KR0157474B1 - 반도체 소자용 금합금 - Google Patents

반도체 소자용 금합금 Download PDF

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Publication number
KR0157474B1
KR0157474B1 KR1019940005746A KR19940005746A KR0157474B1 KR 0157474 B1 KR0157474 B1 KR 0157474B1 KR 1019940005746 A KR1019940005746 A KR 1019940005746A KR 19940005746 A KR19940005746 A KR 19940005746A KR 0157474 B1 KR0157474 B1 KR 0157474B1
Authority
KR
South Korea
Prior art keywords
gold
yttrium
beryllium
ppm
calcium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019940005746A
Other languages
English (en)
Korean (ko)
Other versions
KR940022687A (ko
Inventor
겐지 모리
마사노리 도키다
다카노리 후쿠다
Original Assignee
고노 사토시
다츠다 덴센 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 고노 사토시, 다츠다 덴센 가부시키가이샤 filed Critical 고노 사토시
Publication of KR940022687A publication Critical patent/KR940022687A/ko
Application granted granted Critical
Publication of KR0157474B1 publication Critical patent/KR0157474B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/50—Alloying conductive materials with semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
KR1019940005746A 1993-03-31 1994-03-22 반도체 소자용 금합금 Expired - Fee Related KR0157474B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9888293 1993-03-31
JP93-98882 1993-03-31

Publications (2)

Publication Number Publication Date
KR940022687A KR940022687A (ko) 1994-10-21
KR0157474B1 true KR0157474B1 (ko) 1998-12-01

Family

ID=14231528

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940005746A Expired - Fee Related KR0157474B1 (ko) 1993-03-31 1994-03-22 반도체 소자용 금합금

Country Status (4)

Country Link
KR (1) KR0157474B1 (enExample)
GB (1) GB2276632B (enExample)
SG (1) SG44578A1 (enExample)
TW (1) TW284791B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5945065A (en) * 1996-07-31 1999-08-31 Tanaka Denshi Kogyo Method for wedge bonding using a gold alloy wire

Also Published As

Publication number Publication date
GB9405839D0 (en) 1994-05-11
GB2276632A (en) 1994-10-05
SG44578A1 (en) 1997-12-19
KR940022687A (ko) 1994-10-21
GB2276632B (en) 1996-02-28
TW284791B (enExample) 1996-09-01

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