WO2003071475A2 - Chipkarte - Google Patents
Chipkarte Download PDFInfo
- Publication number
- WO2003071475A2 WO2003071475A2 PCT/DE2003/000514 DE0300514W WO03071475A2 WO 2003071475 A2 WO2003071475 A2 WO 2003071475A2 DE 0300514 W DE0300514 W DE 0300514W WO 03071475 A2 WO03071475 A2 WO 03071475A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chip card
- battery
- injection
- plastic
- card body
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
- G06K19/0702—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including a battery
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0046—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/712—Containers; Packaging elements or accessories, Packages
- B29L2031/7146—Battery-cases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a chip card, as it is known as GSM or smart cards, to process cashless payment transactions, to operate mobile telephones or to provide security-relevant areas with an access identifier.
- GSM Global System for Mobile Communications
- Other conceivable applications are company ID cards or health insurance cards for storing personal data.
- the increasing spread of chip cards results from their wide range of uses. In this way, data can be stored, processed, read in or read out and thus made available in a reproducible manner.
- the chip cards are easy to transport and therefore allow a high degree of mobility.
- the increasing spread brings with it increasing demands on the chip cards, so that an increasing integration of functions can be observed.
- chip cards are becoming more complex in structure and have to accommodate a growing number of electronic components.
- the data exchange via chip card can in principle be contact-related, for example by means of a contact surface unit provided on the chip card surface or contactless, that is, for example, inductively via an electromagnetic coupling.
- a coil that is integrated in the chip card body of the chip card can emit its signals to an external reading device suitable for this purpose, or can receive its signals from an external device.
- the chip card thickness must be limited to 0.76 mm. This places increased demands on the electronic components to be integrated into the chip card. These have to be extremely flat.
- a chip card can be increased considerably if it is possible to integrate a battery or an accumulator cell into the chip card body, because this makes the chip card self-sufficient, ie it can work independently of external energy sources.
- the electrodes have customary connection surfaces for connecting the battery to the conductor tracks of the chip card.
- RHISS rechargeable hydrogen ion solid state electrolyte
- the components integrated into a chip card are generally not rigid, but rather rigid.
- the chip card body mostly consists of plastic or a plastic composite material with elastic properties, so that the chip card body is correspondingly flexible.
- the partially rigid electronic components incorporated into the chip card result in discontinuities in the bending process of the chip card during daily use of the chip cards. Form at the transitions between the electronic components and the chip card body As a result of the elastic movements, voltage peaks develop that can permanently damage the chip card. These voltage peaks are the cause of cracks developing inside the chip card.
- the high loads during injection molding have an effect on a battery to be integrated into the chip card in such a way that it can delaminate.
- the delamination of the battery limits its usability.
- the battery body undesirably changes its external geometry.
- the invention is based on the technical problem of providing a chip card, in the chip card body of which, in addition to electronic components, a battery is also implemented which withstands the high thermal and mechanical loads during the production of the chip card body, so that delamination of the battery can be avoided.
- the technical teaching of the invention accordingly consists in the fact that the battery implemented in the chip card body has a tapering geometry against the direction of injection of the liquid plastic into the injection mold cavity.
- the plastic that is injected, liquefied and heated into the injection mold cavity first meets the tapered geometry of the battery and, starting from there, uniformly surrounds the battery distributed. As a result, high mechanical loads on the circumference of the battery or on the outer surfaces of the battery are avoided. Delamination can no longer occur.
- a positive effect of the solution according to the invention is that the liquefied plastic is distributed very uniformly within the injection mold cavity. An improvement in the homogeneity of the chip card body can thus be achieved.
- the battery can have the shape of a drop, a circular cone, a pyramid, an octahedron or a tetrahedron, at least on its side facing the injection direction.
- a battery according to the invention has a geometry that tapers against the direction of injection. This can also only exist in certain areas.
- other flow-optimized profiles for the battery design are of course conceivable, which can approximate the design of an aircraft wing. propose to provide the battery with electrical connections on its side facing away from the injection direction.
- the solution according to the invention made it possible overall to provide a chip card which has a simple structure and, moreover, leads to decisive quality improvements. Another very important aspect is a longer service life due to the lower stress on the electronic components and in particular the batteries implemented in the chip card body.
- an injection mold cavity which has been designated 2 overall, is shown in a highly simplified manner.
- the outer dimension of the injection mold cavity corresponds to the outer dimensions of the finished chip card body 1.
- a battery 3 is inserted into the injection mold cavity 2.
- This battery 3 has an injection-side geometry 5 which tapers against the injection direction of the liquefied plastic.
- this injection-side geometry of the battery 3 has a side 6 facing away from the injection direction, on which the electrical connections 7 and 8 of the battery 3 are also located.
- Battery 3 has a teardrop shape in plan view. It is irrelevant that the battery was designed as a flat battery in the present case, that is, it has a very low overall height.
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003215510A AU2003215510A1 (en) | 2002-02-19 | 2003-02-19 | Chip card |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2002107000 DE10207000C2 (de) | 2002-02-19 | 2002-02-19 | Chipkarte |
DE10207000.8 | 2002-02-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003071475A2 true WO2003071475A2 (de) | 2003-08-28 |
WO2003071475A3 WO2003071475A3 (de) | 2004-04-01 |
Family
ID=27674762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2003/000514 WO2003071475A2 (de) | 2002-02-19 | 2003-02-19 | Chipkarte |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2003215510A1 (de) |
DE (1) | DE10207000C2 (de) |
WO (1) | WO2003071475A2 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107399363A (zh) * | 2016-04-27 | 2017-11-28 | 株式会社捷太格特 | 外壳结构体的制造方法以及外壳结构体 |
EP3238905A3 (de) * | 2016-04-27 | 2018-02-21 | Jtekt Corporation | Verfahren zur herstellung einer gehäusestruktur und gehäusestruktur |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4037555A1 (de) * | 1989-11-25 | 1991-05-29 | Hitachi Maxell | Halbleiterkarte und herstellungsverfahren dafuer |
JPH0493296A (ja) * | 1990-08-09 | 1992-03-26 | Nissha Printing Co Ltd | Icカードとその製造方法 |
JPH0516582A (ja) * | 1991-07-15 | 1993-01-26 | Mitsubishi Electric Corp | Icカード |
EP0646895A2 (de) * | 1993-09-01 | 1995-04-05 | Kabushiki Kaisha Toshiba | Dünne Chipkarte und ihr Herstellungsverfahren |
EP0923047A1 (de) * | 1997-07-18 | 1999-06-16 | Rohm Co., Ltd. | Ic-modul, sein herstellungsverfahren und ic-karte damit versehen |
WO2003034333A1 (de) * | 2001-10-18 | 2003-04-24 | Trüb AG | Verfahren zur herstellung eines datenträgers sowie nach diesem verfahren hergestellter datenträger |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05169885A (ja) * | 1991-12-26 | 1993-07-09 | Mitsubishi Electric Corp | 薄型icカード |
-
2002
- 2002-02-19 DE DE2002107000 patent/DE10207000C2/de not_active Expired - Fee Related
-
2003
- 2003-02-19 AU AU2003215510A patent/AU2003215510A1/en not_active Abandoned
- 2003-02-19 WO PCT/DE2003/000514 patent/WO2003071475A2/de not_active Application Discontinuation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4037555A1 (de) * | 1989-11-25 | 1991-05-29 | Hitachi Maxell | Halbleiterkarte und herstellungsverfahren dafuer |
JPH0493296A (ja) * | 1990-08-09 | 1992-03-26 | Nissha Printing Co Ltd | Icカードとその製造方法 |
JPH0516582A (ja) * | 1991-07-15 | 1993-01-26 | Mitsubishi Electric Corp | Icカード |
EP0646895A2 (de) * | 1993-09-01 | 1995-04-05 | Kabushiki Kaisha Toshiba | Dünne Chipkarte und ihr Herstellungsverfahren |
EP0923047A1 (de) * | 1997-07-18 | 1999-06-16 | Rohm Co., Ltd. | Ic-modul, sein herstellungsverfahren und ic-karte damit versehen |
WO2003034333A1 (de) * | 2001-10-18 | 2003-04-24 | Trüb AG | Verfahren zur herstellung eines datenträgers sowie nach diesem verfahren hergestellter datenträger |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 016, no. 328 (M-1281), 16. Juli 1992 (1992-07-16) & JP 04 093296 A (NISSHA PRINTING CO LTD), 26. März 1992 (1992-03-26) * |
PATENT ABSTRACTS OF JAPAN vol. 017, no. 286 (M-1422), 2. Juni 1993 (1993-06-02) -& JP 05 016582 A (MITSUBISHI ELECTRIC CORP), 26. Januar 1993 (1993-01-26) * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107399363A (zh) * | 2016-04-27 | 2017-11-28 | 株式会社捷太格特 | 外壳结构体的制造方法以及外壳结构体 |
EP3238905A3 (de) * | 2016-04-27 | 2018-02-21 | Jtekt Corporation | Verfahren zur herstellung einer gehäusestruktur und gehäusestruktur |
US10166705B2 (en) | 2016-04-27 | 2019-01-01 | Jtekt Corporation | Method of manufacturing housing structure and housing structure |
CN107399363B (zh) * | 2016-04-27 | 2021-08-06 | 株式会社捷太格特 | 外壳结构体的制造方法以及外壳结构体 |
Also Published As
Publication number | Publication date |
---|---|
WO2003071475A3 (de) | 2004-04-01 |
DE10207000C2 (de) | 2003-12-11 |
DE10207000A1 (de) | 2003-09-04 |
AU2003215510A1 (en) | 2003-09-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0842491B1 (de) | Datenträger mit einem einen bauteil aufweisenden modul und mit einer spule und verfahren zum herstellen eines solchen datenträgers | |
DE3131216C2 (de) | ||
EP1271399B1 (de) | Datenträger mit integriertem Schaltkreis | |
DE10313005B4 (de) | Reservebatterie und Verfahren zu deren Herstellung | |
DE102015224569A1 (de) | Festelektrolyt und festkörper-(all-solid-state)-batterie, die diesen umfasst | |
DE102007017024B3 (de) | Batteriezelle und Verfahren zu ihrer Herstellung und Batterie | |
WO2007017506A1 (de) | Elektrochemischer energiespeicher | |
WO1997005570A1 (de) | Kartenförmiger datenträger für kontaktlose anwendungen mit einem bauteil und mit einer übertragungseinrichtung für die kontaktlosen anwendungen und verfahren zum herstellen eines solchen kartenförmigen datenträgers sowie modul hierfür | |
EP0842493A1 (de) | Datenträger mit einem einen bauteil aufweisenden modul und mit einer spule und verfahren zum herstellen eines solchen datenträgers sowie modul hierfür | |
DE19741984B4 (de) | Chipträger zur Herstellung einer Chipkarte sowie Verfahren zur Herstellung einer derartigen Chipkarte | |
WO2011012201A1 (de) | Batterie und verfahren zum herstellen einer batterie | |
EP2637129B1 (de) | Verfahren zum Freilegen einer Kontaktierungseinrichtung einer elektrischen Komponente in einem portablen Datenträger | |
EP2095944A1 (de) | Chipkarten und Verfahren zum Herstellen einer Chipkarte | |
EP2807613B1 (de) | Verfahren zum herstellen eines datenträgers unter vermeidung von mechanischen spannungen zwischen chip und datenträgerkörper | |
WO2003071475A2 (de) | Chipkarte | |
EP2729902A1 (de) | Tragbarer datenträger mit antenne | |
WO1997023843A1 (de) | Verfahren zur herstellung einer chipkarte für kontaktlosen betrieb | |
DE202005008982U1 (de) | Polschraube | |
EP1500159B1 (de) | Schmelzkarbonatbrennstoffzelle und verfahren zur herstellung einer solchen | |
DE102010020969A1 (de) | Inlay für ein Wert- und/oder Sicherheitsdokument sowie Verfahren zu dessen Herstellung | |
DE102016200516A1 (de) | Isolations- und/oder Dichtungsvorrichtung für eine Energiespeicherzelle, Energiespeicherzelle und Herstellungsverfahren | |
DE102009030402B4 (de) | Gehäuse für ein mobiles Kommunikationsendgerät sowie Verfahren zu dessen Herstellung | |
DE19609854A1 (de) | Akku-Pack für ein elektronisches Handgerät | |
DE19612718B4 (de) | Chipkarte mit Batterie sowie Verfahren zur Montage einer Chipmodul/Batterie-Einheit | |
DE212018000257U1 (de) | Flexible Batterie |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
122 | Ep: pct application non-entry in european phase | ||
NENP | Non-entry into the national phase |
Ref country code: JP |
|
WWW | Wipo information: withdrawn in national office |
Country of ref document: JP |