JPWO2025069863A1 - - Google Patents
Info
- Publication number
- JPWO2025069863A1 JPWO2025069863A1 JP2025548628A JP2025548628A JPWO2025069863A1 JP WO2025069863 A1 JPWO2025069863 A1 JP WO2025069863A1 JP 2025548628 A JP2025548628 A JP 2025548628A JP 2025548628 A JP2025548628 A JP 2025548628A JP WO2025069863 A1 JPWO2025069863 A1 JP WO2025069863A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023167773 | 2023-09-28 | ||
| JP2023167773 | 2023-09-28 | ||
| PCT/JP2024/030506 WO2025069863A1 (ja) | 2023-09-28 | 2024-08-27 | エッチング方法及びプラズマ処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025069863A1 true JPWO2025069863A1 (https=) | 2025-04-03 |
| JPWO2025069863A5 JPWO2025069863A5 (https=) | 2026-03-10 |
| JP7836946B2 JP7836946B2 (ja) | 2026-03-27 |
Family
ID=95202499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025548628A Active JP7836946B2 (ja) | 2023-09-28 | 2024-08-27 | エッチング方法及びプラズマ処理装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7836946B2 (https=) |
| CN (1) | CN121890303A (https=) |
| TW (1) | TW202529200A (https=) |
| WO (1) | WO2025069863A1 (https=) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0677177A (ja) * | 1992-06-22 | 1994-03-18 | Matsushita Electric Ind Co Ltd | ドライエッチング法及びドライエッチング装置 |
| CN108321211A (zh) * | 2017-01-16 | 2018-07-24 | 中芯国际集成电路制造(上海)有限公司 | Tmbs半导体器件及其制作方法、电子装置 |
| JP2018529225A (ja) * | 2015-08-31 | 2018-10-04 | レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード | 半導体構造物をエッチングするための窒素含有化合物 |
| WO2021171764A1 (ja) * | 2020-02-27 | 2021-09-02 | 株式会社日立ハイテク | プラズマ処理方法 |
| WO2022234647A1 (ja) * | 2021-05-07 | 2022-11-10 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| JP2023063526A (ja) * | 2021-04-28 | 2023-05-09 | 東京エレクトロン株式会社 | エッチング方法及びプラズマ処理装置 |
| US20230230840A1 (en) * | 2022-01-18 | 2023-07-20 | Samsung Electronics Co., Ltd. | Process gas for cryogenic etching, plasma etching apparatus, and method of fabricating semiconductor device using the same |
-
2024
- 2024-08-27 JP JP2025548628A patent/JP7836946B2/ja active Active
- 2024-08-27 WO PCT/JP2024/030506 patent/WO2025069863A1/ja active Pending
- 2024-08-27 CN CN202480059445.9A patent/CN121890303A/zh active Pending
- 2024-08-29 TW TW113132533A patent/TW202529200A/zh unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0677177A (ja) * | 1992-06-22 | 1994-03-18 | Matsushita Electric Ind Co Ltd | ドライエッチング法及びドライエッチング装置 |
| JP2018529225A (ja) * | 2015-08-31 | 2018-10-04 | レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード | 半導体構造物をエッチングするための窒素含有化合物 |
| CN108321211A (zh) * | 2017-01-16 | 2018-07-24 | 中芯国际集成电路制造(上海)有限公司 | Tmbs半导体器件及其制作方法、电子装置 |
| WO2021171764A1 (ja) * | 2020-02-27 | 2021-09-02 | 株式会社日立ハイテク | プラズマ処理方法 |
| JP2023063526A (ja) * | 2021-04-28 | 2023-05-09 | 東京エレクトロン株式会社 | エッチング方法及びプラズマ処理装置 |
| WO2022234647A1 (ja) * | 2021-05-07 | 2022-11-10 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| US20230230840A1 (en) * | 2022-01-18 | 2023-07-20 | Samsung Electronics Co., Ltd. | Process gas for cryogenic etching, plasma etching apparatus, and method of fabricating semiconductor device using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN121890303A (zh) | 2026-04-17 |
| TW202529200A (zh) | 2025-07-16 |
| WO2025069863A1 (ja) | 2025-04-03 |
| JP7836946B2 (ja) | 2026-03-27 |
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