KR0159350B1 - 페이스트 도포기 - Google Patents

페이스트 도포기

Info

Publication number
KR0159350B1
KR0159350B1 KR1019950042073A KR19950042073A KR0159350B1 KR 0159350 B1 KR0159350 B1 KR 0159350B1 KR 1019950042073 A KR1019950042073 A KR 1019950042073A KR 19950042073 A KR19950042073 A KR 19950042073A KR 0159350 B1 KR0159350 B1 KR 0159350B1
Authority
KR
South Korea
Prior art keywords
paste
nozzle
substrate
discharge port
negative pressure
Prior art date
Application number
KR1019950042073A
Other languages
English (en)
Korean (ko)
Other versions
KR960016976A (ko
Inventor
시게루 이시다
하루오 미시나
토미오 요네다
유끼히로 카와수미
Original Assignee
우치케사끼 기이치로
히다찌 테크노 엔지니어링 컴파니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 우치케사끼 기이치로, 히다찌 테크노 엔지니어링 컴파니 리미티드 filed Critical 우치케사끼 기이치로
Publication of KR960016976A publication Critical patent/KR960016976A/ko
Application granted granted Critical
Publication of KR0159350B1 publication Critical patent/KR0159350B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1019950042073A 1994-11-17 1995-11-17 페이스트 도포기 KR0159350B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-283482 1994-11-17
JP6283482A JPH08141464A (ja) 1994-11-17 1994-11-17 ペースト塗布機

Publications (2)

Publication Number Publication Date
KR960016976A KR960016976A (ko) 1996-06-17
KR0159350B1 true KR0159350B1 (ko) 1998-11-16

Family

ID=17666125

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950042073A KR0159350B1 (ko) 1994-11-17 1995-11-17 페이스트 도포기

Country Status (2)

Country Link
JP (1) JPH08141464A (ja)
KR (1) KR0159350B1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100964981B1 (ko) * 2009-11-26 2010-06-21 김인수 액상수지 주입장치
KR20150106538A (ko) * 2014-03-12 2015-09-22 에이피시스템 주식회사 디스펜서의 액맺힘 방지 장치 및 그 동작 방법

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4665509B2 (ja) * 2004-12-20 2011-04-06 凸版印刷株式会社 インキジェット塗工装置
JP2007105730A (ja) * 2007-01-16 2007-04-26 Seiko Epson Corp 塗布装置及び塗布方法
KR101005251B1 (ko) * 2010-06-25 2011-01-04 양영수 3축방향으로 이동이 가능한 센터축 위치 고정용 도포기
TW202120198A (zh) * 2019-08-13 2021-06-01 日商東京威力科創股份有限公司 基板處理裝置、噴嘴檢查方法及記憶媒體

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100964981B1 (ko) * 2009-11-26 2010-06-21 김인수 액상수지 주입장치
KR20150106538A (ko) * 2014-03-12 2015-09-22 에이피시스템 주식회사 디스펜서의 액맺힘 방지 장치 및 그 동작 방법

Also Published As

Publication number Publication date
JPH08141464A (ja) 1996-06-04
KR960016976A (ko) 1996-06-17

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Legal Events

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A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20080804

Year of fee payment: 11

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