KR0161653B1 - 테이프 캐리어 패키지 반도체장치 - Google Patents

테이프 캐리어 패키지 반도체장치 Download PDF

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Publication number
KR0161653B1
KR0161653B1 KR1019950007882A KR19950007882A KR0161653B1 KR 0161653 B1 KR0161653 B1 KR 0161653B1 KR 1019950007882 A KR1019950007882 A KR 1019950007882A KR 19950007882 A KR19950007882 A KR 19950007882A KR 0161653 B1 KR0161653 B1 KR 0161653B1
Authority
KR
South Korea
Prior art keywords
resin
semiconductor substrate
semiconductor device
inner leads
carrier package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019950007882A
Other languages
English (en)
Korean (ko)
Other versions
KR960002710A (ko
Inventor
미쯔아끼 오소노
나오유끼 타지마
가쯔노부 모리
Original Assignee
쯔지 하루오
샤프 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쯔지 하루오, 샤프 가부시끼가이샤 filed Critical 쯔지 하루오
Publication of KR960002710A publication Critical patent/KR960002710A/ko
Application granted granted Critical
Publication of KR0161653B1 publication Critical patent/KR0161653B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors

Landscapes

  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1019950007882A 1994-06-23 1995-03-31 테이프 캐리어 패키지 반도체장치 Expired - Lifetime KR0161653B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6141584A JP2989476B2 (ja) 1994-06-23 1994-06-23 Ｔｃｐ半導体装置
JP94-141584 1994-06-23

Publications (2)

Publication Number Publication Date
KR960002710A KR960002710A (ko) 1996-01-26
KR0161653B1 true KR0161653B1 (ko) 1999-02-01

Family

ID=15295405

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950007882A Expired - Lifetime KR0161653B1 (ko) 1994-06-23 1995-03-31 테이프 캐리어 패키지 반도체장치

Country Status (4)

Country Link
US (1) US5614760A (enExample)
JP (1) JP2989476B2 (enExample)
KR (1) KR0161653B1 (enExample)
TW (1) TW286428B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5736432A (en) * 1996-09-20 1998-04-07 National Semiconductor Corporation Lead frame with lead finger locking feature and method for making same
US6104619A (en) * 1997-12-16 2000-08-15 Kabushiki Kaisha Toshiba Tape carrier package and its fabrication method therefor
JP3147071B2 (ja) * 1998-01-19 2001-03-19 日本電気株式会社 半導体装置及びその製造方法
KR100574278B1 (ko) * 1998-11-27 2006-09-22 삼성전자주식회사 테이프 캐리어 패키지 및 이를 이용한 액정표시기모듈
US6201299B1 (en) * 1999-06-23 2001-03-13 Advanced Semiconductor Engineering, Inc. Substrate structure of BGA semiconductor package
JP2003258184A (ja) * 2002-02-27 2003-09-12 Nec Kyushu Ltd 半導体装置およびリードフレーム
TW200703606A (en) * 2005-07-15 2007-01-16 Siliconware Precision Industries Co Ltd Semiconductor package and fabrication method thereof
KR101907904B1 (ko) 2018-04-27 2018-10-16 주식회사 모습 기념 코인 제조 장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53103659A (en) * 1977-02-22 1978-09-09 Takuma Co Ltd Apparatus for sucking sludge in precipitation tank
US4996583A (en) * 1989-02-15 1991-02-26 Matsushita Electric Industrial Co., Ltd. Stack type semiconductor package
US5157478A (en) * 1989-04-19 1992-10-20 Mitsubishi Denki Kabushiki Kaisha Tape automated bonding packaged semiconductor device incorporating a heat sink
US5250842A (en) * 1990-09-07 1993-10-05 Nec Corporation Semiconductor devices using tab tape
JPH05152486A (ja) * 1991-11-26 1993-06-18 Asahi Glass Co Ltd 回路装置

Also Published As

Publication number Publication date
JP2989476B2 (ja) 1999-12-13
JPH088277A (ja) 1996-01-12
KR960002710A (ko) 1996-01-26
US5614760A (en) 1997-03-25
TW286428B (enExample) 1996-09-21

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