JP7764607B1 - 半導体製造装置用部材 - Google Patents

半導体製造装置用部材

Info

Publication number
JP7764607B1
JP7764607B1 JP2024531405A JP2024531405A JP7764607B1 JP 7764607 B1 JP7764607 B1 JP 7764607B1 JP 2024531405 A JP2024531405 A JP 2024531405A JP 2024531405 A JP2024531405 A JP 2024531405A JP 7764607 B1 JP7764607 B1 JP 7764607B1
Authority
JP
Japan
Prior art keywords
plug
ceramic
semiconductor manufacturing
manufacturing equipment
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024531405A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025134288A1 (https=
JPWO2025134288A5 (https=
Inventor
征樹 石川
達也 久野
太朗 宇佐美
夏樹 平田
直輝 山本
裕佑 小木曽
誠士 中山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of JPWO2025134288A1 publication Critical patent/JPWO2025134288A1/ja
Priority to JP2025178752A priority Critical patent/JP2026012854A/ja
Application granted granted Critical
Publication of JP7764607B1 publication Critical patent/JP7764607B1/ja
Publication of JPWO2025134288A5 publication Critical patent/JPWO2025134288A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Drying Of Semiconductors (AREA)
JP2024531405A 2023-12-20 2023-12-20 半導体製造装置用部材 Active JP7764607B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025178752A JP2026012854A (ja) 2023-12-20 2025-10-23 半導体製造装置用部材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/045783 WO2025134288A1 (ja) 2023-12-20 2023-12-20 半導体製造装置用部材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025178752A Division JP2026012854A (ja) 2023-12-20 2025-10-23 半導体製造装置用部材

Publications (3)

Publication Number Publication Date
JPWO2025134288A1 JPWO2025134288A1 (https=) 2025-06-26
JP7764607B1 true JP7764607B1 (ja) 2025-11-05
JPWO2025134288A5 JPWO2025134288A5 (https=) 2025-11-19

Family

ID=96096428

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024531405A Active JP7764607B1 (ja) 2023-12-20 2023-12-20 半導体製造装置用部材
JP2025178752A Pending JP2026012854A (ja) 2023-12-20 2025-10-23 半導体製造装置用部材

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025178752A Pending JP2026012854A (ja) 2023-12-20 2025-10-23 半導体製造装置用部材

Country Status (4)

Country Link
US (1) US20250210394A1 (https=)
JP (2) JP7764607B1 (https=)
TW (1) TW202527196A (https=)
WO (1) WO2025134288A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019519927A (ja) * 2016-06-07 2019-07-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ガス孔に開口縮小プラグを有する大電力静電チャック
JP2020150257A (ja) * 2019-03-05 2020-09-17 Toto株式会社 静電チャック、および処理装置
JP2023035856A (ja) * 2021-08-31 2023-03-13 Toto株式会社 静電チャック、および処理装置
JP2023101194A (ja) * 2022-01-07 2023-07-20 日本碍子株式会社 半導体製造装置用部材
JP2023106929A (ja) * 2022-01-21 2023-08-02 日本碍子株式会社 半導体製造装置用部材
WO2023153021A1 (ja) * 2022-02-09 2023-08-17 日本碍子株式会社 半導体製造装置用部材

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019519927A (ja) * 2016-06-07 2019-07-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ガス孔に開口縮小プラグを有する大電力静電チャック
JP2020150257A (ja) * 2019-03-05 2020-09-17 Toto株式会社 静電チャック、および処理装置
JP2023035856A (ja) * 2021-08-31 2023-03-13 Toto株式会社 静電チャック、および処理装置
JP2023101194A (ja) * 2022-01-07 2023-07-20 日本碍子株式会社 半導体製造装置用部材
JP2023106929A (ja) * 2022-01-21 2023-08-02 日本碍子株式会社 半導体製造装置用部材
WO2023153021A1 (ja) * 2022-02-09 2023-08-17 日本碍子株式会社 半導体製造装置用部材

Also Published As

Publication number Publication date
JPWO2025134288A1 (https=) 2025-06-26
WO2025134288A1 (ja) 2025-06-26
US20250210394A1 (en) 2025-06-26
TW202527196A (zh) 2025-07-01
JP2026012854A (ja) 2026-01-27

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