JPWO2025134288A5 - - Google Patents

Info

Publication number
JPWO2025134288A5
JPWO2025134288A5 JP2024531405A JP2024531405A JPWO2025134288A5 JP WO2025134288 A5 JPWO2025134288 A5 JP WO2025134288A5 JP 2024531405 A JP2024531405 A JP 2024531405A JP 2024531405 A JP2024531405 A JP 2024531405A JP WO2025134288 A5 JPWO2025134288 A5 JP WO2025134288A5
Authority
JP
Japan
Prior art keywords
plug
ceramic
circumferential surface
semiconductor manufacturing
manufacturing equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024531405A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025134288A1 (https=
JP7764607B1 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/045783 external-priority patent/WO2025134288A1/ja
Publication of JPWO2025134288A1 publication Critical patent/JPWO2025134288A1/ja
Priority to JP2025178752A priority Critical patent/JP2026012854A/ja
Application granted granted Critical
Publication of JP7764607B1 publication Critical patent/JP7764607B1/ja
Publication of JPWO2025134288A5 publication Critical patent/JPWO2025134288A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2024531405A 2023-12-20 2023-12-20 半導体製造装置用部材 Active JP7764607B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025178752A JP2026012854A (ja) 2023-12-20 2025-10-23 半導体製造装置用部材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/045783 WO2025134288A1 (ja) 2023-12-20 2023-12-20 半導体製造装置用部材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025178752A Division JP2026012854A (ja) 2023-12-20 2025-10-23 半導体製造装置用部材

Publications (3)

Publication Number Publication Date
JPWO2025134288A1 JPWO2025134288A1 (https=) 2025-06-26
JP7764607B1 JP7764607B1 (ja) 2025-11-05
JPWO2025134288A5 true JPWO2025134288A5 (https=) 2025-11-19

Family

ID=96096428

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024531405A Active JP7764607B1 (ja) 2023-12-20 2023-12-20 半導体製造装置用部材
JP2025178752A Pending JP2026012854A (ja) 2023-12-20 2025-10-23 半導体製造装置用部材

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025178752A Pending JP2026012854A (ja) 2023-12-20 2025-10-23 半導体製造装置用部材

Country Status (4)

Country Link
US (1) US20250210394A1 (https=)
JP (2) JP7764607B1 (https=)
TW (1) TW202527196A (https=)
WO (1) WO2025134288A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10770270B2 (en) * 2016-06-07 2020-09-08 Applied Materials, Inc. High power electrostatic chuck with aperture-reducing plug in a gas hole
JP7441404B2 (ja) * 2019-03-05 2024-03-01 Toto株式会社 静電チャック、および処理装置
JP2023035856A (ja) * 2021-08-31 2023-03-13 Toto株式会社 静電チャック、および処理装置
JP7620578B2 (ja) * 2022-01-07 2025-01-23 日本碍子株式会社 半導体製造装置用部材
JP7569343B2 (ja) * 2022-01-21 2024-10-17 日本碍子株式会社 半導体製造装置用部材
JP7483121B2 (ja) * 2022-02-09 2024-05-14 日本碍子株式会社 半導体製造装置用部材

Similar Documents

Publication Publication Date Title
CN110277341B (zh) 静电吸盘
JP5633766B2 (ja) 静電チャック
KR20250007482A (ko) 정전척
CN116313981A (zh) 静电吸盘
CN111128838B (zh) 静电吸盘
US7268423B2 (en) Flexible rewiring plate for semiconductor components, and process for producing it
EP1900680A3 (en) Cap wafer having electrodes
KR101590541B1 (ko) 릴리프된 활성 영역을 가지는 다이를 포함하는 집적 회로 패키지 시스템
JP4858319B2 (ja) ウェハ保持体の電極接続構造
TW201810513A (zh) 基板保持裝置
CN107534269A (zh) 具有基底和半导体激光器的装置
JP7802835B2 (ja) 試料保持具
JP7319153B2 (ja) 保持装置
KR20090030540A (ko) 반도체 패키지, 이를 제조하기 위한 반도체 패키지의제조장치와 반도체 패키지의 제조방법, 그리고 반도체패키지를 구비한 전자 기기
JPWO2025134288A5 (https=)
CN110277343B (zh) 静电吸盘
JP6680649B2 (ja) 真空吸着部材
TW201832341A (zh) 半導體裝置
JP7577524B2 (ja) 保持装置
KR102863907B1 (ko) 웨이퍼 배치대
WO2018190220A1 (ja) シャワーヘッド
JP2020004809A (ja) 保持装置
US7649672B2 (en) MEMS structure and method of fabricating the same
EP1796158B1 (en) Semiconductor manufacturing apparatus
US6698088B2 (en) Universal clamping mechanism