JPWO2025009349A5 - - Google Patents

Info

Publication number
JPWO2025009349A5
JPWO2025009349A5 JP2025531457A JP2025531457A JPWO2025009349A5 JP WO2025009349 A5 JPWO2025009349 A5 JP WO2025009349A5 JP 2025531457 A JP2025531457 A JP 2025531457A JP 2025531457 A JP2025531457 A JP 2025531457A JP WO2025009349 A5 JPWO2025009349 A5 JP WO2025009349A5
Authority
JP
Japan
Prior art keywords
leads
electronic device
die pad
sealing resin
outer portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025531457A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025009349A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/021456 external-priority patent/WO2025009349A1/ja
Publication of JPWO2025009349A1 publication Critical patent/JPWO2025009349A1/ja
Publication of JPWO2025009349A5 publication Critical patent/JPWO2025009349A5/ja
Pending legal-status Critical Current

Links

JP2025531457A 2023-07-04 2024-06-13 Pending JPWO2025009349A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023110016 2023-07-04
PCT/JP2024/021456 WO2025009349A1 (ja) 2023-07-04 2024-06-13 電子装置

Publications (2)

Publication Number Publication Date
JPWO2025009349A1 JPWO2025009349A1 (cg-RX-API-DMAC7.html) 2025-01-09
JPWO2025009349A5 true JPWO2025009349A5 (cg-RX-API-DMAC7.html) 2026-04-03

Family

ID=94171689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025531457A Pending JPWO2025009349A1 (cg-RX-API-DMAC7.html) 2023-07-04 2024-06-13

Country Status (2)

Country Link
JP (1) JPWO2025009349A1 (cg-RX-API-DMAC7.html)
WO (1) WO2025009349A1 (cg-RX-API-DMAC7.html)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS558923Y2 (cg-RX-API-DMAC7.html) * 1973-09-17 1980-02-27
JP2924858B2 (ja) * 1997-06-09 1999-07-26 日本電気株式会社 リードフレームとその製造方法
JP3566109B2 (ja) * 1998-11-04 2004-09-15 株式会社デンソー 樹脂封止型半導体装置
JP6591302B2 (ja) * 2016-01-29 2019-10-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2017174885A (ja) * 2016-03-22 2017-09-28 ルネサスエレクトロニクス株式会社 半導体装置
DE112022005516T5 (de) * 2021-12-17 2024-08-29 Rohm Co., Ltd. Elektronische Vorrichtung

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