KR0131271B1 - Thin ic card and method for producing the same - Google Patents
Thin ic card and method for producing the sameInfo
- Publication number
- KR0131271B1 KR0131271B1 KR94021754A KR19940021754A KR0131271B1 KR 0131271 B1 KR0131271 B1 KR 0131271B1 KR 94021754 A KR94021754 A KR 94021754A KR 19940021754 A KR19940021754 A KR 19940021754A KR 0131271 B1 KR0131271 B1 KR 0131271B1
- Authority
- KR
- South Korea
- Prior art keywords
- card
- thin
- producing
- same
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21750493 | 1993-09-01 | ||
JP5318632A JPH07117385A (ja) | 1993-09-01 | 1993-12-17 | 薄型icカードおよび薄型icカードの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR0131271B1 true KR0131271B1 (en) | 1998-04-24 |
Family
ID=26522051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR94021754A KR0131271B1 (en) | 1993-09-01 | 1994-08-31 | Thin ic card and method for producing the same |
Country Status (5)
Country | Link |
---|---|
US (1) | US5612532A (ko) |
EP (1) | EP0646895B1 (ko) |
JP (1) | JPH07117385A (ko) |
KR (1) | KR0131271B1 (ko) |
DE (1) | DE69425592T2 (ko) |
Families Citing this family (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4443980C2 (de) * | 1994-12-11 | 1997-07-17 | Angewandte Digital Elektronik | Verfahren zur Herstellung von Chipkarten und Chipkarte hergestellt nach diesem Verfahren |
DE19512191C2 (de) * | 1995-03-31 | 2000-03-09 | Siemens Ag | Kartenförmiger Datenträger und Leadframe zur Verwendung in einem solchen Datenträger |
AU704645B2 (en) * | 1995-04-13 | 1999-04-29 | Dainippon Printing Co. Ltd. | IC card and IC module |
AT1470U1 (de) * | 1995-08-01 | 1997-05-26 | Austria Card | Laminierte karte und verfahren zu ihrer herstellung |
AU6238396A (en) * | 1995-08-01 | 1997-02-26 | Austria Card Plastikkarten Und Ausweissysteme Gmbh | Card-shaped data carrier for contactless applications with acomponent and a transmission system for the contactless applcations, method of producing such a card-shaped data carrier and module therefor |
JP3735374B2 (ja) * | 1995-08-01 | 2006-01-18 | オーストリア カード プラスティッカルテン ウント アウスヴァイスジステーム ゲゼルシャフト ミット ベシュレンクテル ハフツング | コンポネントを含むモジュールを持ち且つコイルを持つデータ担体及びその製造方法 |
DE19534480C2 (de) * | 1995-09-18 | 1999-11-11 | David Finn | IC-Kartenmodul zur Herstellung einer IC-Karte sowie IC-Karte mit einem IC-Kartenmodul |
US5817207A (en) | 1995-10-17 | 1998-10-06 | Leighton; Keith R. | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
DE19654902C2 (de) * | 1996-03-15 | 2000-02-03 | David Finn | Chipkarte |
DE19612718B4 (de) * | 1996-03-29 | 2006-06-29 | Ods Landis & Gyr Gmbh & Co. Kg | Chipkarte mit Batterie sowie Verfahren zur Montage einer Chipmodul/Batterie-Einheit |
KR100209259B1 (ko) * | 1996-04-25 | 1999-07-15 | 이해규 | Ic 카드 및 그 제조방법 |
JPH09315061A (ja) * | 1996-06-03 | 1997-12-09 | Minolta Co Ltd | Icカードおよびicカード装着装置 |
JPH09327990A (ja) * | 1996-06-11 | 1997-12-22 | Toshiba Corp | カード型記憶装置 |
AU707828B2 (en) * | 1996-08-05 | 1999-07-22 | Gemplus S.C.A. | Improvement to a method for producing smart cards and cards obtained thereby |
DE19632813C2 (de) * | 1996-08-14 | 2000-11-02 | Siemens Ag | Verfahren zur Herstellung eines Chipkarten-Moduls, unter Verwendung dieses Verfahrens hergestellter Chipkarten-Modul und diesen Chipkarten-Modul enthaltende Kombi-Chipkarte |
US6011698A (en) * | 1996-11-12 | 2000-01-04 | Delco Electronics Corp. | Circuit protection from radio frequency energy |
CA2272383A1 (en) * | 1996-11-20 | 1998-05-28 | Edward M. Scheidt | Cryptographic medium |
DE19703990A1 (de) * | 1997-02-03 | 1998-08-06 | Giesecke & Devrient Gmbh | Modular aufgebauter, elektronischer Datenträger |
FR2760113B1 (fr) * | 1997-02-24 | 1999-06-04 | Gemplus Card Int | Procede de fabrication de carte sans contact a antenne bobinee |
US6049463A (en) * | 1997-07-25 | 2000-04-11 | Motorola, Inc. | Microelectronic assembly including an antenna element embedded within a polymeric card, and method for forming same |
US6024285A (en) | 1997-08-19 | 2000-02-15 | Micron Technology, Inc. | Wireless communication devices and methods of forming wireless communication devices |
JP3687783B2 (ja) * | 1997-11-04 | 2005-08-24 | エルケ ツァケル | コンタクトレスチップカードを製造する方法およびコンタクトレスチップカード |
DE19800341C2 (de) * | 1997-11-12 | 2002-02-14 | Meinen Ziegel & Co Gmbh | IC-Karte, insbesondere für ein schlüsselloses Zugangssystem |
ATE345539T1 (de) * | 1998-03-24 | 2006-12-15 | Toshiba Kk | Ic karte mit kontaktbehafteten und kontaktlosen schnittstellen |
US6040622A (en) * | 1998-06-11 | 2000-03-21 | Sandisk Corporation | Semiconductor package using terminals formed on a conductive layer of a circuit board |
US6525410B1 (en) * | 1998-07-24 | 2003-02-25 | Texas Instruments Incorporated | Integrated circuit wireless tagging |
CN1516147A (zh) * | 1998-09-21 | 2004-07-28 | 索尼公司 | 装有记录媒体的记录媒体装置及记录和/或再生装置 |
FR2784210B1 (fr) * | 1998-10-02 | 2001-09-14 | Gemplus Card Int | Carte a puce sans contact comportant des moyens d'inhibition |
FR2785072B1 (fr) * | 1998-10-23 | 2001-01-19 | St Microelectronics Sa | Circuit electronique autocollant |
FR2788646B1 (fr) * | 1999-01-19 | 2007-02-09 | Bull Cp8 | Carte a puce munie d'une antenne en boucle, et micromodule associe |
JP3335938B2 (ja) * | 1999-03-01 | 2002-10-21 | 新光電気工業株式会社 | Icカード用アンテナフレーム及びicカードの製造方法 |
JP4320481B2 (ja) * | 1999-03-05 | 2009-08-26 | ソニー株式会社 | 電子マネーシステム |
EP1186150A1 (de) * | 1999-06-18 | 2002-03-13 | Swisscom Mobile AG | Auswechselbarer batteriesatz für mobilfunktelefon |
US6634561B1 (en) | 1999-06-24 | 2003-10-21 | Sandisk Corporation | Memory card electrical contact structure |
US6368901B2 (en) | 1999-07-15 | 2002-04-09 | Texas Instruments Incorporated | Integrated circuit wireless tagging |
JP4299414B2 (ja) * | 1999-10-12 | 2009-07-22 | 富士通マイクロエレクトロニクス株式会社 | コンビネーションカード、icカード用モジュール及びコンビネーションカードの製造方法 |
JP2001167242A (ja) * | 1999-12-10 | 2001-06-22 | Sony Corp | エンボス加工可能なicカード、その製造方法及びその情報読取確認システム |
US6433285B2 (en) * | 2000-03-30 | 2002-08-13 | Matsushita Electronics Corporation | Printed wiring board, IC card module using the same, and method for producing IC card module |
KR100727904B1 (ko) * | 2000-06-09 | 2007-06-13 | 삼성전자주식회사 | 칩 인베디드 트레이딩 카드, 이에 적합한 기록/재생 장치,그리고 이에 적합한 커뮤니케이션 구현 방법 |
US6945461B1 (en) * | 2001-03-30 | 2005-09-20 | 3Com Corporation | Compact multifunction card for electronic devices |
EP1788512A1 (en) * | 2001-04-02 | 2007-05-23 | Hitachi, Ltd. | A semiconductor device and a method of manufacturing the same |
JP2002342731A (ja) * | 2001-05-16 | 2002-11-29 | Matsushita Electric Ind Co Ltd | 複合icカード |
JPWO2003015169A1 (ja) * | 2001-08-07 | 2004-12-02 | 株式会社ルネサステクノロジ | 半導体装置およびicカード |
US7177601B1 (en) * | 2001-11-02 | 2007-02-13 | Raytheon Company | Method and apparatus for transceiving data using a bimodal power data link transceiver device |
DE10207000C2 (de) * | 2002-02-19 | 2003-12-11 | Orga Kartensysteme Gmbh | Chipkarte |
JP2003288573A (ja) * | 2002-03-27 | 2003-10-10 | Seiko Epson Corp | Icカード及びその製造方法 |
KR100910769B1 (ko) * | 2002-06-11 | 2009-08-04 | 삼성테크윈 주식회사 | Ic 카드 및, 그것의 제조 방법 |
JP4141857B2 (ja) * | 2003-02-18 | 2008-08-27 | 日立マクセル株式会社 | 半導体装置 |
JP4318967B2 (ja) * | 2003-06-16 | 2009-08-26 | Tdk株式会社 | Icカード |
DE10343734A1 (de) * | 2003-09-22 | 2005-04-21 | Austria Card | Datenträgerkarte mit aufladbarer Batterie |
US7177159B2 (en) * | 2004-05-03 | 2007-02-13 | 3 View Technology Co., Ltd. | Packaging structure of electronic card |
US7444735B2 (en) * | 2004-06-15 | 2008-11-04 | Chartered Semiconductor Manufacturing Ltd. | Process for manufacturing an integrated circuit system |
CN101156164B (zh) * | 2005-09-26 | 2014-05-07 | 松下电器产业株式会社 | 非接触型信息存储介质及其制造方法 |
JP5135780B2 (ja) * | 2005-12-05 | 2013-02-06 | 日本電気株式会社 | 電子デバイス |
JP2007183919A (ja) * | 2005-12-05 | 2007-07-19 | Nec Corp | Rfidタグ |
DE102009014343A1 (de) * | 2009-03-21 | 2010-09-23 | Deutsche Telekom Ag | Verfahren zum Herstellen einer eine kontaktlose und eine kontaktbehaftete Schnittstelle aufweisenden Chipkarte |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
US20140312123A1 (en) * | 2012-09-28 | 2014-10-23 | Smart Approach Co., Ltd. | Radio Frequency Identification Module |
EP2933759A1 (fr) * | 2014-04-18 | 2015-10-21 | Gemalto SA | Procédé de fabrication d'un dispositif à circuit électronique/électrique |
CN104166870B (zh) * | 2014-07-01 | 2018-04-27 | 珠海市金邦达保密卡有限公司 | 双界面金属智能芯片卡及其制造方法 |
CN104166869A (zh) * | 2014-07-07 | 2014-11-26 | 珠海市金邦达保密卡有限公司 | 无源led闪光交易卡、制备方法及交易显示的方法 |
FR3089659B1 (fr) * | 2018-12-07 | 2022-10-21 | Smart Packaging Solutions | Carte à puce en métal à double interface de communication |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1987000486A1 (en) * | 1985-07-17 | 1987-01-29 | Ibiden Co., Ltd. | Printed wiring board for ic cards |
JPH01185783A (ja) * | 1988-01-20 | 1989-07-25 | Mitsubishi Electric Corp | Icカード識別方式 |
JP2559849B2 (ja) * | 1989-05-23 | 1996-12-04 | 三菱電機株式会社 | Icカード |
DE3935364C1 (ko) * | 1989-10-24 | 1990-08-23 | Angewandte Digital Elektronik Gmbh, 2051 Brunstorf, De | |
DE4007221A1 (de) * | 1990-03-07 | 1991-09-12 | Gao Ges Automation Org | Pruefkopf fuer kontaktflaechen von wertkarten mit eingelagertem halbleiterchip |
US5049728A (en) * | 1990-04-04 | 1991-09-17 | Rovin George H | IC card system with removable IC modules |
JPH0416831A (ja) * | 1990-05-11 | 1992-01-21 | Nec Corp | 非線形光学素子の作製方法 |
JPH04168094A (ja) * | 1990-10-31 | 1992-06-16 | Mitsubishi Electric Corp | 携帯形半導体記憶装置 |
EP0492482B1 (en) * | 1990-12-28 | 1996-10-23 | Mitsubishi Denki Kabushiki Kaisha | Non contact type IC-card |
DE4105869C2 (de) * | 1991-02-25 | 2000-05-18 | Edgar Schneider | IC-Karte und Verfahren zu ihrer Herstellung |
JPH05169885A (ja) * | 1991-12-26 | 1993-07-09 | Mitsubishi Electric Corp | 薄型icカード |
DE4218923A1 (de) * | 1992-06-10 | 1992-10-22 | Haiss Ulrich | Wertkarte mit elektronik-wert-chip |
JP2896031B2 (ja) * | 1992-12-28 | 1999-05-31 | 三菱電機株式会社 | 非接触icカードの端末機および非接触icカードシステム |
-
1993
- 1993-12-17 JP JP5318632A patent/JPH07117385A/ja active Pending
-
1994
- 1994-07-06 DE DE69425592T patent/DE69425592T2/de not_active Expired - Lifetime
- 1994-07-06 EP EP94304992A patent/EP0646895B1/en not_active Expired - Lifetime
- 1994-08-31 KR KR94021754A patent/KR0131271B1/ko not_active IP Right Cessation
-
1995
- 1995-11-09 US US08/554,927 patent/US5612532A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH07117385A (ja) | 1995-05-09 |
EP0646895B1 (en) | 2000-01-19 |
DE69425592D1 (de) | 2000-09-21 |
EP0646895A3 (en) | 1995-06-28 |
DE69425592T2 (de) | 2000-12-14 |
US5612532A (en) | 1997-03-18 |
EP0646895A2 (en) | 1995-04-05 |
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Legal Events
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---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20101028 Year of fee payment: 14 |
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LAPS | Lapse due to unpaid annual fee |