WO2025134288A1 - 半導体製造装置用部材 - Google Patents

半導体製造装置用部材 Download PDF

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Publication number
WO2025134288A1
WO2025134288A1 PCT/JP2023/045783 JP2023045783W WO2025134288A1 WO 2025134288 A1 WO2025134288 A1 WO 2025134288A1 JP 2023045783 W JP2023045783 W JP 2023045783W WO 2025134288 A1 WO2025134288 A1 WO 2025134288A1
Authority
WO
WIPO (PCT)
Prior art keywords
plug
ceramic
semiconductor manufacturing
hole
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2023/045783
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
征樹 石川
達也 久野
太朗 宇佐美
夏樹 平田
直輝 山本
裕佑 小木曽
誠士 中山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP2024531405A priority Critical patent/JP7764607B1/ja
Priority to PCT/JP2023/045783 priority patent/WO2025134288A1/ja
Priority to US18/800,232 priority patent/US20250210394A1/en
Priority to TW113135976A priority patent/TW202527196A/zh
Publication of WO2025134288A1 publication Critical patent/WO2025134288A1/ja
Priority to JP2025178752A priority patent/JP2026012854A/ja
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material

Definitions

  • the present invention relates to components for semiconductor manufacturing equipment.
  • semiconductor manufacturing equipment components used for holding, controlling temperature, transporting, etc., wafers.
  • These types of semiconductor manufacturing equipment components are also called wafer mounting tables, electrostatic chucks, susceptors, etc., and generally have the function of applying electrostatic adsorption power to a built-in electrode and adsorbing the wafer by electrostatic force, and some are also known to have the function of controlling the wafer temperature by flowing gas between the wafer mounting surface and the wafer to be adsorbed.
  • a known component for semiconductor manufacturing equipment is, for example, one that includes a ceramic substrate having an upper surface on which a wafer is placed, a gas passage that passes through the ceramic substrate in the vertical direction, and a conductive base plate bonded to the lower surface of the ceramic substrate.
  • Patent Document 1 proposes a plug having a gas flow path that bends and penetrates a dense body in the thickness direction. It also proposes making at least a portion of the total length of the gas flow path insulating and porous. Patent Document 1 describes fixing the plug to the plug insertion hole with an adhesive material of insulating resin such as silicone resin, epoxy resin, or acrylic resin.
  • Patent Document 2 discloses an electrostatic chuck comprising: a ceramic dielectric substrate having a first main surface on which an object to be attracted is placed and a second main surface opposite to the first main surface; a base plate supporting the ceramic dielectric substrate and having a gas introduction passage; and a first porous portion provided between the base plate and the first main surface of the ceramic dielectric substrate and at a position facing the gas introduction passage, the ceramic dielectric substrate having a first hole portion located between the first main surface and the first porous portion, the first porous portion having a porous portion having a plurality of holes and a first dense portion denser than the porous portion, and configured such that the first dense portion overlaps with the first hole portion and the porous portion does not overlap with the first hole portion when projected onto a plane perpendicular to a first direction from the base plate to the ceramic dielectric substrate.
  • an adhesive member is provided between the first porous portion and the ceramic dielectric substrate, and a silicone adhesive is described as the adhesive member.

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Drying Of Semiconductors (AREA)
PCT/JP2023/045783 2023-12-20 2023-12-20 半導体製造装置用部材 Pending WO2025134288A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2024531405A JP7764607B1 (ja) 2023-12-20 2023-12-20 半導体製造装置用部材
PCT/JP2023/045783 WO2025134288A1 (ja) 2023-12-20 2023-12-20 半導体製造装置用部材
US18/800,232 US20250210394A1 (en) 2023-12-20 2024-08-12 Member for semiconductor manufacturing equipment
TW113135976A TW202527196A (zh) 2023-12-20 2024-09-23 半導體製造裝置用部件
JP2025178752A JP2026012854A (ja) 2023-12-20 2025-10-23 半導体製造装置用部材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/045783 WO2025134288A1 (ja) 2023-12-20 2023-12-20 半導体製造装置用部材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/800,232 Continuation US20250210394A1 (en) 2023-12-20 2024-08-12 Member for semiconductor manufacturing equipment

Publications (1)

Publication Number Publication Date
WO2025134288A1 true WO2025134288A1 (ja) 2025-06-26

Family

ID=96096428

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/045783 Pending WO2025134288A1 (ja) 2023-12-20 2023-12-20 半導体製造装置用部材

Country Status (4)

Country Link
US (1) US20250210394A1 (https=)
JP (2) JP7764607B1 (https=)
TW (1) TW202527196A (https=)
WO (1) WO2025134288A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019519927A (ja) * 2016-06-07 2019-07-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ガス孔に開口縮小プラグを有する大電力静電チャック
JP2020150257A (ja) * 2019-03-05 2020-09-17 Toto株式会社 静電チャック、および処理装置
JP2023101194A (ja) * 2022-01-07 2023-07-20 日本碍子株式会社 半導体製造装置用部材
WO2023153021A1 (ja) * 2022-02-09 2023-08-17 日本碍子株式会社 半導体製造装置用部材

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023035856A (ja) * 2021-08-31 2023-03-13 Toto株式会社 静電チャック、および処理装置
JP7569343B2 (ja) * 2022-01-21 2024-10-17 日本碍子株式会社 半導体製造装置用部材

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019519927A (ja) * 2016-06-07 2019-07-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ガス孔に開口縮小プラグを有する大電力静電チャック
JP2020150257A (ja) * 2019-03-05 2020-09-17 Toto株式会社 静電チャック、および処理装置
JP2023101194A (ja) * 2022-01-07 2023-07-20 日本碍子株式会社 半導体製造装置用部材
WO2023153021A1 (ja) * 2022-02-09 2023-08-17 日本碍子株式会社 半導体製造装置用部材

Also Published As

Publication number Publication date
JPWO2025134288A1 (https=) 2025-06-26
US20250210394A1 (en) 2025-06-26
TW202527196A (zh) 2025-07-01
JP7764607B1 (ja) 2025-11-05
JP2026012854A (ja) 2026-01-27

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