JPWO2025134288A1 - - Google Patents
Info
- Publication number
- JPWO2025134288A1 JPWO2025134288A1 JP2024531405A JP2024531405A JPWO2025134288A1 JP WO2025134288 A1 JPWO2025134288 A1 JP WO2025134288A1 JP 2024531405 A JP2024531405 A JP 2024531405A JP 2024531405 A JP2024531405 A JP 2024531405A JP WO2025134288 A1 JPWO2025134288 A1 JP WO2025134288A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025178752A JP2026012854A (ja) | 2023-12-20 | 2025-10-23 | 半導体製造装置用部材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/045783 WO2025134288A1 (ja) | 2023-12-20 | 2023-12-20 | 半導体製造装置用部材 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025178752A Division JP2026012854A (ja) | 2023-12-20 | 2025-10-23 | 半導体製造装置用部材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025134288A1 true JPWO2025134288A1 (https=) | 2025-06-26 |
| JP7764607B1 JP7764607B1 (ja) | 2025-11-05 |
| JPWO2025134288A5 JPWO2025134288A5 (https=) | 2025-11-19 |
Family
ID=96096428
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024531405A Active JP7764607B1 (ja) | 2023-12-20 | 2023-12-20 | 半導体製造装置用部材 |
| JP2025178752A Pending JP2026012854A (ja) | 2023-12-20 | 2025-10-23 | 半導体製造装置用部材 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025178752A Pending JP2026012854A (ja) | 2023-12-20 | 2025-10-23 | 半導体製造装置用部材 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250210394A1 (https=) |
| JP (2) | JP7764607B1 (https=) |
| TW (1) | TW202527196A (https=) |
| WO (1) | WO2025134288A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10770270B2 (en) * | 2016-06-07 | 2020-09-08 | Applied Materials, Inc. | High power electrostatic chuck with aperture-reducing plug in a gas hole |
| JP7441404B2 (ja) * | 2019-03-05 | 2024-03-01 | Toto株式会社 | 静電チャック、および処理装置 |
| JP2023035856A (ja) * | 2021-08-31 | 2023-03-13 | Toto株式会社 | 静電チャック、および処理装置 |
| JP7620578B2 (ja) * | 2022-01-07 | 2025-01-23 | 日本碍子株式会社 | 半導体製造装置用部材 |
| JP7569343B2 (ja) * | 2022-01-21 | 2024-10-17 | 日本碍子株式会社 | 半導体製造装置用部材 |
| JP7483121B2 (ja) * | 2022-02-09 | 2024-05-14 | 日本碍子株式会社 | 半導体製造装置用部材 |
-
2023
- 2023-12-20 WO PCT/JP2023/045783 patent/WO2025134288A1/ja active Pending
- 2023-12-20 JP JP2024531405A patent/JP7764607B1/ja active Active
-
2024
- 2024-08-12 US US18/800,232 patent/US20250210394A1/en active Pending
- 2024-09-23 TW TW113135976A patent/TW202527196A/zh unknown
-
2025
- 2025-10-23 JP JP2025178752A patent/JP2026012854A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025134288A1 (ja) | 2025-06-26 |
| US20250210394A1 (en) | 2025-06-26 |
| TW202527196A (zh) | 2025-07-01 |
| JP7764607B1 (ja) | 2025-11-05 |
| JP2026012854A (ja) | 2026-01-27 |
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