DE10207000C2 - Chipkarte - Google Patents
ChipkarteInfo
- Publication number
- DE10207000C2 DE10207000C2 DE2002107000 DE10207000A DE10207000C2 DE 10207000 C2 DE10207000 C2 DE 10207000C2 DE 2002107000 DE2002107000 DE 2002107000 DE 10207000 A DE10207000 A DE 10207000A DE 10207000 C2 DE10207000 C2 DE 10207000C2
- Authority
- DE
- Germany
- Prior art keywords
- battery
- chip card
- injection
- chip
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
- G06K19/0702—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including a battery
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0046—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/712—Containers; Packaging elements or accessories, Packages
- B29L2031/7146—Battery-cases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Battery Mounting, Suspending (AREA)
Description
Claims (3)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2002107000 DE10207000C2 (de) | 2002-02-19 | 2002-02-19 | Chipkarte |
AU2003215510A AU2003215510A1 (en) | 2002-02-19 | 2003-02-19 | Chip card |
PCT/DE2003/000514 WO2003071475A2 (de) | 2002-02-19 | 2003-02-19 | Chipkarte |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2002107000 DE10207000C2 (de) | 2002-02-19 | 2002-02-19 | Chipkarte |
Publications (2)
Publication Number | Publication Date |
---|---|
DE10207000A1 DE10207000A1 (de) | 2003-09-04 |
DE10207000C2 true DE10207000C2 (de) | 2003-12-11 |
Family
ID=27674762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2002107000 Expired - Fee Related DE10207000C2 (de) | 2002-02-19 | 2002-02-19 | Chipkarte |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2003215510A1 (de) |
DE (1) | DE10207000C2 (de) |
WO (1) | WO2003071475A2 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10166705B2 (en) * | 2016-04-27 | 2019-01-01 | Jtekt Corporation | Method of manufacturing housing structure and housing structure |
JP6886612B2 (ja) * | 2016-04-27 | 2021-06-16 | 株式会社ジェイテクト | ハウジング構造体の製造方法およびハウジング構造体 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0646895A2 (de) * | 1993-09-01 | 1995-04-05 | Kabushiki Kaisha Toshiba | Dünne Chipkarte und ihr Herstellungsverfahren |
DE4243654C2 (de) * | 1991-12-26 | 2002-01-24 | Mitsubishi Electric Corp | Dünne IC-Karte |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2913190B2 (ja) * | 1989-11-25 | 1999-06-28 | 日立マクセル株式会社 | 半導体カードならびにその製造方法 |
JP3021008B2 (ja) * | 1990-08-09 | 2000-03-15 | 日本写真印刷株式会社 | Icカードとその製造方法 |
JP2674366B2 (ja) * | 1991-07-15 | 1997-11-12 | 三菱電機株式会社 | Icカード |
JPH1134553A (ja) * | 1997-07-18 | 1999-02-09 | Rohm Co Ltd | Icモジュール、およびその製造方法、ならびにこれを備えたicカード |
ATE371228T1 (de) * | 2001-10-18 | 2007-09-15 | Trueb Ag | Verfahren zur herstellung eines datenträgers sowie nach diesem verfahren hergestellter datenträger |
-
2002
- 2002-02-19 DE DE2002107000 patent/DE10207000C2/de not_active Expired - Fee Related
-
2003
- 2003-02-19 WO PCT/DE2003/000514 patent/WO2003071475A2/de not_active Application Discontinuation
- 2003-02-19 AU AU2003215510A patent/AU2003215510A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4243654C2 (de) * | 1991-12-26 | 2002-01-24 | Mitsubishi Electric Corp | Dünne IC-Karte |
EP0646895A2 (de) * | 1993-09-01 | 1995-04-05 | Kabushiki Kaisha Toshiba | Dünne Chipkarte und ihr Herstellungsverfahren |
Also Published As
Publication number | Publication date |
---|---|
WO2003071475A2 (de) | 2003-08-28 |
DE10207000A1 (de) | 2003-09-04 |
WO2003071475A3 (de) | 2004-04-01 |
AU2003215510A1 (en) | 2003-09-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8304 | Grant after examination procedure | ||
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: SAGEM ORGA GMBH, 33104 PADERBORN, DE |
|
R082 | Change of representative |
Representative=s name: RICHARDT PATENTANWAELTE, DE Representative=s name: RICHARDT PATENTANWAELTE, 65185 WIESBADEN, DE |
|
R082 | Change of representative |
Representative=s name: RICHARDT PATENTANWAELTE, 65185 WIESBADEN, DE Representative=s name: RICHARDT PATENTANWAELTE, DE |
|
R081 | Change of applicant/patentee |
Owner name: MORPHO CARDS GMBH, DE Free format text: FORMER OWNER: SAGEM ORGA GMBH, 33106 PADERBORN, DE Effective date: 20120509 |
|
R082 | Change of representative |
Representative=s name: RICHARDT PATENTANWAELTE PART GMBB, DE Effective date: 20120213 Representative=s name: RICHARDT PATENTANWAELTE PART GMBB, DE Effective date: 20120509 Representative=s name: RICHARDT PATENTANWAELTE GBR, DE Effective date: 20120509 Representative=s name: RICHARDT PATENTANWAELTE GBR, DE Effective date: 20120213 Representative=s name: RICHARDT PATENTANWAELTE PARTG MBB, DE Effective date: 20120509 Representative=s name: RICHARDT PATENTANWAELTE PARTG MBB, DE Effective date: 20120213 |
|
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |