WO2003071475A3 - Chipkarte - Google Patents

Chipkarte Download PDF

Info

Publication number
WO2003071475A3
WO2003071475A3 PCT/DE2003/000514 DE0300514W WO03071475A3 WO 2003071475 A3 WO2003071475 A3 WO 2003071475A3 DE 0300514 W DE0300514 W DE 0300514W WO 03071475 A3 WO03071475 A3 WO 03071475A3
Authority
WO
WIPO (PCT)
Prior art keywords
chip card
card body
injection
battery
mould tool
Prior art date
Application number
PCT/DE2003/000514
Other languages
English (en)
French (fr)
Other versions
WO2003071475A2 (de
Inventor
Stefan Dohse
Original Assignee
Orga Kartensysteme Gmbh
Stefan Dohse
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orga Kartensysteme Gmbh, Stefan Dohse filed Critical Orga Kartensysteme Gmbh
Priority to AU2003215510A priority Critical patent/AU2003215510A1/en
Publication of WO2003071475A2 publication Critical patent/WO2003071475A2/de
Publication of WO2003071475A3 publication Critical patent/WO2003071475A3/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
    • G06K19/0702—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including a battery
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0046—Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/712—Containers; Packaging elements or accessories, Packages
    • B29L2031/7146—Battery-cases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Es wird eine Chipkarte mit einem durch Spritzgiessen erzeugten Chipkartenkörper (1) vorgestellt, zu dessen Herstellung verflüssigter Kunststoff in eine Spritzgusswerkzeugkavität (2) eingebracht wird, wobei nach Erstarrung des Kunststoffes eine Batterie (3) in den Chipkartenkörper (1) implementiert ist. Die Batterie (3) weist eine entgegen der Einspritzrichtung (4) des flüssigen Kunststoffes in die Spritzgusswerkzeugkavität (2) sich verjüngende Geometrie auf.
PCT/DE2003/000514 2002-02-19 2003-02-19 Chipkarte WO2003071475A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003215510A AU2003215510A1 (en) 2002-02-19 2003-02-19 Chip card

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2002107000 DE10207000C2 (de) 2002-02-19 2002-02-19 Chipkarte
DE10207000.8 2002-02-19

Publications (2)

Publication Number Publication Date
WO2003071475A2 WO2003071475A2 (de) 2003-08-28
WO2003071475A3 true WO2003071475A3 (de) 2004-04-01

Family

ID=27674762

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/000514 WO2003071475A2 (de) 2002-02-19 2003-02-19 Chipkarte

Country Status (3)

Country Link
AU (1) AU2003215510A1 (de)
DE (1) DE10207000C2 (de)
WO (1) WO2003071475A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10166705B2 (en) * 2016-04-27 2019-01-01 Jtekt Corporation Method of manufacturing housing structure and housing structure
JP6886612B2 (ja) * 2016-04-27 2021-06-16 株式会社ジェイテクト ハウジング構造体の製造方法およびハウジング構造体

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4037555A1 (de) * 1989-11-25 1991-05-29 Hitachi Maxell Halbleiterkarte und herstellungsverfahren dafuer
JPH0493296A (ja) * 1990-08-09 1992-03-26 Nissha Printing Co Ltd Ｉｃカードとその製造方法
JPH0516582A (ja) * 1991-07-15 1993-01-26 Mitsubishi Electric Corp Ｉｃカード
EP0646895A2 (de) * 1993-09-01 1995-04-05 Kabushiki Kaisha Toshiba Dünne Chipkarte und ihr Herstellungsverfahren
EP0923047A1 (de) * 1997-07-18 1999-06-16 Rohm Co., Ltd. Ic-modul, sein herstellungsverfahren und ic-karte damit versehen
WO2003034333A1 (de) * 2001-10-18 2003-04-24 Trüb AG Verfahren zur herstellung eines datenträgers sowie nach diesem verfahren hergestellter datenträger

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05169885A (ja) * 1991-12-26 1993-07-09 Mitsubishi Electric Corp 薄型ｉｃカード

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4037555A1 (de) * 1989-11-25 1991-05-29 Hitachi Maxell Halbleiterkarte und herstellungsverfahren dafuer
JPH0493296A (ja) * 1990-08-09 1992-03-26 Nissha Printing Co Ltd Ｉｃカードとその製造方法
JPH0516582A (ja) * 1991-07-15 1993-01-26 Mitsubishi Electric Corp Ｉｃカード
EP0646895A2 (de) * 1993-09-01 1995-04-05 Kabushiki Kaisha Toshiba Dünne Chipkarte und ihr Herstellungsverfahren
EP0923047A1 (de) * 1997-07-18 1999-06-16 Rohm Co., Ltd. Ic-modul, sein herstellungsverfahren und ic-karte damit versehen
WO2003034333A1 (de) * 2001-10-18 2003-04-24 Trüb AG Verfahren zur herstellung eines datenträgers sowie nach diesem verfahren hergestellter datenträger

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 016, no. 328 (M - 1281) 16 July 1992 (1992-07-16) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 286 (M - 1422) 2 June 1993 (1993-06-02) *

Also Published As

Publication number Publication date
DE10207000C2 (de) 2003-12-11
WO2003071475A2 (de) 2003-08-28
DE10207000A1 (de) 2003-09-04
AU2003215510A1 (en) 2003-09-09

Similar Documents

Publication Publication Date Title
CA2412003A1 (en) Fluid compression of injection molded plastic materials
EP1166991A3 (de) Verfahren, Vorrichtung und Zusammensetzung zum Spritzgiessen von Schaum
WO2005089189A3 (en) Active and reconfigurable tools
WO2005069797A3 (en) Microfluidic structures and methods for integrating a functional component into a microfluidic device
GB2427380A (en) Injection-molded product and its use
CA2494588A1 (en) Three-dimensional model
ATE473851T1 (de) Vorrichtung zur herstellung von spritzgussteilen
DE50103105D1 (de) Reinigungs- oder applikationsvorrichtung mit einem schwammkörper und verfahren zu dessen herstellung
WO2003008171A1 (fr) Methode de production d'une lentille de resine et lentille de resine
WO2002020236A3 (en) A mold
CA2448375A1 (en) Plastic overmolded bottle
EP1136222A4 (de) Verfahren und gerät zum herstellen von kontaktlinsenteilen und dafür benutzte spritzgussform
EP1787783A3 (de) Verfahren zur Herstellung eines spritzgegossenen Artikels und danach hergestellter Artikel
EP1391285A4 (de) Harzgliedformverfahren und spritzgiessvorrichtung
EP1225024A3 (de) Spritzprägeverfahren zum Formen eines Brillenglases
ATE224530T1 (de) Verfahren zur herstellung eines positionssensors
MY133794A (en) Die capable of being opened, manufacturing method thereof, and mold
WO2007100945A3 (en) Gaming chip and method of manufacture
WO2005058575A3 (en) Injection moulding of functional cavities
TW200700212A (en) Resin made cap of case for receiving solid state imaging device and method for producing the same
WO2003071475A3 (de) Chipkarte
MY134571A (en) Metal mold for forming, method for the preparation of the metal mold for forming and molded article obtained on forming by the metal mold for forming
CA2415534A1 (en) Injection molding alignment steering utilizing sequential throttles in a base-wall-section flow guides
GB0323659D0 (en) Detergent body
WO2005007381A3 (de) Vorrichtung zum spritzgiessen von kunststoff

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP