10-06 | 1972-04-17 | Ricoh Kk | Varmefølsom stencil. |
| US3629036A (en) * | 1969-02-14 | 1971-12-21 | Shipley Co | The method coating of photoresist on circuit boards |
| JPS5711091A (en) * | 1980-06-24 | 1982-01-20 | Ricoh Co Ltd | Production of electronic recording stencile sheet |
| DK456883A (da) * | 1982-10-08 | 1984-04-09 | Pilot Pen Co Ltd | Stencil, stencilmaterialesaet samt en stencilduplikator |
| US4597829A (en) * | 1982-10-08 | 1986-07-01 | Pilot Man-Nen-Hitsu Kabushiki Kaisha | Stencil, stencil material kit and stencil duplicator kit containing the same |
| JPS5996983A (ja) | 1982-11-26 | 1984-06-04 | Riso Kagaku Corp | 孔版式製版印刷装置 |
| JPS59115898A (ja) * | 1982-12-22 | 1984-07-04 | Asia Genshi Kk | 感熱性孔版原紙 |
| JPS6013551A (ja) | 1983-07-04 | 1985-01-24 | Riso Kagaku Corp | サ−マルプリンタ |
| JPS6067196A (ja) * | 1983-09-22 | 1985-04-17 | General Kk | 感熱性孔版原紙の製造方法 |
| JPS612597A (ja) * | 1984-06-15 | 1986-01-08 | Daito Kako Kk | 感熱性孔版印刷用原紙及びその製造法 |
| JPS6112395A (ja) * | 1984-06-29 | 1986-01-20 | Takara Co Ltd | 印刷玩具用原紙 |
| JPS6112387A (ja) * | 1984-06-29 | 1986-01-20 | Takara Co Ltd | 印刷玩具用原版セツト |
| JPS61116595A (ja) * | 1984-11-12 | 1986-06-04 | Riso Kagaku Corp | 感熱孔版印刷用原紙 |
| JPS6221596A (ja) * | 1985-07-23 | 1987-01-29 | Mitsubishi Petrochem Co Ltd | 感熱性孔版原紙 |
| JPS62173296A (ja) * | 1986-01-25 | 1987-07-30 | Tomoegawa Paper Co Ltd | 感熱孔版原紙の製法 |
| DE69117734T2 (de) * | 1991-04-18 | 1996-09-26 | Hikaru Maeda | Mehrfarbiges Siebdruckverfahren und Verwendung einer Siegelschablone |
| US5165337A (en) * | 1992-02-07 | 1992-11-24 | Mattel, Inc. | Screen printing kit for children |
| JP2798108B2 (ja) * | 1992-09-24 | 1998-09-17 | 日本電気株式会社 | 混成集積回路装置 |
| JPH06112387A (ja) * | 1992-09-30 | 1994-04-22 | Toshiba Corp | 半導体素子用リード支持材の切断検査方法 |
-
1993
- 1993-09-09 JP JP22472493A patent/JP3466237B2/ja not_active Expired - Fee Related
-
1994
- 1994-09-08 DE DE69422063T patent/DE69422063T2/de not_active Expired - Fee Related
- 1994-09-08 EP EP94306602A patent/EP0642930B1/en not_active Expired - Lifetime
- 1994-09-08 DE DE69411646T patent/DE69411646T2/de not_active Expired - Fee Related
- 1994-09-08 EP EP96203686A patent/EP0770500B1/en not_active Expired - Lifetime
- 1994-09-09 KR KR1019940022675A patent/KR100197321B1/ko not_active Expired - Fee Related
- 1994-09-09 TW TW083108343A patent/TW254892B/zh active
- 1994-09-09 AU AU72898/94A patent/AU683283B2/en not_active Ceased
-
1996
- 1996-03-29 US US08/623,986 patent/US5709146A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0642930B1 (en) | 1998-07-15 |
| DE69422063D1 (de) | 2000-01-13 |
| DE69411646D1 (de) | 1998-08-20 |
| DE69411646T2 (de) | 1998-12-24 |
| KR950008125A (ko) | 1995-04-17 |
| EP0770500A2 (en) | 1997-05-02 |
| EP0642930A1 (en) | 1995-03-15 |
| EP0770500A3 (en) | 1997-10-22 |
| DE69422063T2 (de) | 2000-05-25 |
| JPH0781264A (ja) | 1995-03-28 |
| EP0770500B1 (en) | 1999-12-08 |
| AU7289894A (en) | 1995-03-23 |
| TW254892B (cg-RX-API-DMAC7.html) | 1995-08-21 |
| US5709146A (en) | 1998-01-20 |
| AU683283B2 (en) | 1997-11-06 |
| JP3466237B2 (ja) | 2003-11-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100197321B1 (ko) | 스텐실 인쇄용 시이트의 제조방법 | |
| AU677063B2 (en) | Printing plate and process for plate-making using the same | |
| KR100197322B1 (ko) | 공판 인쇄 시트의 제조방법 | |
| KR100193925B1 (ko) | 공판 인쇄용 원지의 제판방법 | |
| KR100189662B1 (ko) | 스텐실 인쇄용 시이트의 천공방법 | |
| JPH0999664A (ja) | 感熱孔版原紙の製版方法並びにそれに用いる感熱孔版原紙及び組成物 | |
| US5879792A (en) | Stencil printing sheet and process for stencil making the same | |
| AU680710B2 (en) | Stencil printing sheet and process for stencil-making the same | |
| JP3477231B2 (ja) | 水性溶剤穿孔性孔版印刷用原紙、その穿孔方法および印刷方法 | |
| JPH0781265A (ja) | 孔版印刷用原紙およびその製造法 | |
| KR100436103B1 (ko) | 스텐실 시트와 그 제조방법 및 스텐실판의 제조방법 | |
| JP2001232964A (ja) | 感熱孔版原紙及びその製版方法 | |
| JPH08197707A (ja) | 孔版印刷用原紙の製版方法および孔版印刷用原紙 | |
| JPH0858055A (ja) | 孔版印刷用原紙の製版方法 | |
| JPH08197708A (ja) | 孔版印刷用原紙及びその製版方法 | |
| JPH08150789A (ja) | 孔版印刷用原紙およびその製造方法 | |
| JPH08324147A (ja) | 孔版シートおよびその製版方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20070208 Year of fee payment: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20080225 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20080225 |